Connector Launch Design Guide

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "Connector Launch Design Guide"

Transcription

1 WILD RIVER TECHNOLOGY LLC Connector Launch Design Guide For Vertical Mount RF Connectors James Bell, Director of Engineering 4/23/2014 This guide will information on a typical launch design procedure, focused on compression attached vertical RF connectors. There will also be special tips Wild River Technology has learned over several years of our own design projects.

2 Table of Contents Pre-design Activity... 2 Choosing Your RF Connectors... 2 Choosing Your Connector Launch Designer... 2 Mechanical Considerations... 4 The Launch Design Checklist... 4 PCB Landing Pad Design and Simulation... 5 Launch Verification Measurement - Optimization... 6 About Wild River Technology

3 More than ever, launch designs need to be considered once the signal groups are being allocated in the stack-up definition phase. Why? Because they are Critical to the success of the high-speed paths Easy to get wrong Prone to causing board fabrication spin cycles if the measurements don t match simulation. The following guide will help you to become more aware of what it takes to design a good high speed connector launch, and also help you decide how to best approach the effort; to do the design work in-house or to have an outside service design it for you. Although this guide is focused on designing launches for vertical connectors, most of the principles and methods apply to launch designs for any high frequency connector. Pre-design Activity Choosing Your RF Connectors The goal of any RF connector design is to eliminate or reduce reflections, maintain constant impedance, and provide a robust mechanical connection. A standard 2.92 mm connector uses a customized insulator designed to maximize signal propagation and mechanical support. While this design is electrically efficient, it enables the possibility of introducing foreign object damage (FOD) into the air line during soldering, which causes unwanted reflections. To eliminate this possibility we recommend connectors that require no soldering, like our VLF family of vertical launch 2.92mm (K) connectors. Choosing Your Connector Launch Designer If you have the talent in-house to design and optimize the connector launch to what is probably your first foyer into the frequency of interest, good for you. But, in case you need help, here are some alternatives to consider: Option 1: Design a connector launch in-house Lots of customer complexity, so start the design in your stackup definition phase or soon after. High risk, high hassle Could be very expensive if optimized over several board turns. Option 2: Contract the launch design out and evaluate yourself. Vendor will design optimized launch based on customer supplied stackup and board materials. Medium risk. Vendor is only responsible for launch design and simulation. Measurement correspondence is the customer s responsibility. 2

4 Medium hassle. Constant correspondence with contractor during correspondence testing. Cost moderate Assumes you have proper equipment and skills to validate PCB Contact WRT for more information if you want to go this route. Option 3: Full service contract for optimized launch based on supplied stackup and board materials, fabricate an evaluation board (See Figure 1) and make TDR and S-parameter measurements, including starter kit in 3D EM solver Contractor assumes all risk Moderate cost increase to customer over Option 2 Best chance for correct launch on first fabrication of your PCB design. Contact WRT for more information. Figure 1 - Typical connector launch evaluation board. Stripline structures are on opposite side. TIP: Depending on the size and complexity of your board design, you may want to create a small test and measurement board before committing your launch designs to the final board design. A small test board is normally much cheaper to fabricate than the final board, and you can also add test structures for VNA calibration and material properties measurement. Wild River designs, fabricates and/or tests these types of boards for our customers when they require our expertise. 3

5 Mechanical Considerations Although not part of the connector launch design proper, a poor connector mounting design in your PCB can have a significant effect on measurement correspondence and launch signal quality consistency. There are two potential problems to consider: Misalignment of the connector s center pin to PCB pad Connector shift due to cable torque during and after installation. Here are some recommendation: Use the smallest drill diameter practical for the mounting holes. The usual drill hole size recommended for 0-80 screws can allow the connector to mount off center. Check to see if your fabrication vendor will guarantee a maximum plating thickness and use the smallest drill size possible. We use 60 mils with +/-3 mil tolerance. If your fabrication vendor will not guarantee their maximum plating thickness, use the recommended drill size and consider using flat head screws if your board is thick enough for the countersunk holes. Use Torx screws and a torque screwdriver for consistence connector mounting results. Phillips head screws have a way of fooling the user into thinking they are applying the correct torque, but remember that the Philips screwdriver is being forced upward while you are forcing it down. Using Torx screws remedies this and gives a better surface connection as a bonus. We use 1 in-lb. of torque on each screw. WRT can provide these items. Call us for details. Figure 3 - Torx Screw Figure 2 - Torque Screwdriver The Launch Design Checklist If you take nothing else away from this guide, let it be that you need to create a checklist of the materials and other information each connector launch design will need, be it for your internal 3D EM design engineer or for your outside design service. Here is what WRT requires for our launch design service: Connector Part Number, mechanical data, and s-parameter model 4

