H2L Series OPTOLOGIC Optical Interrupter Switch Features Low cost.35" apertures Black plastic opaque housing Mounting tabs on housing Choice of inverter or buffer output functions Choice of open-collector or totem-pole output configuration TTL/CMOS compatible output functions Package Dimensions.972 (24.7).957 (24.3) Description January 28 The H2L series are slotted optical switches designed for multipurpose non contact sensing. They consist of a GaAs LED and a silicon OPTOLOGIC sensor packaged in an injection molded housing and facing each other across a.24" (3.5 mm) gap. The output is either inverting or non-inverting, with a choice of totem-pole or open-collector configuration for TTL/CMOS compatibility. Part Number Definitions H2LTB, Totem-pole, buffer output H2LTI, Totem-pole, inverter output H2LOB, Open-collector, buffer output H2LOI, Open-collector, inverter output.472 (2.).457 (.6) C L Ø.33(3.4) Ø.26(3.2) (2X).249 (6.35).243 (6.5) + D E +.755 (9.2).745 (8.9) C L.39 (.).34 (.85).29 (3.3).9 (3.).3 (2.6) NOM.433 (.).422 (.7) Optical C L.25 (3.2).9 (3.).35 (8.) MIN.25 (6.36).26 (5.5) LC.35 (8.9).33 (8.4).55 (.4).45 (.4).35 (8.9).33 (8.4) 2 3 5 4.55 (.4).45 (.4).2 (.5) (SQ). (2.8).9 (2.3) PIN ANODE PIN 2 CATHODE PIN 3 V CC PIN 4 VO PIN 5 GND Notes:. Dimensions for all drawings are in inches (mm). 2. Tolerance of ±. (.25) on all non-nominal dimensions unless otherwise specified. H2L Series Rev...
Absolute Maximum Ratings (T A = 25 C Unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Rating Units T OPR Operating Temperature -4 to +85 C T STG Storage Temperature -4 to +85 C T SOL-I Soldering Temperature (Iron) (5)(6)(7)(8) 24 for 5 sec C T SOL-F Soldering Temperature (Flow) (5)(6)(8) 26 for sec C INPUT (Emitter) I F Continuous Forward Current 5 ma V R Reverse Voltage 6 V P D Power Dissipation (3) mw OUTPUT (Sensor) I O Output Current 5 ma V CC Supply Voltage 4. to 6 V V O Output Voltage 3 V P D Power Dissipation (4) 5 mw Notes: 3. Derate power dissipation linearly.67mw/ C above 25 C. 4. Derate power dissipation linearly 2.5mW/ C above 25 C. 5. RMA flux is recommended. 6. Methanol or isopropyl alcohols are recommended as cleaning agents. 7. Soldering iron /6" (.6mm) from housing. 8. As long as leads are not under any stress or spring tension. H2L Series Rev... 2
Electrical/Optical Characteristics (T A = 25 C) Symbol Parameter Test Conditions Min. Typ Max. Units INPUT (Emitter) V F Forward Voltage I F = 2mA.5 V I R Reverse Leakage Current V R = 5 V µa OUTPUT (Sensor) I CC Supply Current V CC = 5 V 5 ma COUPLED V OL Low Level Output Voltage I F = ma, V CC = 5V, I OL = 6mA.4 V H2LTB, H2LOB Low Level Output Voltage H2LTI, H2LOI I F = 5mA, V CC = 5V, I OL = 6mA.4 V OH High Level Output Voltage I F = 5mA, V CC = 5V, I OH = -ma 2.4 V H2LTB High Level Output Voltage H2LTI I F = ma, V CC = 5V, I OH = -ma 2.4 I OH High Level Output Current I F = 5mA, V CC = 5 V, V OH = 3V µa H2LOB High Level Output Current I F = ma, V CC = 5 V, V OH = 3 V H2LOI I F (+) Turn on Threshold Current V CC = 5V 5 ma I F (-) Turn off Threshold Current V CC = 5V.5 ma I F (+) / I F (-) Hysteresis Ratio.2 t PLH, t PHL Propagation Delay, V CC = 5V, R L = 3Ω (Fig. 9) 6 µs H2LOI, H2LOB Propagation Delay, V CC = 5V, R L = 3Ω (Fig. 9) 6 H2LTI, H2LTB t r, t f Output Rise and Fall Time, V CC = 5V, R L = 3Ω (Fig. 9) ns H2LOI, H2LOB Output Rise and Fall Time, H2LTI, H2LTB V CC = 5V, R L = 3Ω (Fig. 9) 7 Input/Output Table Part Number LED Output H2LTB On High H2LTB Off Low H2LTI On Low H2LTI Off High H2LOB On High H2LOB Off Low H2LOI On Low H2LOI Off High H2L Series Rev... 3
