Chapter #7: Sequential Logic Case Studies. 7.6 Random Access Memories

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1 Chapter #7: Sequential Logic Case Studies 7.6 Random Access Memories R.H. Katz Transparency No. 21-1

2 Transistor efficient methods for implementing storage elements Small RAM: 256 words by 4-bit Large RAM: 4 million words by 1-bit We will discuss a 1024 x 4 organization Static RAM The circuit configuration holds a 1 or 0 as long as the system continues to receive power Static Rams are the fastest memories and the easiest to interface with. R.H. Katz Transparency No. 21-2

3 Basic storage element of the SRAM is a 6-transistor circuit. Data j Data j Word Enable i Words = Rows Static RAM Cell Static RAM Cell Static RAM Cell Columns = Bits (Double Rail Encoded) Nmos transistors provide access to the storage element from two buses, denoted Dataj and Dataj. To write the memory element, special circuitry in the RAM drives the data bit and its complement onto these lines while the word enable line is asserted. To read the contents of the storage element, the word enable line is asserted. The data are sensed by a different collection of special circuits. These circuits detect small voltage differences between the data line and its complement. R.H. Katz Transparency No. 21-3

4 Static RAM Organization Chip Select Line (active lo) Write Enable Line (active lo) 10 Address Lines to yield 1024 words 4 Bidirectional Data Lines (used for reading and writing data) WE determines direction: 0 -- write 1 -- read CS WE A9 A8 A7 A6 A5 A4 A3 A2 A1 A x 4 SRAM IO3 IO2 IO1 IO0 Data line R.H. Katz Transparency No. 21-4

5 RAM Organization Long thin layouts are not the best organization for a RAM Some Addr bits select row A9 A8 A7 A6 A5 A4 Address Buffers Row Decoders Storage Matrix Array 64 x x x x x 64 Square Array Some Addr bits select within row A3 A2 A1 A0 Address Buffers Column Decoders Sense Amplifiers Amplifers & Mux/Demux CS WE Data Buffers I/O0 I/O1 I/O2 I/O3 R.H. Katz Transparency No. 21-5

6 RAM Timing WE Simplified Read Timing CS Address V alid Address Access T ime Data Out Data Out Memory access time -- time it takes for new data to be ready to appear at the output R.H. Katz Transparency No. 21-6

7 RAM Timing WE Simplified Write Timing CS Address Memory Cycle T ime V alid Address Data In Input Data Memory cycle time -- time between subsequent memory operations. R.H. Katz Transparency No. 21-7

8 Dynamic RAMs -- densest memories High capacity due to efficient memory element: Word Line 1 Transistor (+ capacitor) memory element Read: Assert Word Line, Sense Bit Line Write: Drive Bit Line, Assert Word Line (charge capacitor with the desired logic voltage) Bit Line Destructive Read-Out (to read contents of storage capacitor, must discharge it across the bit line) Need for Refresh Cycles: storage decay in ms Internal circuits read word and write back R.H. Katz Transparency No. 21-8

9 DRAM Organization Long rows to simplify refresh Two new signals: RAS, CAS Row Address Strobe Column Address Strobe replace Chip Select Row Decoders Storage Matrix 64 x 64 Row Address A11... A0 RAS CAS WE Control Logic Column Address & Control Signals Column Latches, Multiplexers/Demultiplexers DOUT DIN R.H. Katz Transparency No. 21-9

10 Random Access Memory RAS, CAS Addressing Even to read 1 bit, an entire 64-bit row is read! Separate addressing into two cycles: Row Address, Column Address Saves on package pins, speeds RAM access for sequential bits! Address Row Address Col Address Read Cycle RAS CAS Dout Read Row Row Address Latched Read Bit Within Row Column Address Latched Valid Tri-state Outputs R.H. Katz Transparency No

11 Random Access Memory Write Cycle Timing Address Row Address Col Address RAS (1) Latch Row Address Read Row CAS (2) WE low WE Din Valid (3) CAS low: replace data bit (4) RAS high: write back the modified row (5) CAS high to complete the memory cycle R.H. Katz Transparency No

12 Random Access Memory RAM Refresh Refresh Frequency: 4096 word RAM -- refresh each word once every 4 ms Assume 120ns memory access cycle This is one refresh cycle every 976 ns (1 in 8 DRAM accesses)! But RAM is really organized into 64 rows This is one refresh cycle every 62.5 µs (1 in 500 DRAM accesses) Large capacity DRAMs have 256 rows, refresh once every 16 µs RAS-only Refresh (RAS cycling, no CAS cycling) External controller remembers last refreshed row Some memory chips maintain refresh row pointer CAS before RAS refresh: if CAS goes low before RAS, then refresh R.H. Katz Transparency No

13 Random Access Memory DRAM Variations Page Mode DRAM: read/write bit within last accessed row without RAS cycle RAS, CAS, CAS,..., CAS, RAS, CAS,... New column address for each CAS cycle Static Column DRAM: like page mode, except address bit changes signal new cycles rather than CAS cycling on writes, deselect chip or CAS while address lines are changing Nibble Mode DRAM: like page mode, except that CAS cycling implies next column address in sequence -- no need to specify column address after first CAS Works for 4 bits at a time (hence "nibble") RAS, CAS, CAS, CAS, CAS, RAS, CAS, CAS, CAS, CAS,... R.H. Katz Transparency No

14 HW #19 -- Sections 7.6 R.H. Katz Transparency No

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