6 Stackup data (material, number of layers, etc.) Launch transition layer Frequency bandwidth Transmission line type: Microstrip, Stripline or Grounded Coplanar Waveguide (GCPW) Transmission line dimensions: - Customer supplied or provided by PCB fabrication vendor stack-up? - Optional: For MS transmission line, design frequency to calculate line width (e.g. dispersion effects) Specification sheet for substrate materials and provide dielectric constant (for some materials it isn't clear what the Dk is) Fabrication vendor capabilities (Smallest via size allowed, minimum copper feature gap, etc.) Words of Wisdom from an Experienced 3D EM Designer It typically takes xx hours to get the information, potential clarification, transmission line synthesis, simulation setup, optimization, CAD file and report. If you change the thickness or dielectric constant, it more or less takes the same amount of time to redo it. If the new file was quite similar to an existing file, it might take an hour less... But in my experience, that hasn't happened very often. The takeaway is, make sure your checklist is complete and accurate before submitting it to the 3D EM designer. PCB Landing Pad Design and Simulation PCB footprints should be designed to match an RF connector to a specific PCB stackup. The characteristics of the vertical launch connector that need to be considered are found in the connector mechanical document. The mechanical dimensions for the bottom center pin and ground ring for two types of connectors are shown below. 5

7 Figure 4 Typical 2.92mm vertical mount connector footprint. WRT part VLF-K+ shown Figure 5 - Typical SMA vertical mount connector footprint. WRT part VLF-KS shown. The characteristics of a printed circuit board that need to be considered for proper matching in a vertical launch are 1. Dielectric constant and thickness of prepreg and core layers (S1 and S2) 2. Signal pad diameter (D) 3. Top signal pad to ground fill gap width (G) 4. Signal transition via diameter 5. Copper thickness (T1, T2) 6. Top and bottom layer plating and masking 7. Plane void diameter(s). 8. Grounded guard vias - how many and their distance from the signal transition via. Modification to the items listed above to maintain 50 ohms impedance and minimized reflections can be modeled and analyzed in electromagnetic simulation software. Launch Verification Measurement - Optimization Attention should be paid to the correlation between theoretical performance of a simulation and measured performance of a finished product. The difference between an accurately matched connector and footprint and one that has not been optimized can be pronounced, especially at high frequencies. A paper that describes an approach to simulation to measurement correspondence can be found on Wild River Technology s web site in our Papers collection. DesignCon 2004 paper: A Hybrid Measurement and Electromagnetic Field Solver Approach for the Design of High-Performance Interconnects: An Investigation of Traces and SMA Transitions by Scott McMorrow and Alfred Neves 6

8 Abstract: As the cost of bringing complex high-performance systems to market increases and the time to market decreases, new methods must be used to insure first-pass design success. This paper describes a verifiable design method that establishes excellent signal integrity and enables leading-edge performance with common off-the-shelf materials. By integrating field solver and measurement-based modeling methods, the net process is verifiable. The optimum low-cost production design can be attained in the shortest time. This process yields unmatched time-domain and frequency-domain performance using off-the-shelf, generic, non-esoteric, low-cost materials. 7

9 About Wild River Technology Sandy River, Oregon Need help? Wild River Technology can provide Connector launch design Launch evaluation PCB design VNA training. Contact us for details. Office Mobile Wild River Technology markets products and services for the high-speed Signal Integrity practitioner an individual who addresses challenges in modeling interconnects, making better measurements, and solving signal integrity issues to 32 Gbpsec data rates and beyond. Our products and consulting are born over many years of working in high-speed design environments, and are adopted by much of the measurement community for improving measurements, characterizing SERDES, and optimizing communications channels all designed to elevate SI practices and methodology. 8

FIGURE 1, CROSS SECTION OF A PLATED THROUGH HOLE OR VIA.

