Fairchild Smart Power Modules Motion-SPM

Transcription

1 Fairchild Smart Power Modules Motion-SPM Marco Farneti Field Application Engineer September 2007 Think Future First Fondata nel 1968, azienda privata Terzo distributore a livello mondiale con un faturatto globale di 3B$. Opera in 167 regioni in 41 paesi con più di 5,000 impiegati a livello mondiale Il più alto livello di stock disponibile nel mercato. Servizi Logistici customizzati Presente in Italia da 11 anni con una strutura che conta 65 persone distribuite nelle zone più strategiche. Forti investimenti sulla nostra struttura di Demand Creation che oggi conta 15 persone, di cui 11 sono ingegneri, per un completo supporto tecnico al cliente. 2 1

2 Outline Introduction of Motion-SPM Application Examples Typical Application Circuit Input Stage of Gate Driver Short-circuit Endurance How to find an adequate SPM? Loss Calculation, Thermal Calculation, System Reliability ( Power Cycling) Design Tool SPM Motion Control Lab FFB 3 Introduction of Motion-SPM 4 2

3 [$M] Smart Power Modules SPM SPM Family (Motion SPM) Inverter-controlled variable speed drive for 3 phase induction motor used for inverter type home appliances and industrial inverter 1,200 1, WW SAM $842M in CY 07 Inverter and Servo < 10kW Industrial market Applications: Appliances Washing Machine Air Conditioner Dishwasher Vacuum-cleaner Heat-pumps Fans Industrial AC-Drives Servo-Drives Welding UPS Photovoltaic 5 Smart Power Modules SPM SPM, which integrates all diverse components, enhances productivity while simplifying manufacturing SPM s built-in HVIC and LVIC with protection circuit - reduced total system cost - reduced development time - easy management - optimized control flexibility - higher reliability - higher efficiency - improved time to market SPM optimizes driving characteristics for builtin power devices Impact of using SPM on BOM cost System cost Time to market 0h failures Failures in time Reduced number of components High performance Increased reliability Less board space or application volume Easier and faster design Reproducible performance

4 Fairchild Smart Power Modules SPM -Available Packages- DIP Package ceramic based DIP Package DBC based New Type MiniDIP Package fully molded MiniDIP Package ceramic based Mini DIP Package DBC based TinyDIP Package transfer molded TinyDIP with larger creepage distances SMD version 7 Fairchild Smart Power Modules SPM -DIP Line Up- Inverter Application Types: FSAM10SM60A FSAM15SM60A FSAM20SM60A FSAM30SM60A (22) V B(W) (21) V CC(WH) (20) IN (WH) (23) V S(W) (18) V B(V) (17) V CC(VH) (16) COM (H) (15) IN (VH) (19) V S(V) VB VCC COM IN VB VCC COM IN OUT VS OUT VS P (32) W (31) V (30) FSAM10SH60A FSAM15SH60A FSAM20SH60A FSAM30SH60A Current T c = 25 C SH => switching frequency 15 khz SM => switching frequency 5 khz Voltage rating (13) V B(U) (12) V CC(UH) (11) IN (UH) (14) V S(U) (10) R SC (9) C SC (8) C FOD (7) V FO (6) COM (L) (5) IN (WL) (4) IN (VL) (3) IN (UL) (2) COM (L) (1) V CC(L) VB VCC OUT COM IN VS C(SC) OUT(WL) C(FOD) VFO IN(WL) OUT(VL) IN(VL) IN(UL) COM(L) OUT(UL) VCC THERMISTOR U (29) N W (28) N V (27) N U (26) V TH (24) R TH (25) Ceramic substrate 2500 V Isolation Voltage Divided dc-link terminals Built in thermistor Adjustable current protection 60 mm x 31 mm 8 4

5 Fairchild Smart Power Modules SPM -TinyDIP Line Up- Inverter Application Types: FSB50250 FSB50450 FSB50325 Types: FSB50250S FSB50450S FSB50325S Voltage rating Transfer Molded Small size 1500 V Isolation Voltage Optimized EMI 29 mm x 12 mm 9 Application Examples 10 5

6 Application Example - Washing Machines SPM5 Drying Fan SPM3 Motor 11 Application Example - Air Conditioners SPM5 PFC-SPM FAN Motor SPM3 Compressor 12 6

7 Application Example - Refrigerators AC Input SPM3 or SPM4 Evaporator Fan Motor CONTROL BOARD Compressor Motor 13 Typical Application Circuit 15 7

8 Typical Application Circuit Bias Voltage SPM Microcontroller High Side Load DC link Voltage Low Side 16 Typical Application Circuit Microcontroller SPM Active High Interface Direct connection with controller 17 8

9 Input Stage of Gate Driver DIP FSAMxx Mini-DIP FSBSxx FSBBxx FCBSxx Active Low Active High HS: R pull-up =1.0MOhm LS: R pull-up =0.1MOhm R pull-down =3.3kOhm R pull-down =3.3kOhm R pull-down =3.3kOhm Tiny-DIP/SMD FSB50450 Active High R pull-down =500kOhm 18 Bootstrap Circuit Bootstrap Circuit Adjustable high-side switching speed Reduce noise / EMI Provides supply ( V) to HVICs Single-grounded power supply Optocoupler-less interface 19 9

