UL Recognition in the view of a PCB manufacturer

Transcription

1 UL Recognition in the view of a PCB manufacturer J.Deutschmann, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse 13 A-8700 Leoben Tel +43 (0) info@ats.net

2 Agenda General Info UL Mission UL Customer requirements UL labelling UL requirements 1

3 Agenda Sequence of release Kind s of UL recognition Explanation Test pattern Pricing different UL recognitions 2

4 UL general General info Underwriters Laboratories Inc. Abbreviation The UL Mark Formation 1894 (1894) Type Headquarters Region covered President and CEO UL Standards organization Northbrook, Illinois, United States 104 countries, 64 Labs America, Europe, Asia-Pazific, International Keith E. Williams Staff (2014) Website 3

5 UL general Mission Independent Profit orientation Develops safety standards Examines the danger of materials, components, products, machines, constructions, methods and systems UL representatives regularly examine running production for acceptance criteria FuS (Follow Up Service 4 x / Year every manufacturing location) UL acceptance of products is mostly relevant for products meant for use in the US American and Canadian markets 4

6 UL Listing Customer requirements For us as PCB manufacturer there is one crusial question: What does the customer want to have? Full recognition? Flame only recognition? What kind of MOT? What kind of flammability class? What materials / material combinations? Take care at the beginning of a customer project what the customer wants to have! Check what we have in our existing UL File and if it is necessary to start a new UL project! 5

7 UL Listing UL-labelling UL labelling of PCB s is possible if all applied materials by manufacturer is listed within manufacturer UL file number Exxxxxx the end-customer demands the UL markings If yes: Everything on the final product (PCB) including the stack up and critical manufacturing steps MUST be UL recognized Base material Solder mask material (permanent coating; Ink only used for letters, numbers or symbols doesn t need to be UL recognized BUT have to be mentioned as manufacturing step with curing temp.) Surface finishing (HAL, ENEPIG, ENIG, OSP, chem. Si, chem. Sn, ) Carbon ink Critical Manufacturing Processes (>100 C, etching, surface finish) If any of the used materials is not UL recognized it costs a lot of more money and running time! 6

8 UL-requirements Types of UL recognition for PCB s: Flame only based on requirements acc. UL 94 Full based on requirements acc. UL 796 / UL 796F 7

9 Sequence of release Timeline for flame only recognition -> approximately 2 3 months Timeline for full recognition -> approximately 5 6 months 8

10 UL-requirements Flame only Recognition There are only some tests behind done by UL for a flame only recognition Thermal shock + conditioning half samples ambient / half samples 70 for 1 week Flame Tests 9

11 UL-requirements Full Recognition Rigid board There are to do different tests by UL for a full recognition. Micro-section Analyses Add. Etching Thermal Shock Flammability Conditioning Bond Strength Add. Thermo Shock Oven Conditioning 10 Days -> OK -> pass 56 Days if 10 Day Method is not OK -> OK -> pass Delamination and Blistering Dissimilar Dielectric Materials Thermal Cycling Tests Thermal Cycling Plating Adhesion Conductive Paste Adhesion Test Silver Migration Test 1 0

12 Flame only solder limits (max. temperature, max. time) UL 94 Flame Class Example listing file PCB manufacturer: 1 1

13 Full recognition pattern limits (min. width, max area diameter, min. edge width) solder limits (max. temperature, max. time) Max. Operating Temperature UL 94 Flame Class Example: 1 2

14 Full recognition -> short explanation Cond Width -> Min = conductor size min -> Min Edge = any conductor which is within 0,4 mm clearance to the edge of the board Cond Thk = min copper height internal /external layer DSR = Direct Support Application CTI Resistance to current leakage (CTI V) Max Area Diameter = maximum unpierced conductor area diameter 1 3

15 Explanation Interpretation UL file PCB manufacturer: Data concerning (see attached example of UL board-type M ) Allowed base materials (Individual Laminate /-Bonding Sheet material) Allowed min material thicknesses Conductor thickness (= copper height) E -> external plane (min copper foil); I -> internal plane (max copper foil including copper height) PCB manufacturing process (critical like etching, surface finish, steps > 100 C, sub contractors, ) Suitable for Direct Support application (Meets UL 746 E DSR) Resistance to current leakage (CTI V) * Type UL/ ANSI Grade Individual Laminate Matl. Mfr + Grad e Min. Thk. m (mils) Base Material & Individual Bonding Sheet Matl. UL/ ANSI Grade Mfr + G r a d e Min. Thk. m (mils) Total Build- Up Thk. mm (in.) Conductor Thk.# m (mils) PWB Mfg Proc Meets U L 746E DSR CTI V (PLC) Duraver-E- Cu#104ML, ED130UV, FR402, IS402, PCL-FR- M FR-4 IS 226, PCL-FR-240, FR-4-74, FR (2.0) FR-4 IS 250 Duraver-E#104ML, (2) FR-4+++, ED-###, FR402++, E: 16.5 FR-4+++, IS402++, PCL-FRP- YES (0.65) I: , PCL-FRP-240, FR (2.6) B15 O, N (2.0) (0.015) 175 N (3) O 1 4

