SMDA05C-7 THRU SMDA24C-7

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1 Description The SMDxxC7 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDxxC7 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO8 design allows the user to protect up to seven data and I/O lines with one package. The SMDxxC7 TS diode array will meet the surge requirements of IEC (Formerly IEC 8012), Level 4, Human ody Model for air and contact discharge. SMD05C7 THRU SMD24C7 idirectional TS rray for Protection of Seven Lines Features Transient protection for data lines to IEC (ESD) ±15k (air), ±8k (contact) IEC (EFT) 40 (5/50ns) IEC (Lightning) 12 (8/20µs) Small SO8 surface mount package Protects seven I/O lines Working voltages: 5, 12, 15 and 24 Low leakage current Low operating and clamping voltages Solidstate silicon avalanche technology Mechanical Characteristics JEDEC SO8 package Molding compound flammability rating: UL 940 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EI 481 pplications RS232 and RS422 Data Lines Microprocessor ased Equipment LN/WN Equipment Notebooks, Desktops, and Servers Instrumentation Peripherals Set Top ox Serial and Parallel Ports Schematic and PIN Configuration SO8 (Top iew) Revision 8/15/06 1

2 bsolute Rating Rating alue Pulse Power ( = 8/20µs) P pk 00 3 Watts Lead Soldering Temperature T L 260 ( sec. ) C Operating Temperature T J 55 to +125 C Storage Temperature T STG 55 to +150 C Electrical Characteristics SMD05C7 StandOff WM 5 reakdown 6 WM = 5, T=25 C 20 µ C etween I/O Pins and = 0, f = 1MHz 350 SMD12C7 StandOff WM R 2 1 reakdown WM = 12, T=25 C 1 µ C etween I/O Pins and = 0, f = 1MHz Semtech Corp. 2

3 Electrical Characteristics (Continued) SMD15C7 StandOff WM R 5 1 reakdown WM = 15, T=25 C 1 µ C 24 etween I/O Pins and = 0, f = 1MHz 75 SMD24C7 StandOff WM R 4 2 reakdown WM = 24, T=25 C 1 µ C 43 5 etween I/O Pins and = 0, f = 1MHz Semtech Corp. 3

4 Characteristics NonRepetitive Pulse Power vs. Pulse Time Power Derating Curve Pulse Power PPk (kw) Pulse Duration (µs) % of Rated Power or mbient Temperature T ( o C) Pulse Waveform Percent of e t td = /2 Waveform s: tr = 8µs td = 20µs Time (µs) ESD Pulse Waveform (IEC 60042) IEC Discharge s Level First Current () Current at 30 ns () Current at 60 ns () Test (Contact Discharge) (k) Test (ir Discharge) (k) Semtech Corp. 4

5 pplications Information Device Connection for Protection of Seven Data Lines The SMDxxC7 is designed to protect up to 7 data or I/O lines. They are bidirectional devices and may be used on lines where the signal polarities are above and below ground. Circuit Diagram The SMDxxC7 TS arrays employ a monolithic structure. Therefore, the working voltage (WM ) and breakdown voltage ( R ) specifications apply to the differential voltage between any two data line pins. For example, the SMD24C7 is designed for a maximum voltage excursion of ±12 between any two data lines. The device is connected as follows: Pins 1, 2, 3, 4, 5, 6 and 7 are connected to the lines that are to be protected. Pin 8 is connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. DT IN Connection Diagram DT OUT Circuit oard Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. DT IN DT OUT 2004 Semtech Corp. 5

6 Outline Drawing SO8 2X E/2 ccc C 2X N/2 TIPS aaa C SETING PLNE C N 1 2 D e D E1 E e/2 2 1 bxn bbb C D GGE PLNE 0.25 H SIDE IEW h L (L1) DETIL h c 01 SEE DETIL DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MX MIN NOM MX b c D E E.236 SC 6.00 SC e.050 SC 1.27 SC h L L1 N 01 0 (.041) (1.04) 8 8 aaa bbb ccc NOTES: 1. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). 2. DTUMS ND TO E DETERMINED T DTUM PLNE H 3. DIMENSIONS "E1" ND "D" DO NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE URRS. 4. REFERENCE JEDEC STD MS012, RITION. Land Pattern SO8 X DIMENSIONS DIM INCHES MILLIMETERS C (.205) (5.20) (C) G Z G P X Y Y Z P NOTES: 1. THIS LND PTTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MNUFCTURING GROUP TO ENSURE YOUR COMPNY'S MNUFCTURING GUIDELINES RE MET. 2. REFERENCE IPCSM782, RLP NO Semtech Corp. 6

7 Ordering Information Part Number Lead Finish Qty per Reel Reel Size SMD05C7.T SMD12C7.T SMD15C7.T SMD24C7.T SMD05C7.TT SMD12C7.TT SMD15C7.TT SMD24C7.TT Sn Sn Sn Sn SMD05C7 SMD12C7 SMD15C7 SMD24C7 SMD05C7.T SMD12C7.T SMD15C7.T SMD24C7.T Sn Sn Sn Sn Note: Leadfree devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, C Phone: (805) FX (805) Semtech Corp. 7