MC33269, NCV ma, Adjustable Output, Low Dropout Voltage Regulator

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1 00 ma, ustable Output, ow Dropout Voltage Regulator The MC269/NCV269 series are low dropout, medium current, fixed and adjustable, positive voltage regulators specifically designed for use in low input voltage applications. These devices offer the circuit designer an economical solution for precision voltage regulation, while keeping power losses to a minimum. The regulator consists of a.0 V dropout composite PNPNPN pass transistor, current limiting, and thermal shutdown. Features. V,.5 V, 5.0 V, 2 V and ustable Versions 2.5 V version available as MC426 Space Saving, and SOT22 Power Packages.0 V Dropout Output Current in Excess of 00 ma Thermal Protection Short Circuit Protection Output Trimmed to.0% Tolerance NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ00 Qualified and PPAP Capable These are PbFree Devices DEVICE TYPE/NOMINA OUTPUT VOTAGE MC269D NCV269D* MC269DT NCV269DTRK* MC269T MC269D. MC269DT. NCV269DTRK.* MC269T. MC269ST.. V. V. V. V. V MC269T.5 MC269D5.0 MC269DT5.0 NCV269DT5.0* NCV269DTRK5.0* MC269T5.0 MC269D02 MC269DT02 NCV269DTRK02* MC269T02.5 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 2 V 2 V 2 V 2 V *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ00 Qualified and PPAP Capable. GND/ 2 4 (Top View) DT SUFFIX CASE 69C. GND/ 2.. SOT22 ST SUFFIX CASE E TO220AB T SUFFIX CASE 22AB D SUFFIX CASE 75 NC NC Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. 2 (Top View) 2 (Top View). GND/ (Top View) Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page of this data sheet. Semiconductor Components Industries, C, 204 August, 204 Rev. 2 Publication Order Number: MC269/D

2 MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Input Voltage 20 V Power Dissipation Case 69C () T A = 25 C Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase Case 75 () T A = 25 C Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase Case 22A (TO220) T A = 25 C Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase Case E (SOT22) T A = 25 C Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase P D JA JC P D JA JC P D JA JC P D JA JC Internally imited Internally imited Internally imited Internally imited 56 5 Operating Die Junction Temperature Range T J 40 to +50 C Operating Ambient Temperature Range NCV269 MC269 T A 40 to to +25 Storage Temperature T stg 55 to +50 C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) ESD W W W W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. EECTRICA CHARACTERISTICS (C O = 0 F, T A = 25 C, for min/max values T A = 40 C to +25 C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Output Voltage (I out = 0 ma, T A = 25 C) V O V. Suffix (V CC = 5. V).5 Suffix (V CC = 5.5 V) 5.0 Suffix (V CC = 7.0 V) 2 Suffix (V CC = 4 V) Output Voltage (ine, oad and Temperature) (Note ) (.25 V 5 V, I out = 500 ma) (.5 V 0 V, I out = 00 ma). Suffix.5 Suffix 5.0 Suffix 2 Suffix V O C V V Reference Voltage for ustable Voltage (I out = 0 ma, = 2.0 V, T A = 25 C) Reference Voltage (ine, oad and Temperature) (Note ) for ustable Voltage (.25 V 5 V, I out = 500 ma) (.5 V 0 V, I out = 00 ma) V ref V V ref V ine Regulation (I out = 0 ma, = [ +.5 V] to = 20 V, T A = 25 C) Reg line 0. % oad Regulation ( = +.0 V, I out = 0 ma to 00 ma, T A = 25 C) Reg load 0.5 % Dropout Voltage (I out = 500 ma) (I out = 00 ma) Ripple Rejection (0 V pp, 20 Hz Sinewave; I out = 500 ma) RR 55 db Current imit ( = 0 V) I imit 00 ma Quiescent Current (Fixed Output) (.5 V.5 V) (5 V 2 V) I Q V ma Minimum Required oad Current Fixed Output Voltage ustable Voltage I oad.0 0 ma ustment Pin Current I 20 A. The MC2692, is limited to.0 V maximum, because of the 20 V maximum rating applied to. 2