Circuit Schematics ANODE () CATHODE (2) ANODE () CATHODE (2) ANODE () VOLTAGE REGULATOR LA VOLTAGE REGULATOR LA VOLTAGE REGULATOR LA V CC (3) V OUT (4) GND (5) V CC (3) V OUT (4) GND (5) V CC (3) V OUT (4) H2LTB Totem-Pole Output Buffer H2LTI Totem-Pole Output inverter H2LOB Open-Collector Output Buffer CATHODE (2) GND (5) ANODE () VOLTAGE REGULATOR LA V CC (3) V OUT (4) H2LOI Open-Collector Output Inverter CATHODE (2) GND (5) H2L Series Rev... 4
VO- Output Voltage (V) VO- Output Voltage (V) Typical Performance Characteristics IF(ON) - Normalized Threshold Current 6 5 4 3 2 V OL 2 3 4 5 I F - Input Current (ma) Figure. Output Voltage vs. Input Current (Inverters) V OH Black Shield + E D + d V CC = 5V R L = 27Ω T A = 25 C Black Shield d Normalized to: V CC = 5V I F = 2mA Pulsed Pulse Width = µs Duty Cycle =.% IF - Normalized Threshold Current 6 5 4 3 2 V OL 2 3 4 5 I F - Input Current (ma).6.4.2..8.6.4.2 V CC = 5V R L = 27Ω T A = 25 C Figure 2. Output Voltage vs. Input Current (Buffers) Normalized to: Turn ON Threshold V CC = 5V T A = 25 C V OH 2 3 4 5 6 7 8. 2 4 6 8 2 4 6 d - Distance (mm) V CC - Supply Voltage (V) Figure 3. Normalized Threshold Current vs. Shield Distance Figure 4. Normalized Threshold Current vs. Supply Voltage H2L Series Rev... 5
I F - Forward Current (ma) Response Delay Time (us) Typical Performance Characteristics (Continued) IF - Normalized Threshold Current VOL- Output Voltage, Low (V).8.6.4.2..8.6.4.2.. V CC = 5 V T A = 25 C I F = ma Normalized to: V CC = 5 V T A = 25 C T A - Ambient Temperature ( C) -4-2 2 4 6 8 Figure 5. Normalized Threshold Current vs. Ambient Temperature 5 4 3 2 8 6 4 2 T A = 25 C...2.3.4.5.6 V F - Forward Voltage (V) Figure 6. Forward Current vs. Forward Voltage V CC = 5 V R L = 27Ω T A = 25 C I F Pulsed T = ms Duty Cycle = 5% T PLH T PHL. I O - Output Current (ma) Figure 7. Low Output Voltage vs. Output Current 5 5 2 I F - Forward Current (ma) Figure 8. Response Time vs. Forward Current H2L Series Rev... 6
C 2 Pulse Generator V O = 5V f = KHz d.c. = 5% R = 3Ω R 2= 8Ω ma Figure 9. Switching Speed Test Circuit R 2 R C 5V. uf bypass GND C = 5pF C and C 2 include probe and C 2= 2pF stray wire capacitance Figure. Switching Times Definition for Buffer 5% ma Figure. Typical Operating Circuit + V IN - R IN R L V CC GND 5%. uf bypass Figure 2. Switching Times Definitions for Inverters V O tplh tphl t PHL tplh V OH Output V O 9% % 5% VOH Output V O % 9% V % 9% OL tr tf V OL t f 9% % t r H2L Series Rev... 7
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx Build it Now CorePLUS CROSSVOLT CTL Current Transfer Logic EcoSPARK EZSWITCH * Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FlashWriter * FPS FRFET Global Power Resource SM Green FPS Green FPS e-series GTO i-lo IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive Motion-SPM OPTOLOGIC OPTOPLANAR PDP-SPM Power22 Power247 POWEREDGE Power-SPM PowerTrench Programmable Active Droop QFET QS QT Optoelectronics Quiet Series RapidConfigure SMART START SPM STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET The Power Franchise TinyBoost TinyBuck TinyLogic TINYOPTO TinyPower TinyPWM TinyWire µserdes UHC Ultra FRFET UniFET VCX *EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete Formative or In Design First Production Full Production Not In Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I32 H2L Series Rev... 8