NG74 Single D Flip-Flop The NG74 is a high performance, full function edge triggered D Flip Flop in ultra small footprint. The NG74 input structures provide protection when voltages up to 7. are applied, regardless of the supply voltage. Features Extremely igh Speed: t PD = 2.6 ns (typical) at CC =. Designed for.6 to CC Operation ow Power Dissipation: I CC = A (Max) at T A = 2 C 24 ma Balanced Output Sink and Source Capability at CC = 3. Balanced Propagation Delays Overvoltage Tolerant (OT) Input Pins Ultra Small Package N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC 00 ualified and PPAP Capable This is a Pb Free Device TRUT TABE Inputs Outputs PR CR CP D h l h l Operating Mode Asynchronous Set Asynchronous Clear Undetermined oad and Read Register NC NC old = igh oltage evel = igh oltage evel One Setup Time Prior to the ow to igh Clock Transition = ow oltage evel = ow oltage evel One Setup Time Prior to the ow to igh Clock Transition = No Change = igh or ow oltage evel and Transitions are Acceptable = ow to igh Transition NC = Not a ow to igh Transition For I CC reasons, DO NOT FOAT Inputs PR D 6 CP 7 CR UFN8 MU SUFFI CASE 23AN PINOUT DIAGRAM OGIC DIAGRAM 2 3 MARKING DIAGRAM AA = Device Code M = Date Code* = Pb Free Package (Note: Microdot may be in either location) CC 8 8 CP D 7 6 2 3 PR CR 4 AA M GND CC = 8, GND = 4 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Semiconductor Components Industries, C, 203 September, 203 Rev. Publication Order Number: NG74/D
NG74 MAIMUM RATINGS Symbol Parameter alue Unit CC DC Supply oltage 0. to +7. I DC Input oltage 0. to +7. O DC Output oltage Output in igh or ow State (Note ) 0. to CC +0. I IK DC Input Diode Current I < GND 0 ma I OK DC Output Diode Current O < GND 0 ma I O DC Output Sink Current ±0 ma I CC DC Supply Current Per Supply Pin ±00 ma I GND DC Ground Current Per Ground Pin ±00 ma T STG Storage Temperature Range 6 to +0 C T ead Temperature, mm from Case for 0 Seconds 260 C T J Junction Temperature Under Bias +0 C JA Thermal Resistance (Note 2) 20 C/W P D Power Dissipation in Still Air at 8 C 20 mw MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 28 to 34 U 94 0 @ 0.2 in ESD ESD Withstand oltage uman Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note ) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. I O absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 0 mm inch, 2 ounce copper trace with no air flow. 3. Tested to EIA/JESD22 A4 A. 4. Tested to EIA/JESD22 A A.. Tested to JESD22 C0 A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit CC Supply oltage Operating Data Retention Only I Input oltage (Note 6) 0 O Output oltage (IG or OW State) CC T A Operating Free Air Temperature 40 +8 C.6. >2000 >200 N/A t/ Input Transition Rise or Fall Rate CC = 2. ±0.2 CC = 3. ±0.3 CC =. ±0. 6. Unused inputs may not be left open. All inputs must be tied to a high logic voltage level or a low logic input voltage level. 0 0 0 20 0.0 ns/ ORDERING INFORMATION NG74MUTCG NG74MUTCG* Device Package Shipping UFN8 (Pb Free) UFN8 (Pb Free) 3000 / Tape & Reel 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC 00 ualified and PPAP Capable. 2
NG74 DC EECTRICA CARACTERISTICS Symbol Parameter Condition CC () T A = 2 C 40 C T A 8 C Min Typ Max Min Max I igh evel Input oltage.6 0.7 CC 0.7 CC to 0.7 CC 0.7 CC I ow evel Input oltage.6 0.2 CC 0.2 CC O O igh evel Output oltage IN = I or I ow evel Output oltage IN = I I O = 00 A I O = 3 ma I O = 8 ma I O = 2 ma I O = 6 ma I O = 24 ma I O = 32 ma I O = 00 A I O = 3 ma I O = 8 ma I O = 2 ma I O = 6 ma I O = 24 ma I O = 32 ma to 0.3 CC 0.3 CC.6 to.6 2.7 4..6 to.6 2.7 4. CC 0..29.9 2.2 2.4 3.8 CC.2 2. 2.4 2.7 2. 4.0 0.008 0.0 0.2 0. 0.9 0.30 0.30 CC 0..29.9 2.2 2.4 3.8 I IN Input eakage Current IN = CC or GND 0..0 A I OFF Power off Input eakage Current 0. 0.24 0.3 0. 0. 0. 0.24 0.3 0. 0. or IN = GND 0.0 0 A I CC uiescent Supply Current IN = CC or GND.0 0 A Unit 3
