Flexible Solutions. Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June
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1 Flexible Solutions Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0)
2 Agenda Features of Flex and rigid flex PCB s How to choose the right Technology? What Materials are used? 2.5 D a special Solution for Rigid Flex 1
3 Features of flexible & rigid flexible circuits Small and light-weight Foldable to conform to a 3-D-shape Better space utilization High reliability, integrated cabling reduction of connectors High reliability during dynamic bending High degree of design freedom High shock and vibration resistance 2
4 Available Flex & Rigid flex Technologies Single Sided Flex 2.5 D Rigid Flex Double Sided Flex Rigid- Flex & HDI Rigid flex Depth Routed Rigid flex PCB >3 layer Flex 3
5 Types of flexible boards Single sided flexible board copper on one side layout covered with coverlay / soldermask copper tapping from one side holes non plated excellent buildup for dynamic bending in combination with RA-copper Insulation Layer Copper Polyimid Basematerial Adhesive Stiffener 1 Adhesive Stiffener 2 4
6 Types of flexible Boards Cross section Single Sided Board 35µm base-copper Approx. 30µm finished copper PI Coverlayer Adhesive Coverlayer Adhesive Basematerial PI Basematerial 5
7 Semiflexible boards 6
8 Types of flexible boards Double sided plated through hole flexible board copper on both sides layout covered with coverlay / soldermask copper tapping from both sides is possible holes plated through dynamic bending is not possible in the plated copper areas ED-copper Stiffener 3 Adhesive Insulation Layer Copper Polyimid Basematerial Copper Insulation Layer Adhesive Stiffener 1 Adhesive Stiffener 2 7
9 Types of flexible Boards Cross section Double Sided Board PI Coverlayer Adhesive Coverlay Adhesive Basematerial PI Basematerial Plated through hole 18µm base-copper + 20µm plating copper Via filled with Coverlay-Adhesive PI Coverlayer PI Coverlayer Adhesive Coverlay Adhesive Basematerial PI Basematerial Conductor 18µm base-copper + 20µm plating copper Adhesive Coverlay PI Coverlayer 8
10 Types of flexible boards Stiffener for single- and double- sided flexible boards partial Stiffener on top- and bottom- side are possible on each position different final thicknesses applications FR4 Stiffener ZIF connector mounting area fixing area from the pcb in the housing possible material / thickness FR4 50µm 2000µm PI 25µm 125µm PI Stiffener adhesive types FR4 Thermal set adhesive (TSA) Standard Pressure sensitive adhesive (PSA) Only when using the stiffener as solder carrier PI 20µm, 25µm, 50µm not all combinations are possible and on stock!! On the stiffener side of the flexible board a coverlay is preferred. 9
11 Double sided plated through boards Rigid Flex depth milling Biegeradius ca.4 mm bis 5 mm min.0,8 mm 10
12 Typical Build-up ( Flexible PCB ) Double side flexible PCB : 0.15T (Without Stiffener) Polyimide ( coverlay ) Adhesive ( coverlay ) Copper ( base ) + Plating Polyimide ( base ) Copper ( base ) + Plating Adhesive ( coverlay ) Polyimide ( coverlay ) 4 Layer multi flexible PCB : 0.3T Solder mask Copper ( base ) + Plating Polyimide ( base ) Adhesive ( bonding sheet ) Polyimide ( coverlay ) Adhesive ( coverlay ) Copper ( base ) + Plating Polyimide ( base ) Copper ( base ) + Plating Adhesive ( coverlay ) Polyimide ( coverlay ) Adhesive ( bonding sheet ) Polyimide ( base ) Copper ( base ) + Plating Solder mask 11
13 Typical Build-up ( Flexible PCB ) 5 Layer multi flexible PCB : 0.5T Polyimide ( coverlay ) Adhesive ( coverlay ) Copper ( base ) + Plating Polyimide ( base ) Adhesive ( bonding sheet ) Air gap Air gap Polyimide ( coverlay ) Adhesive ( coverlay ) Copper ( base ) Polyimide ( base ) Adhesive ( bonding sheet ) Air gap Air gap Polyimide ( coverlay ) Adhesive ( coverlay ) Copper ( base ) Polyimide ( base ) Adhesive ( bonding sheet ) Air gap Air gap Polyimide ( base ) Copper ( base ) Adhesive ( coverlay ) Polyimide ( coverlay ) Adhesive ( bonding sheet ) Air gap Air gap Polyimide ( base ) Copper ( base ) + Plating Adhesive ( coverlay ) Polyimide ( coverlay ) 12
