Digital Integrated Circuit (IC) Layout and Design



Similar documents
What is this course is about? Design of Digital Circuitsit. Digital Integrated Circuits. What is this course is about?

ECE 410: VLSI Design Course Introduction

DESIGN CHALLENGES OF TECHNOLOGY SCALING

Introduction to Digital System Design

數 位 積 體 電 路 Digital Integrated Circuits

Computer System: User s View. Computer System Components: High Level View. Input. Output. Computer. Computer System: Motherboard Level

Chapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1

ANALOG & DIGITAL ELECTRONICS

FPGA Design From Scratch It all started more than 40 years ago

EE-612: Nanoscale Transistors (Advanced VLSI Devices) Spring 2005

Area 3: Analog and Digital Electronics. D.A. Johns

Introduction to VLSI Programming. TU/e course 2IN30. Prof.dr.ir. Kees van Berkel Dr. Johan Lukkien [Dr.ir. Ad Peeters, Philips Nat.

CS 159 Two Lecture Introduction. Parallel Processing: A Hardware Solution & A Software Challenge

EE 459/500 HDL Based Digital Design with Programmable Logic. Lecture 16 Timing and Clock Issues

Sequential 4-bit Adder Design Report

Digital Systems Design! Lecture 1 - Introduction!!

What is a System on a Chip?

EEM870 Embedded System and Experiment Lecture 1: SoC Design Overview

Agenda. Michele Taliercio, Il circuito Integrato, Novembre 2001

Design of VLSI Circuits and Systems

EE411: Introduction to VLSI Design Course Syllabus

Curriculum for a Master s Degree in ECE with focus on Mixed Signal SOC Design

Introduction to Microprocessors

Introduction to Semiconductor Manufacturing Technology. Chapter 1, Introduction. Hong Xiao, Ph. D.

9/14/ :38

CISC, RISC, and DSP Microprocessors

EEC 119B Spring 2014 Final Project: System-On-Chip Module

Ingar Fredriksen AVR Applications Manager. Tromsø August 12, 2005

Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications

International Journal of Electronics and Computer Science Engineering 1482

L4: Sequential Building Blocks (Flip-flops, Latches and Registers)

High-Frequency Integrated Circuits

Digital Design for Low Power Systems

IC-EMC Simulation of Electromagnetic Compatibility of Integrated Circuits

Riding silicon trends into our future

Introducción. Diseño de sistemas digitales.1

An Introduction to High-Frequency Circuits and Signal Integrity

Design and analysis of flip flops for low power clocking system

A Point of View on the Future of IC Design, Testing and Manufacturing

Introduction to System-on-Chip

HIGH SPEED AREA EFFICIENT 1-BIT HYBRID FULL ADDER

CS 61C: Great Ideas in Computer Architecture Finite State Machines. Machine Interpreta4on

CSCI 4717 Computer Architecture. Function. Data Storage. Data Processing. Data movement to a peripheral. Data Movement

These help quantify the quality of a design from different perspectives: Cost Functionality Robustness Performance Energy consumption

Unternehmerseminar WS 2009 / 2010

Intel Labs at ISSCC Copyright Intel Corporation 2012

A Novel Low Power, High Speed 14 Transistor CMOS Full Adder Cell with 50% Improvement in Threshold Loss Problem

Advanced Computer Architecture

The Incredible Methamorphosis of The computer in Smartphone. L incroyable métamorphose de l ordinateur en smartphone

Design Cycle for Microprocessors

7a. System-on-chip design and prototyping platforms

e.g. τ = 12 ps in 180nm, 40 ps in 0.6 µm Delay has two components where, f = Effort Delay (stage effort)= gh p =Parasitic Delay

Programmable Single-/Dual-/Triple- Tone Gong SAE 800

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences

Introduction to CMOS VLSI Design

A Novel Low Power Fault Tolerant Full Adder for Deep Submicron Technology

Analog & Digital Electronics Course No: PH-218

Read-only memory Implementing logic with ROM Programmable logic devices Implementing logic with PLDs Static hazards

ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path

Digital Circuit Design

Advanced VLSI Design CMOS Processing Technology

Course PM MCC091 Introduction to Integrated Circuit Design

EMC Expert System for Architecture Design

NTE2053 Integrated Circuit 8 Bit MPU Compatible A/D Converter

Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology

CSE140 Homework #7 - Solution

Alpha CPU and Clock Design Evolution

NEW adder cells are useful for designing larger circuits despite increase in transistor count by four per cell.