FIGURE 1, CROSS SECTION OF A PLATED THROUGH HOLE OR VIA. ANATOMY OF A PLATED THROUGH HOLE LEE RITCHEY AUGUST 30, 2001 INTRODUCTION This document examines the way a plated through hole is formed in a PCB. The discussion holds whether the hole is used by a signal

More information

PCB design Support for Coaxial connector

PCB design Support for Coaxial connector RF-14547-02 PCB design Support for Coaxial connector Oct 2015 Hirose Electric Co., Ltd. 1 Outline Introduction Mechanical performance Products Specifications Electrical performance PCB design considerations

More information

Hardware Design Considerations for MCR20A IEEE Devices

Hardware Design Considerations for MCR20A IEEE Devices Freescale Semiconductor Application Note Document Number: AN5003 Rev. 0, 07/2015 Hardware Design Considerations for MCR20A IEEE 802.15.4 Devices 1 Introduction This application note describes Printed Circuit

More information

Connectivity in a Wireless World. Cables Connectors 2014. A Special Supplement to

Connectivity in a Wireless World. Cables Connectors 2014. A Special Supplement to Connectivity in a Wireless World Cables Connectors 204 A Special Supplement to Signal Launch Methods for RF/Microwave PCBs John Coonrod Rogers Corp., Chandler, AZ COAX CABLE MICROSTRIP TRANSMISSION LINE

More information

High Frequency PCB Probing with Fixture Removal for Multi- Port Devices

High Frequency PCB Probing with Fixture Removal for Multi- Port Devices High Frequency with Fixture Removal for Multi- Port Devices By Heidi Barnes, Jose Moreira, Mike Resso, and Robert Schaefer We will explore how to provide robust high frequency multi-port measurements of

More information

CXP BOARD ROUTING RECOMMENDATIONS

CXP BOARD ROUTING RECOMMENDATIONS TABLE OF CONTENTS 1.0 SCOPE 2.0 PC BOARD REQUIREMENTS 2.1 MATERIAL THICKNESS 2.2 TOLERANCE 2.3 HOLE DIMENSIONS 2.4 LAYOUT 3.0 HIGHSPEED ROUTING 3.1 GENERAL ROUTING EXAMPLE 3.2 HIGH-SPEED TRANSMISSION LINE

More information

How to make a Quick Turn PCB that modern RF parts will actually fit on!

How to make a Quick Turn PCB that modern RF parts will actually fit on! How to make a Quick Turn PCB that modern RF parts will actually fit on! By: Steve Hageman www.analoghome.com I like to use those low cost, no frills or Bare Bones [1] type of PCB for prototyping as they

More information

Design for Speed: A Designer s Survival Guide to Signal Integrity. Overview

Design for Speed: A Designer s Survival Guide to Signal Integrity. Overview Slide -1 Design for Speed: A Designer s Survival Guide to Signal Integrity Introducing the Ten Habits of Highly Successful Board Designers with Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises,

More information

Do's and Don'ts for PCB Layer Stack-up. By Pragnesh Patel & Ronak Shah

Do's and Don'ts for PCB Layer Stack-up. By Pragnesh Patel & Ronak Shah Do's and Don'ts for PCB Layer Stack-up By Pragnesh Patel & Ronak Shah 1. Introduction Each day the electronic gadgets complexity increases with the miniaturization requirements, boards are becoming much

More information

HOLE PLATING COPPER FOIL ANNULAR RING. Figure 1 A Section Through a Plated Through Hole in a PCB

HOLE PLATING COPPER FOIL ANNULAR RING. Figure 1 A Section Through a Plated Through Hole in a PCB FAQ #5 For Current Source Newsletter #7 Why Not Route Two Traces Between Pins on a 1 mm Pitch BGA? There are applications notes that describe how to save layers in a PCB by routing two traces between pins

More information

Choosing the Dielectric Material for a V93000 DUT Loadboard

Choosing the Dielectric Material for a V93000 DUT Loadboard Jose Moreira and Heidi Barnes Verigy jose.moreira@verigy.com heidi.barnes@verigy.com Abstract This application note discusses the influence of the dielectric material choice on the performance of DUT loadboards

More information

Hybrid PCB Stack-up. Optimization of PCB Cost and Loss Performance. Intel Corporation. Data Center Platform Application Engineering.

