PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP.
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1 PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP.
2 Corporate Information Established in 2004 Headquarter office in San Jose, CA Production factory located in Binh Duong, Vietnam - Center of hi-tech industrial parks - 30 min. from Ho Chi Minh City - 20,000 sq. ft. manufacturing facility - 2,000 sq. ft. office space 35 employees combined 100% US owned company Revenue for Y2009: USD 1.0M Revenue for Y2010E: USD 1.2M
3 Mission Statement FAB-9 strives to become the Low Cost Solution for the PCB design & manufacturing service while maintaining consistent quality, delivery and customer support
4 Quality Policy It is the policy of Fab-9 to provide all customers with the highest quality workmanship. We enforce strict Quality Management System and continuous improvement process to ensure our products exceed customer s specifications Fab-9 Vietnam have achieved ISO 9001 certification in March 2007
5 Management Team Anthony Viet Tran CEO Co-founder of Hytek Services USA since 1993, he has extensive experience background in the PCB design layout. Anthony holds a BS Computer Science from the University of Indiana Prudencio Valdez Technical VP Prudencio has more than 25 years of experience in the manufacturing of printed circuit boards. He has helped startup various PCB companies in the silicon valley, CA. Prudencio have managed teams at the Tyco Elec. Div. and Sanmina
6 Company Structure FAB-9 JOINT STOCK CO., Headquarter Office California, USA Manufacturing Binh Duong, VN Sales Design Services Customer Support PCB Manufacturing Design Services Sales Customer Support
7 Professional Services PCB Manufacturing Complex-Multilayer Printed Circuit Board UL and RoHS certified materials Impedance Controlled (50 ohm, 5%) Quick-turn Prototypes (3 days, 4-10 layers) Medium Volume Production (20,000 sq ft / month) Layout Design Net Topology Optimization Material Performance Recommendation Stack-up Creation PCB Layout Guideline Creation Pad-Stack / Component Footprint Creation & Verification
8 Manufacturing Capabilities CATEGORIES STANDARD SPECIAL CATEGORIES STANDARD SPECIAL Board Thickness Based Copper Thickness (All Layers) Minimum.040" (1mm).024" (0.61mm) 0.25 oz (9um) Maximum.125 (3.175mm).200 (5.08mm) 0.5 oz (18um) Panel / Board Dimensions 1.0 oz (36um) Minimum Panel Dimensions 18x24 (457x610) 2.0 oz (72um) Maximum Panel Dimensions 18x24 (457x610) 3.0 oz (108um) Maximum Board Dimensions 16x22 (406x559) 4.0 oz (144um) Minimum Lines & Spaces Annular Ring Lines Internal (1/2oz copper thk) (0.1mm) (0.07mm) Internal Layers 2.5 mil (0.06mm) 2.0 mil (0.05mm) Lines External (1/2oz copper thk) (0.1mm) (0.07mm) External Layers 2.5 mil (0.06mm) 2.0 mil (0.05mm) Spaces Internal (1/2oz copper thk) (0.1mm) (0.07mm) Drilling Capability Spaces External (1/2oz copper thk) (0.1mm) (0.07mm) Minimum Drilled Hole 10.0 mil (0.25mm) 6.0 mil (0.15mm) Layer Count Hole Location Accuracy 2 mil (0.05mm) Maximum Layer Count rigid Image to Hole Location Accuracy 2.5 mil (0.06mm) Maximum Layer Count flexible 2 1 Drill to Metal Minimum Spacing 7 mil (0.18mm) 5 mil (0.13mm) Maximum Layer Count (rigid +flex) 4 6 Aspect Ratio 8:1 10:1
9 Manufacturing Capabilities Cont. CATEGORIES STANDARD SPECIAL CATEGORIES STANDARD SPECIAL Solder Mask Machining Minimum Solder Mask Clearance SMD Pads 4.0 mil (0.05mm) 2 mil (0.05mm) Routing Tolerance +/- 10mil (.25mm) +/-5mil(.12mm) Minimum Solder Mask Dam Between SMD Pads 3.0 mil (0.08mm) 2.0 mil (0.05mm) Hole to Edge Location 10.0 mil (.25mm) 7 mil(.18mm) Minimum Solder Mask Thickness 0.8 mil (0.02mm) >0.8 mil Metal to Edge Minimum 25 mil (.63mm) 0 Plating Capability V-Groove Angles Capability (30, 45, 60, 90 deg) (30, 45, 60, 90 deg) Average Copper Plating (inside hole) 1 mil (.025mm) Electrical Test Minimum Copper Plating (inside hole) 1 mil (.025mm) Single Ended Impedance 10% 5% Nickel Thickness 150 uinch (3.8um) 250uinch (6.35um) Differential Impedance 10% 5% Selective Electrolytic Gold Plating 2-3 uinch (0.07um) 30uinch (0.7 um) Test Voltage Gold Edge Connector Thickness Max Isolation Resistance OSP Thickness Min Continuity Resistance HAL Thickness Minimum pad size 7 mil (0.18mm) 5 mil (0.13mm) Immersion Gold Thickness Minimum Pitch (pad-to-pad) 11 mil (0.28mm) 9 mil (0.23mm) Immersion Silver Board Warpage Maximum Warpage 1.50% 0.75%
10 Equipment List Photo Orbotech 5008 Express (1998) Orbotech 5008 CA Picard film registration punch (2001) Primary Imaging 2 Colight Exposure Unit (8kW) Colight Exposure Unit (5kW) CA Picard material registration punch (2001) 2 Teknek CM6 clean machines
11 Equipment List Wet Processing: Chemcut clean line 547XL (2000) Chemcut DES line 547XL Chemcut SES lines 547 Chemcut Deburrer 604 MacDermid Multibond line (1998) IS pumice scrubber, Pumiflex Vertical Electroless and DC plating lines Water Purification and Waste Treatment: DI water system Clarifier waste treatment system
12 Equipment List Lamination: TMP vacuum assisted press. 4 openings hot and cold. Automatic loader Drilling/Fabrication: 2 Excellon Mark VI drill with CNC-6 controllers 1 Excellon Mark V Driller/Router 1 Excellon Mark IV drill 1 Excellon XL-3 Router Inspection/Testing: AOI Orbotech 206E Probot Super Six-D
13 Material Suppliers Fab-9 uses high end materials from top quality manufacturers to fabricate our PCBs. The materials we use are also UL listed and RoHS compliant Materials Description Manufacturer Series Specs UL Listed RoHS Compliant Copper Clad Laminate Matsushita, Iteq, NanYa, Polyimide ISOLA R1766T, IT-180, NP-170 High Tg >170 Prepregs Matsushita, Iteq, NanYa Polyimide ISOLA R1766T, IT-180, NP-170 High Tg > 170 Solder Mask Taiyo PSR-2000, 4000,.. LPI Green, Blue, Clear Legend Ink Taiyo S-200W White Copper Foil Nikko Materials HTE 1/2 oz, 1 oz Copper Plating Atotech Cupracid Nickel/Gold Finishing Uyemura GoBright
14 Certifications UL Listed FAB-9 is UL Listed under product code E E ISO 9001:2008 FAB-9 obtained its ISO 9001 standard certification in March 2007 RoHS FAB-9 products have been certified by TUV Vietnam as RoHS compliant RoHS COMPLIANT
15 Business Partners
16 Thank You Fab-9 Corp.- Headquarter 1630 Old Oakland Rd. Suite A212 San Jose, CA USA Tel: (408) , Fab-9 Joint Stock Company 1B St. Dong An Industrial Park Binh Duong Province, Vietnam Tel: (+84) , , Fax: (+84)
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