Serial port interface for microcontroller embedded into integrated power meter

True Single Phase Clocking Flip-Flop Design using Multi Threshold CMOS Technique

VLSI Design Verification and Testing

BSEE Degree Plan Bachelor of Science in Electrical Engineering:

Automated Switching Mechanism for Multi-Standard RFID Transponder

EE 42/100 Lecture 24: Latches and Flip Flops. Rev B 4/21/2010 (2:04 PM) Prof. Ali M. Niknejad

State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop

INSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad

Lecture 5: Cost, Price, and Price for Performance Professor Randy H. Katz Computer Science 252 Spring 1996

CSEN301 Embedded Systems Trimester 1

«A 32-bit DSP Ultra Low Power accelerator»

Efficient Big Data Analytics Computing: A Research Challenge

Chapter 2 Logic Gates and Introduction to Computer Architecture

University of St. Thomas ENGR Digital Design 4 Credit Course Monday, Wednesday, Friday from 1:35 p.m. to 2:40 p.m. Lecture: Room OWS LL54

DESIGN OF MIXED SIGNAL CIRCUITS AND SYSTEMS FOR WIRELESS APPLICATIONS

How To Increase Areal Density For A Year

FPGAs in Next Generation Wireless Networks

FLASH TECHNOLOGY DRAM/EPROM. Flash Year Source: Intel/ICE, "Memory 1996"

8 Gbps CMOS interface for parallel fiber-optic interconnects

TRUE SINGLE PHASE CLOCKING BASED FLIP-FLOP DESIGN

Module 7 : I/O PADs Lecture 33 : I/O PADs

GETTING STARTED WITH PROGRAMMABLE LOGIC DEVICES, THE 16V8 AND 20V8

Low Power AMD Athlon 64 and AMD Opteron Processors

Power Reduction Techniques in the SoC Clock Network. Clock Power

ES 154 Electronic Devices and Circuits

A 2-Slot Time-Division Multiplexing (TDM) Interconnect Network for Gigascale Integration (GSI)

Microprocessor or Microcontroller?

TowerJazz High Performance SiGe BiCMOS processes

10 BIT s Current Mode Pipelined ADC

Lecture 5: Logical Effort

DEGREE: Bachelor in Biomedical Engineering YEAR: 2 TERM: 2 WEEKLY PLANNING

Gates & Boolean Algebra. Boolean Operators. Combinational Logic. Introduction

Transcription:

Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST LAB Friday Jan. 20 EE134 1 People! Lecturer - Roger Lake " Office ENGR2 Rm. 437 " Office hours - MW 4-5pm " rlake@ee.ucr.edu! TA FarukYilmaz " Office ENGR2 Rm. 222 " Office Hours TBD " faruk@ee.ucr.edu EE134 2

EE134 Web-site! http://www.ee.ucr.edu/~rlake/ee134.html " Class lecture notes " Assignments and solutions " Lab and project information " Exams and solutions " Other useful links EE134 3 Class Organization! Homework assignments (10%)! Labs (20%) " Tutorials to learn the Cadence design software! Final Project (50%) " Design a digital circuit (eg. 4 bit adder) " Work in teams of 3! Midterm (20%) EE134 4

Text Book Digital Integrated Circuits: A Design Perspective, 2 nd Ed. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic EE134 Software! Cadence software " Online documentation and tutorials " Sun4 UNIX Workstations EE134 6

What is this book all about?! Introduction to digital integrated circuits. " CMOS devices and manufacturing technology. " CMOS inverters and gates. " Propagation delay, " noise margins, and " power dissipation. " Sequential circuits. Arithmetic, interconnect, and memories.! What will you learn? " Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, and reliability EE134 7 Digital Integrated Circuits! Introduction: Issues in digital design! CMOS devices and manufacturing! The CMOS inverter! Combinational logic structures! Propagation delay, noise margins, power! Sequential logic gates; timing! Interconnect: R, L and C! Arithmetic building blocks! Memories and array structures! Design methods EE134 8

EE134 Winter 2006 - Lecture 1! Introduction EE134 9 Introduction! Why is designing digital ICs different today than it was before?! Will it change in future? EE134 10

The First Computer (1832) The Babbage Difference Engine (1832) 25,000 parts cost: 17,470 EE134 11 ENIAC - The first electronic computer (1946) EE134 12

The Transistor Revolution First transistor Bell Labs, 1948 EE134 13 The First Integrated Circuits Bipolar logic 1960 s ECL 3-input Gate Motorola 1966 EE134 14

Intel 4004 Micro-Processor (1971) 1971 2,300 transistors 108 KHz operation EE134 15 Intel Pentium 4 microprocessor (2000) 42 M transistors (217 mm 2 ) 1.5 GHz 0.18 µm 180 nm technology node EE134 16