3 Trim inks V Gnd This device contains active transistors. Figure. Internal Schematic

4 .5 V in -V out, DROPOUT VOTAGE (V) T A = 25 C T A = -40 C T A = 25 C I O, OUTPUT OAD CURRENT (ma) IO, OUTPUT Δ VO, OUTPUT CURRENT VOTAGE DEVIATION 20 ms/div C in = 0 F C O = 0 F Tantalum = V O +.0 V Preload = 0. A 00 mv/div 0.5 A 0 A Figure 2. Dropout Voltage versus Output oad Current Figure. Transient oad Regulation, OVERVOTAGE INPUT THRESHOD (%V ) FB(OV) FB V I O = 00 ma T A, AMBIENT TEMPERATURE ( C) OUTPUT CURRENT (A) T A = 25 C MC269D-XX = 25 mm Copper INPUT-OUTPUT VOTAGE DIFFERENTIA (V) Figure 4. Dropout Voltage versus Temperature Figure 5. MC269XX Output DC Current versus InputOutput Differential Voltage RR, RIPPE REJECTION RATIO (db) = V O +.0 V I = 00 ma T A = 25 C V O = 2 V V O =. V or 5.0 V RR, RIPPE REJECTION RATIO (db) =.0 V = 5.0 V I = 00 ma C = 22 F T A = 25 C f, FREQUENCY (khz) f, FREQUENCY (khz) 00 Figure 6. MC269 Ripple Rejection versus Frequency Figure 7. MC269ADJ Ripple Rejection versus Frequency 4

5 70.2 R θja, THERMA RESISTANCE, JUNCTION-TO-AIR ( C/W) 50 P D(max) for T A = 50 C Graph represents symmetrical layout ÏÏÏ 2.0 oz. ÏÏÏ ÏÏÏ Copper ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ.0 mm R JA , ENGTH OF COPPER (mm) Figure. SOP Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper ength R θja, THERMA RESISTANCE, JUNCTION-TO-AIR ( C/W) Free Air Mounted Vertically Minimum Size Pad P D(max) for T A = 50 C 2.0 oz. Copper ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ R JA , ENGTH OF COPPER (mm) Figure 9. Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper ength R θja, THERMA RESISTANCE JUNCTION TO AIR ( C/W) Free Air Mounted Vertically Minimum Size Pad P D(max) for T A = 50 C 2.0 oz. Copper ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ R JA , ENGTH OF COPPER (mm), MAXIMUM POWER DISSIPATION (W) P D Figure 0. SOT22 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper ength 5

6 APPICATIONS INFORMATION Figures through 5 are typical application circuits. The output current capability of the regulator is in excess of 00 ma, with a typical dropout voltage of less than.0 V. Internal protective features include current and thermal limiting. * The MC269 requires an external output capacitor for stability. The capacitor should be at least 0 F with an equivalent series resistance (ESR) of less than 0 but greater than 0.2 over the anticipated operating temperature range. With economical electrolytic capacitors, cold temperature operation can pose a problem. As temperature decreases, the capacitance also decreases and the ESR increases, which could cause the circuit to oscillate. Also capacitance and ESR of a solid tantalum capacitor is more stable over temperature. The use of a low ESR ceramic capacitor placed within close proximity to the output of the device could cause instability. ** An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the ** C in MC269-XX GND C o * 0 F An input capacitor is not necessary for stability, however it will improve the overall performance. Figure. Typical Fixed Output Application ** C in MC269 R S I out.25 R S Figure. Current Regulator I out C o * 0 F supply input filter with long wire lengths. This will reduce the circuit s sensitivity to the input line impedance at high frequencies. A 0. F or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator s input terminals. Applications should be tested over all operating conditions to insure stability. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 70 C, the output is disabled. There is no hysteresis built into the thermal limiting circuit. As a result, if the device is overheating, the output will appear to be oscillating. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heatsinking. ** C in MC269 C *** C o * 0 F ***C is optional, however it will improve the ripple rejection. The MC4269 develops a.25 V reference voltage between the output and the adjust terminal. Resistor R, operates with constant current to flow through it and resistor R2. This current should be set such that the ust Pin current causes negligible drop across resistor R2. The total current with minimum load should be greater than.0 ma. Figure 2. Typical ustable Output Application R R2.25 R2 R I R2 ** C in ** C in MC269-XX GND MC269-XX GND C o * 0 F The Schottky diode in series with the ground leg of the upper regulator shifts its output voltage higher by the forward voltage drop of the diode. This will cause the lower device to remain off until the input voltage is removed. Figure 4. Battery BackedUp Power Supply ** C in MC269 C o * 0 F R 2 sets the maximum output voltage. Each transistor reduces the output voltage when turned on. Figure 5. Digitally Controlled Voltage Regulator R R2 6

