Type Marking Pin Configuration Package BCX41 EKs 1 = B 2 = E 3 = C SOT23. Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage V CEO



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BX4 NPN Silicon AF and Switching Transistor For general AF applications High breakdown voltage Low collectoremitter saturation voltage omplementary type: BX4 (PNP) Pbfree (RoHS compliant) package Qualified according AE Q Type Marking Pin onfiguration Package BX4 EKs = B = E = SOT Maximum Ratings Parameter Symbol Value Unit ollectoremitter voltage V EO V ollectorbase voltage V BO Emitterbase voltage V EBO ollector current I 8 ma Peak collector current, t p ms I M A Base current I B ma Peak base current I BM Total power dissipation T S 79 P tot mw Junction temperature T j Storage temperature T stg 6... Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs K/W For calculation of R thja please refer to Application Note AN77 (Thermal Resistance alculation) 4

BX4 Electrical haracteristics at T A =, unless otherwise specified Parameter Symbol Values Unit min. typ. max. D haracteristics ollectoremitter breakdown voltage I = ma, I B = ollectorbase breakdown voltage I = µa, I E = Emitterbase breakdown voltage I E = µa, I = ollectorbase cutoff current V B = V, I E = V B = V, I E =, T A = V (BR)EO V V (BR)BO V (BR)EBO I BO. µa ollectoremitter cutoff current V E = V, T A = 8 V E = V, T A = Emitterbase cutoff current V EB = 4 V, I = D current gain ) I = µa, V E = V I = ma, V E = V I = ma, V E = V ollectoremitter saturation voltage ) I = ma, I B = ma Base emitter saturation voltage ) I = ma, I B = ma A haracteristics Transition frequency I = ma, V E = V, f = MHz ollectorbase capacitance V B = V, f = MHz I EO 7 I EBO na h FE 6 4 V Esat.9 V V BEsat.4 f T MHz cb pf Pulse test: t < µs; D < % 4

BX4 D current gain h FE = ƒ(i ) V E = V ollectoremitter saturation voltage I = ƒ(v Esat ), h FE = BX 4/BSS 64 EHP47 BX 4/BSS 64 EHP4 ma h FE ma Baseemitter saturation voltage I = ƒ(v BEsat ), h FE = 4 6 mv 8 ollector current I = ƒ(v BE ) V E = V V E sat ma BX 4/BSS 64 EHP44 ma BX 4/BSS 64 T A = EHP4 V V V BE sat V BE 4

BX4 ollector cutoff current I BO = ƒ(t A ) V BO = 8 V Transition frequency f T = ƒ(i ) V E = V na 4 BX 4/BSS 64 EHP46 MHz BX 4/BSS 64 EHP4 B max f T typ ollectorbase capacitance cb = ƒ(v B ) Emitterbase capacitance eb = ƒ(v EB ) T A ma Total power dissipation P tot = ƒ(t S ) pf 4 mw 8 B(EB) 7 6 Ptot 4 EB B V V B (V EB 4 6 7 9 T S 4 4

BX4 Permissible Pulse Load P totmax /P totd = ƒ(t p ) P P tot max tot D BX 4/BSS 64 t p = D T t p T EHP4 D =....... 6 4 s t p 4

Package SOT BX4 Package Outline +. ).4..9 ±..9 B.9.4 ±.. MIN. MAX. ±.. MAX....8 MAX..8.... ±. A. M B. M A Foot Print ) Lead width can be.6 max. in dambar area.8.8..9..9 Marking Layout (Example) EH s Manufacturer, June Date code (YM) Pin BW66 Type code Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel 4.9. 8..6 Pin.. 6 4

BX4 Edition 96 Published by Infineon Technologies AG 876 Munich, Germany 9 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 4