Contents. 1. Trends 2. Markets 3. Requirements 4. Solutions

Transcription

1 Server Memory Forum Shenzhen 2012

2 Contents 1. Trends 2. Markets 3. Requirements 4. Solutions

3 Big Client Big Iron Evolution of IT Infra Architecture Mainframe Powerful PC Server- Client The Web : Thin client The Cloud

4 The Cloud : Server-Client reintroduced Cloud with rich clients model driven by increasing power of Internet-connected devices and the cost-utilization incentives Context awareness Cost reduced by client utilization Application responsiveness User experience

5 The Cloud : Boundaryless Society , SNS, audio/video and collaboration services through virtualized, highly scalable servers blur boundaries Cloud Infra: Data Center Friends Office Connection Family

6 revenue [millions of dollars] k unit shipment The Cloud is growing fast in China China surpassed Japan after 2010 world economic crisis showing rapid growth of x86 server used in public cloud. Top 3 Server Markets Cloud Growth in China 25,000 2,000 1,800 20,000 1,600 1,400 CAGR=16.9% 15,000 1,200 1,000 10,000 China > Japan CAGR=36.5% 5, Total number of x86 server market shipments US Japan China Number of servers used in public cloud (Source : Gartner 2011 Q4) (Source : Gartner 2011 Nov.)

7 revenue [millions of dollars] k unit shipment Mid-term Sever Market Forecast x86 server continues proliferating for horizontal scalability. (e.g. the cloud, virtualization) But non-x86 still significant for RAS & vertical scalability. (e.g. core infrastructure, database) Server Revenue by Platform Forecast on x86 Data Center 50,000 45,000 40,000 CAGR=6.7% 14,000 12,000 35,000 30,000 10,000 Total x86 Server 25,000 8,000 20,000 15,000 6,000 10,000 5, ,000 2, % DC for Enterprise DC for Cloud 17% x86 Non x86 (RISC, IA64, others) (Source : Gartner 2011 Q4) (Source : IDC 2011 Sep., Hynix)

8 Big data market can get very big Forbes.com recently showed a groundbreaking report of forecasting astounding CAGR 58% of big data market reaching $50 billion revenue by (HW, SW, Services included) (Source : Forbes.com/Wikibon 2012 Feb)

9 Requirements for Memory High Density Highly Parallel Workloads (HPC, Mission Critical) Scalable Performance Low Power Standard Workloads Small Form Factor Low Power Light weight workloads (Web Hosting, Contents Delivery)

10 DDR4 as Server Optimized Solution More than 40% of the new features were derived from server requirements. DDR4 Feature Breakdown DBI Boundary Scan Client Reliability Performance High Density CRC (Cyclic Redundancy Check) CA Parity (CMD/ADDR Parity) TCAR (Temperature Compensated Auto Refresh) MPR (Multi Purpose Register) PDA (Per DRAM Addressability) 3DS (3 Dimensional Stack) CRC CA Parity MPR MRS Readout Fine Granul Refresh TCAR Max Pwr Saving 0.5KB Page 3DS PDA Server 45% Common Bank Group Self Ref Abort Gear Down Internal VrefDQ PASR TCSR CAL VDDQ Term

11 Hynix DDR4 Development Status 30nm class 2Gb DDR4 was developed in Q1 11 with the lasted JEDEC spec at the time. Hynix plans to mass produce JEDEC compliant 20nm class 4Gb DDR4 in 1H 13.

12 Supply Voltage [V] DDR SDRAM Supply Voltage Trend DDR4L of 1.0xV anticipated in 2016 if the supply voltage trend can be maintained V 25%/3years 2 1.8V 17%/4years DDR DDR2 1.5V DDR3 17%/4years 1.35V 1.25V DDR3L DDR3U %/4years? 1.2V 1.0xV DDR4 DDR4L Year

13 Ultra Low Voltage Operation at 1.0V Ultra low voltage operation of 2400Mpbs at 1.0V was verified on ATE level with 30nm class 2Gb DDR4. tck vs VDD Shmoo VDD range for DDR4 Spec Passed at 1.0V 2400Mbps

14 40% Power Saving compared to DDR3 30nm class 2Gb DDR4 achieved 40% power saving and 35% standby current saving compared to 1.5V DDR xnm 2Gb D3 vs D4 Power 3xnm 2Gb D3 vs D4 IDD 100% DDR3 DDR3-40% -35% DDR4 80% 60% DDR4 *based on IDD measured at 2133Mbps 40% IDD0 IDD2N IDD4R IDD4W IDD5 IDD6N *with CAL (CS to ADDR/CMD Latency) enabled

15 Bandwidth Improvement overt DDR4 Bank Group for Performance Scaling Bank grouping enhances performance by more than 30% providing gapless read operations with 16 banks. 25.0% 20.0% 16 banks performance improvement over 8 banks (1 Rank, Open-page) 2133Mbps 15.0% gapless read 2400Mbps verified w/ BG 10.0% Read Read Read Read Read Read 5.0% 0.0% (Source : Memory Systems, Cache/DRAM/Disk) tck 0.83ns(DDR2400) Data Rate [Mbps]

16 DDR4 CRC for Reliability on Data CRC provides error detection capability on data channel reducing BER. CRC Alert Latency & Pulse Width Shmoo CRC Functionality Check on ATE RD ACT WT PRE RD tcrc_alert MRSRDOUT_EN tcrc_alert_pw MRSRDOUT_DIS With CRC Error clear MRSRDOUT_EN CRC Error tcrc_alert_pw 1.9ns

17 DDR4 CA Parity for Reliability on C/A Bus CA Parity provides error detection on command/address bus with debug capability using MPR readout Alert Latency & Pulse Width Shmoo Functionality Check on ATE RDRDRDRD Active MRSREADOUT tpar_pw MPR0 MPR2 MPR1 MPR3 PARITY Error from Active command tpar_on

18 3DS as High Density Solution More than 1 TB of memory per CPU socket is possible with 4Hi 8Gb 3DS DDR4 based 128GB LRDIMM, which can address SI concern on both data and c/a. But cost challenge remains to be solved across industry. 128GB 128GB 128GB 128GB 128GB 128GB 128GB 128GB 128GB 128GB 128GB 128GB

19 Hynix 3DS Development Several types of 3DS have been explored with 40nm class 2Gb DDR3 ranging from 8GB/16GB RDIMM to 16Gb PKG Hynix has no plan for 3DS DDR3 and anticipates mass production of 3DS in DDR4 8GB RDIMM (2Rx4) 16Gb PKG (2Gb 8Hi)

20 3DS saves power. A lot 40nm class 2Gb 3DS 16GB DDR3 confirmed that it can drop to power a level equivalent to 8GB module. 4xm 16GB DDR3 (4Rx4) 4xnm 16GB 3DS DDR3 4xnm 8GB DDR3 (2Rx4) (Source : IBM)

21 Hynix Small Form Factor Module Hynix provides ECC-SODIMM, ULP mini UDIMM, VLP ECC UDIMM as small form factor solutions. Small form factor Server ULP Mini-IMM ECC SODIMM VLP ECC UDIMM Embedded system Network system

22 Summary IT infra architecture and market forces have shifted toward the Cloud, and China has become a very important part of server market. Server optimized DDR4 will be introduced very soon capable of providing low power and scalable performance solution. 3DS will be able to answer the needs from big data market. But it may take time for cost challenge of higher stack to be resolved.