7 ORDERING INFORMATION Device Package Shipping Information MC269DG 9 Units / Rail MC269DR2G MC269DTG 75 Units / Rail MC269DTRKG MC269TG TO Units / Rail MC269D.G 9 Units / Rail MC269DR2.G MC269DT.G 75 Units / Rail MC269DTRK.G MC269ST.TG SOT Units / Tape & Reel MC269T.G TO Units / Rail MC269T.5G TO Units / Rail MC269D5.0G 9 Units / Rail MC269DR25.0G MC269DT5.0G 75 Units / Rail NCV269DT5.0G* 75 Units / Rail MC269DTRK5.0G MC269T5.0G TO Units / Rail MC269D02G 9 Units / Rail MC269DR202G MC269DT02G 75 Units / Rail MC269DTRK02G MC269T02G TO Units / Rail NCV269DR2G* NCV269DTRKG* NCV269DTRK.G* NCV269DTRK5.0G* NCV269DTRK2G* For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD0/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ00 Qualified and PPAP Capable. 7

8 MARKING DIAGRAMS D SUFFIX CASE AJ AYW 692 AYW 269 AYW 2695 AYW DT SUFFIX CASE 69C SOT22 ST SUFFIX CASE E 269AJG AYWW 2 692G AYWW 2 269G AYWW G AYWW 2 AYW TO220AB T SUFFIX CASE 22A MC 269T AWYWWG MC 269T2 AWYWWG MC 269T AWYWWG MC 269T5 AWYWWG A = Assembly ocation, W = Wafer ot Y = Year W, WW = Work Week G = PbFree Package = PbFree Package (Note: Microdot may be in either location)

9 PACKAGE DIMENSIONS D SUFFIX CASE 7507 ISSUE AK X B Y A 5 4 S 0.25 (0.00) M Y M K NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETER.. DIMENSION A AND B DO NOT INCUDE MOD PROTRUSION. 4. MAXIMUM MOD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SHA BE 0.27 (0.005) TOTA IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIA CONDITION THRU 7506 ARE OBSOETE. NEW STANDARD IS Z H G D C 0.25 (0.00) M Z Y S X S SEATING PANE 0.0 (0.004) N X 45 M J MIIMETERS INCHES DIM MIN MAX MIN MAX A B C D G.27 BSC BSC H J K M 0 0 N S SODERING FOOTPRINT* SCAE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 9

10 PACKAGE DIMENSIONS DT SUFFIX CASE 69C ISSUE D 4 b2 e E b 4 2 b A D B DETAI A c (0.) M C A C c2 H 2 GAUGE PANE DETAI A ROTATED 90 CW A H C Z SEATING PANE NOTES:. DIMENSIONING AND TOERANCING PER ASME Y4.5M, CONTROING DIMENSION: INCHES.. THERMA PAD CONTOUR OPTIONA WITHIN DI- MENSIONS b, and Z. 4. DIMENSIONS D AND E DO NOT INCUDE MOD FASH, PROTRUSIONS, OR BURRS. MOD FASH, PROTRUSIONS, OR GATE BURRS SHA NOT EXCEED INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PANE H. INCHES MIIMETERS DIM MIN MAX MIN MAX A A b b b c c D E e BSC 2.29 BSC H REF 2.74 REF BSC 0.5 BSC Z SODERING FOOTPRINT* SCAE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 0

11 PACKAGE DIMENSIONS SOT22 ST SUFFIX CASE E04 ISSUE N D b NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: INCH. 0.0 (000) H E e A e 4 2 b E A C MIIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A b b c D E e e H E SODERING FOOTPRINT* SCAE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

12 PACKAGE DIMENSIONS TO220, SINGE GAUGE T SUFFIX CASE 22AB ISSUE A B F T S C T SEATING PANE NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: INCHES.. DIMENSION Z DEFINES A ZONE WHERE A BODY AND EAD IRREGUARITIES ARE AOWED. 4. PRODUCT SHIPPED PRIOR TO 200 HAD DIMENSIONS S = INCHES ( MM) INCHES MIIMETERS DIM MIN MAX MIN MAX A B C D F G H J K N Q R S T U V Z H Q Z V G 4 2 N D A K U R J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCIC s product/patent coverage may be accessed at SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 027 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC269/D

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