16 Explanation Information concerning applicable solder resists Info s concerning (see attached example about of UL board-type M ) Possible production process (Process) Ink supplier and type (Solder Resist) Curing parameters (Curing Conditions) Types Process Solder Resists@ M O, N, E, F 2, 3, 14-22, 26-30, No Manufacturer 1 Huntsman 2 Huntsman 3 Solder Resist Curing Conditions Maximum File Temperature (ºC) Maximum Time Gra Number (minutes) de Probimer 52 Hardener HZ32 Matting Agent DW91H E Probimer 65/7203 (XB7203) with Hardener 65/7204 (XB7204) or Hardener 65/7211 (XB7211) E Lackwerke Peters SD 2468NB+ E

17 Explanation Information concerning applicable production processes Example: PROCESS D: Process D 1 Internal Layers - Any etchant may be used. 2 Lamination is performed at a pressure of 440 psi max at a temperature of 365 C max, maintained for 240 min max Processing after lamination is 3 Make holes for plating-through 4 Apply etch resist 5 Etch - any etchant except chromic sulphuric 6 Remove etch resist 7 Electroplate or electroless plate contact fingers Ni/Au + 8 Apply and cure solder resist at 150 C max for 80mins max or 155 C max for 120mins max 9 Apply marking ink and UV cure to thermal cure at max. 155 C for max. 120 min. Marking ink may only be used for letter, numbers and/or symbols 10a Hot-air levelling at 290 C max for 6 s max, OR 10b Electroless Sn, OR 10c Electroless NiAu, + OR 10d OSP, Organic protective coating 11 Apply non-permanent coating and cure at max. 155 C for max. 60 min 12 No other plating operations performed and no other temperatures over 100 C (212 F) encountered + - May be performed by a multiple-site processor (See Appendix D) or by a subcontractor (See Section General). * 1 6

18 Test pattern for full-recognition Blisters & delamination (bond strength test) Dependents on Max. Operation Temperature (MOT) 10 Day Test Yes Release NO 56 Day Test Yes Release NO New Samples + Retest 1 7

19 Test-pattern for flame only Flammability class acc. to UL 94-Standard : (2 x 5 samples) 1 x thermal shock sec without tempering 1 x thermal shock sec with pre-tempering h Criterion: time from ignition to self extinguishing 1 8

20 UL labelling Correct UL-Marking includes following 3 elements according to enclosed sequence: 1. Company s Identification... AT&S 2. Printed Wiring Board Type... M (Example for Standard-Multilayer) 3. Factory Identification... LE (Example for plant Leoben) It isn t allowed to leave out one of these elements for a complete UL-Marking!!! Following additional UL-relevant Markings are possible upon customer demand: 94V-O... Flammability Classification...UL-Sign... UL-Sign for Direct Support Application E File-No for AT&S 1 9

21 Influence UL pricing Many factors influence the costs needed for a UL listing. No UL or ANSI class of base material (complete test program is required) FR.2, FR.3, FR4.0, FR4.1, CEM, CPY,.. Materials with same ANSI class usually require shorter testing (no parameter modification and consistent process) Unrecognized Material is to implement from the PCB manufacturer into an additional file (QMTS) and means add. costs! In that case the PCB manufacturer has to deliver samples from the unrecognized material once a Year to UL for testing and would have to pay for that tests. 2 0

22 Examples for UL pricing Examples for Listings The following prices are only meant as reference and do not include any special instances (higher amount of solder resist + via hole filler combinations, silver migration, long-term heat aging, relamination cycles, plugging, etc.). The prices includes the material qualification for one material. Additional materials for the same project generally cost an additional 40-60% of the new price. UL decides whether or not acceptance can be given with or without tests (on base of UL 796). Listing - solder resist with flammability tests: EUR Listing base material for SS/DS without tests: EUR Listing base material for SS/DS/ML, with tests : EUR Listing - flexible base material: EUR Listing - Rigid Flex with cavity (flex to install) EUR

23 UL Online Certificate Directory Internet Link 2 2

24 Do you have any Questions? 2 3

25 Kontakt AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Jürgen Deutschmann Supplier Quality Manager UL Coordination AT&S j.deutschmann@at.ats.net 24

26 AT&S first choice for advanced applications AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) info@ats.net