14 Types of flexible Boards Double sided plated through hole rigid flexible board copper on the both outer layers layout covered with coverlay / soldermask copper tapping from both sides is valid holes plated through Possible Buildup s 1x PI and 1x FR4 1x PI and 2x FR4 Insulation Layer Copper FR4 Basematerial [Core B] No Flow Prepreg B FR4 Basematerial [Core C] Coverlayer No Flow Prepreg C Polyimid Basematerial [Core A] Copper Insulation Layer 13
![Buildup s 1x PI and 1x FR4 1x PI and 2x FR4 Insulation Layer Copper FR4 Basematerial [Core B] No Flow Prepreg B](/docs-images/43/19346508/images/page_14.jpg "FR4 Basematerial [Core C] Coverlayer No Flow Prepreg C Polyimid Basematerial [Core A] Copper Insulation Layer")
15 Types of flexible Boards Cross section Rigid Flexible Board PI Basematerial Core A Adhesive Basematerial Plated through hole 18µm base-copper + 20µm plating copper Flexible Soldermask NoFlow Prepreg C FR4 Basematerial Core C NoFlow Prepreg B FR4 Basematerial Core B Conductor 18µm base-copper + 20µm plating copper Flexible Soldermask 14
16 Materials & Build up for ML Flex PCB s 3-Layer und 4-Layer Rigid - flex 3-Layer, 4-Layer 15
17 Materials & Build up for ML Flex PCB s 6-Layer Rigid-flex 6-Layer, Airgap. 6-Layer, 2 Layer Flex no Airgap 16
18 2.5DR Rigid-flexible Samples 8 Layer PCB with 2 HDI layers PI-free build up 2 flexible layers Laser via in flexible layer Industrial application 17
19 Agenda Features of Flex and rigid flex PCB s How to choose the right Technology? What Materials are used? 2.5 D a special Solution for Rigid Flex 18
20 How to choose the right Technology Key Definition Points Layer Count Design Flex or Rigid flex Number of Drill & size Material & Build up Thickness 19
21 Agenda Features of Flex and rigid flex PCB s How to choose the right Technology? What Materials are used? 2.5 D a special Solution for Rigid Flex 20
22 Basematerial Build-up Single sided with adhesive without adhesive Double sided Single sided with adhesive Cu, ED or RA Adhesive, Acrylic or Epoxy PI Single sided without adhesive Cu, ED or RA PI with adhesive without adhesive Double sided with adhesive Cu, ED or RA Adhesive, Acrylic or Epoxy PI Adhesive, Acrylic or Epoxy Cu, ED or RA Double sided without adhesive Cu, ED or RA PI Cu, ED or RA 21
23 Basematerial Copper and Polyimid ED copper (Electro Deposited) For static application» Cheap! RA copper (Rolled Annealed) Excellent characteristic for dynamic bending Base-copper-thickness: 9µm / 12 µm / 18µm / 35µm / (70µm) PI-film thickness: 12,5 µm/ 25µm / 50µm / 75 / 125µm 22
24 Basematerial Solderability Due to the fact of physical properties of polyimide based base materials - they absorb moisture from the environment - therfore it is mandatory to implement an additional tempering process directly before soldering! AT&S suggestion for tempering process» min. 1hour at 150 C» 2 up to 3 hours at 130 C Necessary time / temperature can vary based on build-up of product! 23
25 Agenda Features of Flex and rigid flex PCB s How to choose the right Technology? What Materials are used? 2.5 D a special Solution for Rigid Flex Flexible Solutions / Hubert Haidinger / 5.June
26 Technology Platform Registered Trademark AT DC Cavity 2.5DR Rigid-Flexible 2.5D No limitations in base materials (e.g.. High Frequency, High Tg, halogen reduced, ) No limitations in shape and depth of cavity Surface finishes in cavities (e.g.. ENiG, OSP, ) Several depths can be achieved in 1 card Solder mask in cavity Fan out of assembled layer with vias Excellent reliability performance 2.5DP Pipe Lateral non-conductive connection Transport of gas through the PCB Combination of FR4 and/ or Polyimide materials No baking process prior to assembly needed for FR4 build up High miniaturization potential for Polyimide build ups Symmetrical build ups Proven reliability for Flex-to-install applications HDI Design guide lines 26
27 Standard Rigid-flex Rigid-flex on outermost layers Solder mask/ Cover lay Flexible material, PI No-flow Prepreg FR4 0,30 to 2,0 mm Solder mask 1-layer flexible 1- to 7-layers FR4 Total 8 layers Solder mask/ Cover lay Flexible material, PI Cover lay No-flow Prepreg FR4 0,30 to 2,0 mm 2-layers flexible 1- to 6-layers FR4 Total 8 layers Solder mask Special Materials Polyimide Materials hygroscopic (dimension stability, assembly!) Noflow Prepregs and cover lay cutting process Special Process Steps Pre-routing of cores limitations in stack-up and design rules Manufacturing costs Assembly process Design rules 2 7