Hybrid PCB Stack-up. Optimization of PCB Cost and Loss Performance. Intel Corporation. Data Center Platform Application Engineering. Hybrid PCB Stack-up Optimization of PCB Cost and Loss Performance Intel Corporation Data Center Platform Application Engineering April 2014 Reference Number: 330559-001 Introduction Signal attenuation

More information

The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates

The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates The Performance Leader in Microwave Connectors The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates Thin Substrate: 8 mil Rogers R04003 Substrate Thick Substrate: 30 mil Rogers

More information

Application Note: PCB Design By: Wei-Lung Ho

Application Note: PCB Design By: Wei-Lung Ho Application Note: PCB Design By: Wei-Lung Ho Introduction: A printed circuit board (PCB) electrically connects circuit components by routing conductive traces to conductive pads designed for specific components

More information

IT STARTS WITH THE DESIGN: THE CHALLENGE: THE PROBLEM: Page 1

IT STARTS WITH THE DESIGN: THE CHALLENGE: THE PROBLEM: Page 1 High Performance Multilayer PCBs Design and Manufacturability Judy Warner, Transline Technology Chris Savalia, Transline Technology Michael Ingham, Spectrum Integrity IT STARTS WITH THE DESIGN: Multilayer

More information

Primer of investigation of 90- degree, 45-degree and arched bends in differential line

Primer of investigation of 90- degree, 45-degree and arched bends in differential line Simbeor Application Note #2009_02, April 2009 2009 Simberian Inc. Primer of investigation of 90- degree, 45-degree and arched bends in differential line Simberian, Inc. www.simberian.com Simbeor : Easy-to-Use,

More information

IIB. Complete PCB Design Using OrCAD Capture and PCB Editor. Kraig Mitzner. ~»* ' AMSTERDAM BOSTON HEIDELBERG LONDON ^ i H

IIB. Complete PCB Design Using OrCAD Capture and PCB Editor. Kraig Mitzner. ~»* ' AMSTERDAM BOSTON HEIDELBERG LONDON ^ i H Complete PCB Design Using OrCAD Capture and PCB Editor Kraig Mitzner IIB ~»* ' AMSTERDAM BOSTON HEIDELBERG LONDON ^ i H NEW YORK * OXFORD PARIS SAN DIEGO ШШЯтИ' ELSEVIER SAN FRANCISCO SINGAPORE SYDNEY

More information

Agilent Improved Method for Characterizing and Modeling Gigabit Flex-Circuit Based Interconnects. White Paper

Agilent Improved Method for Characterizing and Modeling Gigabit Flex-Circuit Based Interconnects. White Paper Agilent Improved Method for Characterizing and Modeling Gigabit Flex-Circuit Based Interconnects White Paper Improved Method for Characterizing and Modeling Gigabit Flex-Circuit Based Interconnects Eric

More information

Modeling Physical Interconnects (Part 3)

Modeling Physical Interconnects (Part 3) Modeling Physical Interconnects (Part 3) Dr. José Ernesto Rayas Sánchez 1 Outline Vias Vias in PCBs Types of vias in PCBs Pad and antipad Nonfunctional pads Modeling vias Calculating circuit element values

More information

Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package

Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package Ozgur Misman, Mike DeVita, Nozad Karim, Amkor Technology, AZ, USA 1900 S. Price Rd, Chandler,

More information

Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains

Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains Glenn Oliver and Deepu Nair DuPont Jim Nadolny Samtec, Inc. glenn.e.oliver@dupont.com jim.nadolny@samtec.com

More information

How is a PCB made? What determines impedance? John Steinar Johnsen ( Josse ) Sept 2009

How is a PCB made? What determines impedance? John Steinar Johnsen ( Josse ) Sept 2009 How is a PCB made? What determines impedance? John Steinar Johnsen ( Josse ) Sept 2009 Vi kan se hvor Bugatti har hentet inspirasjon fra Denne forsøkte å stikke av, men jeg hang meg på. JossePhoto Manufacturing

More information

Balancing the Electrical and Mechanical Requirements of Flexible Circuits. Mark Finstad, Applications Engineering Manager, Minco

Balancing the Electrical and Mechanical Requirements of Flexible Circuits. Mark Finstad, Applications Engineering Manager, Minco Balancing the Electrical and Mechanical Requirements of Flexible Circuits Mark Finstad, Applications Engineering Manager, Minco Table of Contents Abstract...............................................................................................