10 SPM Protection Controlling of V cc (UVLO) to drive the gates correctly to reduce P loss SPM Further protection: OTP by thermistor e.g. SPM DIP Fault Signal Output only LVIC Over Current Protection Under Voltage Lock Out Protection 20 Short-circuit Endurance Start condition: Transistor is turned on to an existing load short circuit. Vin [5V/div.] Max. current 8~10 x rated current Ic Min. current due to temperature up Withstanding time IGBT: 4us MOSFET: 20us All SPM modules contain Short Circuit Protection with exception of FSB5xx

11 How to find an adequate SPM? 22 Hints for the Power Stage The following slides will focus on three-phase Drive applications: Block diagram of an AC-Drive Calculations for a proper module selection: Loss calculation Thermal calculation Lifetime calculation Three phase basic Inverter topology 23 11

12 3phase Inverter Topologic Currents and voltages of a standard Inverter topology based on a PWM modulation Motor phase current Motor phase to phase voltage IGBT current 24 How to find an adequate SPM? Loss Calculation 25 12

13 Loss calculation basics Ploss 6 Ploss 6 Inverter IGBT Ploss Diode IGBTs as well as Diodes have non linear characteristics Exact calculation can be done by a numeric calculation using Simulation programs Good approximation can be done by linearization of the device characteristics. Important definitions: Linearization Modulation index Cos (Phi) 26 How to find an adequate SPM? Thermal Calculation 35 13

14 Definitions: Zth T ( t) ; Rth P Thermal limits Rth: Thermal resistance [K/W] or [ C/W] Rthjc: Thermal resistance junction to case [K/W] or [ C/W] Zth: Transient thermal impedance [K/W] or [ C/W] Zthjc: Transient thermal impedance junction to case [K/W] or [ C/W] Tj: Junction temperature [ C] Tc: Case temperature [ C] Ptot: maximum Power losses [W] T ( t, d P 1) Zthjc Rthjc Tjc( t) Ptot Tjc Ptot Tj( t) Tc( t) Ptot Tj Tc Ptot 36 Thermal limits Zth T ( t) ; Rth P T ( t, d P 1) 37 14

15 Zthjc@50Hz 0. 8 Thermal limits C W C W Example: Tj 150 C; Tc 100 C P max Tjc Zthjc 50 C P max@( f 0 50Hz) 62. 5W C 0.8 W 1 1 f0 50Hz 20ms f0 5Hz 200ms f f 0 50 C P max@( f 0 5Hz) 50W C 1.0 W 0 38 Thermal limits Average Junction temperature (Tj avg) Tj = 5Hz output frequency Tj = 50 Hz output frequency This behavior is important for the Power Device selection The startup procedure of a drive begins at low output frequencies Irms max for AC-Drives are typically 1.5 to 2 times of the nominal current. Irms max for Servo Drives are often rated up to 3 times of the nominal current

16 How to find an adequate SPM? System Reliability 40 Power Cycling Capability What is Power Cycling? A well known method to estimate the lifetime of an electronic device. The measurement and calculation of Power Cycling curves is very complex. Failure criteria is a electrical value (e.g. V ce sat) which can increase due to internal mechanical changes based on different thermal expansion coefficients

17 Power Cycling Capability Typical Power-Cycling Curve A ΔT j lower than 30 C is negligible. for AC-Drives with a fixed output frequency the numbers of switch on and switch off cycles are important. Example: T c =75 C T j full load = 150 C Δ T j for an on/off cycle is 75 C. For Δ T j =75 C it s possible to drive 10 5 cycles. Assumed this Drive will be switched on and off 5 times a day the lifetime can be calculated as follows: 5 10 Lifetime[ years ] years Power Cycling Curves SPM-Modules Confidential Initial T j is 25 C. Measured points: T j = 50 C, 90 C and 120 C 25 C is initial and 75 C after power cycling (On time) 25 C is initial and 115 C after power cycling (On time) 25 C is initial and 145 C after power cycling (On time) 0.1 % of tested modules failed (V cesat out of spec.) 1 % of tested modules failed (V cesat out of spec.) 10 % of tested modules failed (V cesat out of spec.) 43 17

18 Power Cycling FSBB20CH60 FSBB30CH60 44 Design Tool Smart Power Module 45 18

19 Design Tool SPM 46 Design Tool SPM Fast and rough approximation of power dissipation 47 19

20 Design Tool SPM 48 Motion Control Lab Fuerstenfeldbruck 49 20

21 Motion Control Lab FFB Why: - To strengthen the support for our costumer - To find solution together with our costumer Current Activities: - Build-up test equipment to measure T J - Thermal management (SPM5) - Test of module behavior 50 REMEMBER TO ALWAYS 51 21