NG74 AC EECTRICA CARACTERISTICS (Input t r = t f = ns) T A = 2 C T A = 40 to 8 C Î SymbolÎ Parameter ÎÎ CC () ÎÎ Test Conditions Î Min Î Unit Typ Max Min Max f Î MA Î Maximum Clock.8 ± 0. C ÎÎ = pf Frequency R D 7 Î 7 Mz ÎÎ ÎÎ 2. ± 0.2 = M 0 0 Î ( Duty Cycle) ÎÎ ÎÎ S = Open (Waveform ) Î ÎÎ 200 200 ÎÎ 20 Î 20 C ÎÎ = 0 pf, ÎÎ R D = 00, S 7 = Open Î 7 200 200 Î t P, Î Propagation Delay, ÎÎ ÎÎ.8 ± 0. C = pf 2. 6. 2. 2. 3 ns Î t P Î CP to or ÎÎ 2. ± 0.2 ÎÎ R D = M. 3.8 7.. (Waveform ) S Î ÎÎ = Open ÎÎ 8.0.0 Î 2.8 6..0 7.0 0.8 2.2 4. 0.8 ÎÎ.0 Î ÎÎ C = 0 pf, ÎÎ R D = 00, S = Open.0 3.4 7.0.0 ÎÎ 7..0 2.6.0.0 t Î P, Propagation Delay, t P Î.8 ± 0. C ÎÎ = pf PR or CR to or R D 2. 6. 4 2. 4. ns ÎÎ 2. ± 0.2 = M. 3.8 9.0. Î (Waveform 2) S = Open 9..0 2.8 6..0 Î 7.0 0.8 2.2.0 0.8 Î C ÎÎ = 0 pf, ÎÎ R D = 00, S.0 3.4 7.0.0 7. = Open.0 2.6.0.0 Î t S Î Setup Time, D to CP ÎÎ.8 ± 0. ÎÎ C = pf 6. 6. ns Î (Waveform ) ÎÎ 2. ± 0.2 ÎÎ R D = M 3. 3. S Î ÎÎ = Open ÎÎ Î 2.0 Î 2.0.. ÎÎ ÎÎ C = 0 pf, 2.0 2.0 Î ÎÎ ÎÎ R D = 00, S = Open.. t Î old Time, D to CP Î.8 ± 0. C ÎÎ = pf (Waveform ) R D 0. Î 0. ns ÎÎ ÎÎ 2. ± 0.2 = M 0. 0. Î ÎÎ ÎÎ S = Open 0. 0. Î ÎÎ ÎÎ 0. 0. Î C ÎÎ = 0 pf, ÎÎ R D = 00, S 0. = Open Î 0. 0. 0. Î t W Î Pulse Width, ÎÎ.8 ± 0. ÎÎ C = pf 6.0 6.0 ns Î CP, CR, PR ÎÎ 2. ± 0.2 ÎÎ R D = M 4.0 4.0 (Waveform 3) S Î ÎÎ = Open ÎÎ Î Î 2.0 2.0 ÎÎ ÎÎ C = 0 pf, Î ÎÎ ÎÎ R D = 00, S = Open 2.0 2.0 t Î REC Î Recover Time.8 ± 0. C ÎÎ = pf PR; CR to CP R D 8.0 Î (Waveform 3) ÎÎ Î 8.0 Mz ÎÎ ÎÎ 2. ± 0.2 = M S = Open 4. 4. ÎÎ Î ÎÎ ÎÎ Î C ÎÎ = 0 pf, ÎÎ R D = 00, S = Open Î Î 7. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC / 2 (per flip flop). C PD is used to determine the no load dynamic power consumption; P D = C PD CC 2 f in + I CC CC. CAPACITANCE (Note 8) Symbol Parameter Condition Typical Unit C IN Input Capacitance CC = 7.0 pf C OUT Output Capacitance CC = 7.0 pf C PD Power Dissipation Capacitance (Note 9) CC = 3.3 6 pf Frequency = 0 Mz CC =. 2 8. T A = +2 C, f = Mz 9. C PD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I CCD ) at no output loading and operating at duty cycle. (See Figure ) C PD is related to I CCD dynamic operating current by the expression: I CCD = C PD CC f in + I CC(static). 4
NG74 D CP t s t h t w f max t P, t P O, O WAEFORM PROPAGATION DEAYS, SETUP AND OD TIMES t R = t F = ns, 0% to 90%; f = Mz; t W = 00 ns PR CR t P t P O t P t P O WAEFORM 2 PROPAGATION DEAYS t R = t F = ns, 0% to 90%; f = Mz; t W = 00 ns PR, CR t w t rec CP t w WAEFORM 3 RECOERY TIME t R = t F = ns from 0% to 90%; f = Mz; t w = 00 ns Output Reg: O 0.8, O 2. Figure. AC Waveforms CC PUSE GENERATOR DUT R T C R Figure 2. Test Circuit
NG74 PACKAGE DIMENSIONS PIN ONE REFERENCE 2 0.0 C 2 D ÉÉÉ ÉÉÉ 0.0 C 0.0 C 0.0 C 8 TOP IEW SIDE IEW A 3 DETAI B A B E 8 3 (A3) e A EPOSED Cu C SEATING PANE A UFN8 MU SUFFI CASE 23AN ISSUE O ÇÇÇ ÇÇÇ ÉÉÉ DETAI B OPTIONA CONSTRUCTION MOD CMPD A3 3 b (0.) (0.0) DETAI A OPTIONA CONSTRUCTION NOTES:. DIMENSIONING AND TOERANCING PER ASME Y4.M, 994. 2. CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b APPIES TO PATED TERMINA AND IS MEASURED BETWEEN 0. AND 0.30 mm FROM TE TERMINA TIP. MIIMETERS DIM MIN MA A 0.60 A 0.00 0.0 A3 0.3 REF b 0. 0.2 D.60 BSC E.60 BSC e 0.0 BSC 0.3 0. 3 0.2 0.3 SODERING FOOTPRINT*.70 0.0 PITC DETAI A 7 8 8 b 0.0 C A B BOTTOM IEW 0.0 C NOTE 3 0.3 7 0.2.70 8 0.3 DIMENSIONS: MIIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCIC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 8027 USA Phone: 303 67 27 or 800 344 3860 Toll Free USA/Canada Fax: 303 67 276 or 800 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 282 98 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 790 290 Japan Customer Focus Center Phone: 8 3 87 00 6 ON Semiconductor Website: www.onsemi.com Order iterature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NG74/D