What Happened over 30 Years? 1971 2000 2,300 transistors 108 KHz operation ~ 15,000 x 42 M transistors 1.5 GHz operation Automotive comparison: SF to NY in 13 seconds. EE134 17 Moore s s Law # In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months. # He made a prediction that semiconductor technology will double its effectiveness every 18 months EE134 18

Moore s s Law LOG 2 OF THE NUMBER OF COMPONENTS PER INTEGRATED FUNCTION 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975 Electronics, April 19, 1965. EE134 19 Evolution in Complexity EE134 20

Transistor Counts 1,000,000 K 1 Billion Transistors 100,000 10,000 1,000 100 10 Pentium III Pentium II Pentium Pro i486 Pentium i386 80286 8086 Source: Intel 1 1975 1980 1985 1990 1995 2000 2005 2010 Courtesy, Intel Projected EE134 21 Moore s s law in Microprocessors Transistors (MT) 1000 100 10 1 0.1 0.01 0.001 2X growth in 1.96 years! 386 286 8085 8086 4004 8008 8080 P6 Pentium proc 486 1970 1980 1990 2000 2010 Year Transistors on Lead Microprocessors double every 2 years Courtesy, Intel EE134 22

Die Size Growth 100 Die size (mm) 10 8080 8085 8008 4004 8086 286386 P6 486 Pentium proc ~7% growth per year ~2X growth in 10 years 1 1970 1980 1990 2000 2010 Year Die size grows by 14% to satisfy Moore s Law Courtesy, Intel EE134 23 Frequency Frequency (Mhz) 10000 1000 100 10 1 0.1 8085 8086 8080 8008 4004 Doubles every 2 years P6 Pentium proc 486 386 286 1970 1980 1990 2000 2010 Year Lead Microprocessors frequency doubles every 2 years Courtesy, Intel EE134 24

Power Dissipation 100 Power (Watts) 10 1 8085 8080 8008 4004 8086 286 386 486 P6 Pentium proc 0.1 1971 1974 1978 1985 1992 2000 Year Lead Microprocessors power continues to increase Courtesy, Intel EE134 25 Power will be a major problem Power (Watts) 100000 10000 1000 100 10 1 0.1 8085 8086286 386 486 4004 80088080 Pentium proc 18KW 5KW 1.5KW 500W 1971 1974 1978 1985 1992 2000 2004 2008 Year Power delivery and dissipation will be prohibitive Courtesy, Intel EE134 26

Power density Power Density (W/cm2) 10000 1000 100 10 1 4004 8008 8080 Rocket Nozzle Nuclear Reactor 8086 Hot Plate 8085 286 386 486 P6 Pentium proc 1970 1980 1990 2000 2010 Year Power density too high to keep junctions at low temp Courtesy, Intel EE134 27 Not Only Microprocessors Cell Phone Small Signal RF Power RF Power Management Digital Cellular Market (Phones Shipped) Analog Baseband Digital Baseband (DSP + MCU) Year 1996 1998 2000 2003 2004 2005 2006 2007 2008 Units (M) 48 162 435 513 648 (703) (776) (836) (889) EE134 28

Challenges in Digital Design (# Transistors) 1/(Transistor size) Microscopic Problems Ultra-high speed design Interconnect Noise, Crosstalk Reliability, Manufacturability Power Dissipation Clock distribution. Everything Looks a Little Different? Macroscopic Issues Time-to-Market Millions of Gates High-Level Abstractions Reuse & IP: Portability Predictability etc. and There s a Lot of Them! EE134 29 Productivity Trends 10,000,000 10,000 1,000,000 1,000 100,000 100 10,000 10 1,0001 100 0.1 0.01 10 Logic Tr./Chip Tr./Staff Month. x x x x x x x x 58%/Yr. compounded Complexity growth rate 21%/Yr. compound Productivity growth rate 100,000,000 10,000,000 1,000,000 100,000 10,000 1,0001 100 0.1 0.001 1 10 0.01 1981 1983 1985 1987 1989 1991 1993 1995 Complexity Logic Transistor per Chip (M) Productivity (K) Trans./Staff - Mo. 1997 1999 2001 2003 2005 2007 2009 Source: Sematech Complexity outpaces design productivity Courtesy, ITRS Roadmap EE134 30

Why Scaling?! Technology shrinks by 0.7/generation! With every generation can integrate 2x more functions per chip; chip cost does not increase significantly! Cost of a function decreases by 2x! But " How to design chips with more and more functions? " Design engineering population does not double every two years! Hence, a need for more efficient design methods " Exploit different levels of abstraction EE134 31 Design Abstraction Levels SYSTEM + MODULE GATE CIRCUIT S n+ G DEVICE n+ D EE134 32

Next Class! Introduce basic metrics for design of integrated circuits how to measure delay, power, etc.! Introduction to IC manufacturing and design. EE134 33 EE134 34