28 Standard Rigid-flex Rigid-flex in center layers Solder mask FR4 1 to 3 Cu-Layers No-flow Prepreg/ Cover lay 50 µm Polyimide 2 x Cu No-flow Prepreg/ Cover lay FR4 1 to 3 Cu-Layers 1- to 2 flexible layers, Partial Cover lay 2- to 6 layers FR4, total 8 layers Solder mask Special Materials Polyimide Materials hygroscopic (dimension stability, assembly!) No-flow Prepregs and Cover lay cutting process Special Process Steps Pre-routing of cores limitations in stack-up and design rules Partial Cover lay handling Manufacturing costs Assembly process Design rules 2
29 2.5DR Rigid-flexible 2.5DR Rigid-Flexible Flex on outer layer(s) Flex in center layer(s) 29
30 2.5DR Rigid-flexible Stack Up BU-Layer 2 BU-Layer 1 Multilayer > 2 Layers BU-Layer 1 BU-Layer 2 Laser Cut Release Layer Lamination of PP Lamination of PP Solder mask Depth Routing Feature Value Comment Multilayer >=2 Layers BU-Layer 1 Glass cloth 106 or 1080 BU-Layer 2 PP 2 Cu 2 / Soldermask <50µm Glass cloth 106 oder 1080 or RCC-foil <50µm: Flexible Soldermask >50µm: Cover Layer Flexible Soldermask --> Polyimide-free Build No cross hatched design in flexible area Bending radius (5x Bending 180 ) > 3mm 30
31 2.5DR Rigid-flexible Advantages Developed for thin build up layers Usage of standard material (halogen-free, ) Symmetrical build up with 1 or 2 flexible layers Very thin Stack-ups possible Polyimide PI free No baking process needed (process window) No Damage of Flexible layers Increased Bending Performance No special materials Cost advantage HDI design rules remain the same (also in flexible layers) 31
32 2.5DR Rigid-flexible Samples 10 Layer PCB with 1 HDI layer PI-free build up Laser via in flexible layer Industrial application 1,6mm thickness 32
33 2.5DR Rigid-flexible Samples SM 25µm Cu 0106PP 18µm Cu 0106PP 25µm Cu 510µm FR4 Core 25µm Cu 0106PP 18µm Cu 0106PP 25µm Cu SM Flex SM 6 Layer PCB with buried vias PI-free build up 2 Flexible layers Edge plating Automotive application 33
34 2.5DR Rigid-flexible Samples 8 Layer PCB with 2 HDI layers PI-free build up 2 flexible layers Laser via in flexible layer Industrial application 34
35 2.5DR Rigid-flexible Samples 8 Layer PCB with 2 HDI layery PI-free build up Laser vias in 2 flexible layers Rigid-flex and local thickness reduction Mobile devices 35
36 2.5D - Samples 2.5DR and 2.5DC sample Flex-to-install HDI in Flexible layer Polyimide-free build up (1x1080PP) PTH in Cavity ENiG in Cavity 36
37 2.5DR Rigid-flexible 2.5DR Rigid-Flexible Flex on outer layer(s) Flex in center layer(s) 37
38 2.5DR Rigid-flexible Stack Up Flex Core Laser Cut Solder Mask Lamination PP Release layer RCC-Foil Flex Core RCC-Foil Release layer Lamination PP(s) Solder Mask Feature Value Comment Flex Core Polyimid: >=50µm FR4: 50-75µm Polyimid-free Build up Cu µm RCC- Foil 55-75µm Cu RCC 18-35µm Can be used for design PP X According Stack up Maximum 4 relaminations Maximum total thickness: 1,6mm Cu X According Design Bending radius(5x Bending Polyimid 50µm: > 2mm No dynamic bending or folding, no airgap 180 ) FR µm: > 3mm 38
39 2.5DR Rigid-flexible Flexible inner layer(s) Tailor-made solutions 100% FR4 solution in place No baking process needed Combination of PI-Core and Epoxy-Resin High potential for miniaturization 100% PI solution under development Full bending performance Symmetrical build up with Prepregs, RCC-foils HDI design rules remain the same 39
40 2.5DR Rigid-flexible Samples 10 Layer PCB with buried vias and 1 HDI PI-free build up 1,6mm thickness Automotive application 40
41 2.5DR Rigid-flexible Samples 8 Layer PCB with buried vias and 3 HDI layers 600µm thickness 220µm pad size 60µm L/S, Impedance controlled Mobile devices 41
42 UL-V0 Approval E DC 2.5DR RF1 Logo RF1 Flame only Class Flame only Panasonic R-1755M Base material Core Panasonic R-1755M Panasonic R-1650M Base material Prepreg Panasonic R-1650M Huntsman Probimer 65 Solder mask Huntsman Probimer Flexible Solder mask Taiyo PSR-4000 FLX101 >80µm Minimum remaining dielectric thickness >80µm 42
43 AT&S Well Positioned for the Future
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