More information

Printed Circuit Board Guidelines

Printed Circuit Board Guidelines Printed Circuit Board Guidelines Introduction : The Poly-Grames research center has the ability to manufacture printed circuits on all types of microwave substrates. Our present fabrication capabilities

More information

AN4619 Application note

AN4619 Application note Application note STLC2690 PCB layout guideline Introduction This application note provides a guideline for PCB implementation of the STCL2690 in a typical mobile handset. This guideline is essential to

More information

Test Structures Needed for Multilayer PCBs

Test Structures Needed for Multilayer PCBs Feature Article #2 for fall 2004 newsletter Test Structures Needed for Multilayer PCBs Why Test Structures? As the number of layers in multilayer PCBs grow and the size of features become smaller and denser,

More information

Digital Systems PCB Layer Stacking CMPE 650

Digital Systems PCB Layer Stacking CMPE 650 Layer Stack Guidelines Layer stack defines: The ordering of the signal, power and GND layers The dielectric constant of the substrate The spacing between layers Optionally, the trace dimensions and minimum

More information

Board Mount Connector Footprint Design Process

Board Mount Connector Footprint Design Process Board Mount Connector Footprint Design Process STEP 1: Connector Selection Series Force to Engage (Max) Max SB LD FD Freq. SMP 2.0 lbs 10 lbs 15 lbs 40 GHz SMPM 3.5 lbs N/A 8.0 lbs 65 GHz SMPS 3.0 lbs

More information

Predictability for PCB Layout Density

Predictability for PCB Layout Density Predictability for PCB Layout Density Ruth Kastner and Eliahu Moshe, Adcom Ltd., ISRAEL Abstract The trend towards increasingly complex designs with smaller physical sizes has been translated into ever-increasing

More information

Tips for PCB Vias Design

Tips for PCB Vias Design Tips for PCB Vias Design Terms of using this article This article is primarily for internal use in Quick teck PCB design department. Now we decided to open it up publicly. We try to ensure the information

More information

PCB Layer Stack-up. Albert Schweitzer Fine Line Gesellschaft für Leiterplattentechnik mbh Itterpark 4, D Hilden Vers. 1.

PCB Layer Stack-up. Albert Schweitzer Fine Line Gesellschaft für Leiterplattentechnik mbh Itterpark 4, D Hilden Vers. 1. PCB Layer Stack-up Technical Workshop 16. / 17. September 2015 Hilden, Germany Albert Schweitzer Fine Line Gesellschaft für Leiterplattentechnik mbh Itterpark 4, D-40724 Hilden 15.09.2015 Vers. 1.2 Introduction

More information

The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007

The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 Successful designs are soon forgotten but failures are remembered for years. Steering clear of these twelve

More information

Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces

Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces Time and Frequency Domain Analysis for Right Angle Corners on Printed Circuit Board Traces Mark I. Montrose Montrose Compliance Services 2353 Mission Glen Dr. Santa Clara, CA 95051-1214 Abstract: For years,

More information

PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing

PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing AN-528-1.1 Application Note Differential Signaling As data rates increase, designers are increasingly moving away

More information

Agilent Stripline TRL Calibration Fixtures for 10-Gigabit Interconnect Analysis. White Paper

Agilent Stripline TRL Calibration Fixtures for 10-Gigabit Interconnect Analysis. White Paper Agilent Stripline TRL Calibration Fixtures for 10-Gigabit Interconnect Analysis White Paper Contents Introduction...3 Why Calibrate?...4 Linear 2-Port Network Analyzer Measurements...5 VNA Measurement

More information

Extending Rigid-Flex Printed Circuits to RF Frequencies

Extending Rigid-Flex Printed Circuits to RF Frequencies Extending -Flex Printed Circuits to RF Frequencies Robert Larmouth Teledyne Electronic Technologies 110 Lowell Rd., Hudson, NH 03051 (603) 889-6191 Gerald Schaffner Schaffner Consulting 10325 Caminito

More information

Paricon Technologies

Paricon Technologies Paricon Technologies Flex connector Measurement Results prepared by Gert Hohenwarter 1/24/07 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...

More information

M. Jämsä 6.4.2011 PCB COST REDUCTIONS

M. Jämsä 6.4.2011 PCB COST REDUCTIONS M. Jämsä 6.4.2011 PCB COST REDUCTIONS There is an old joke about Commodity Manager of PCB (Printed Circuit Board) having one brain cell only, either occupied by the idea of price reduction or by the idea

More information

Mini Coax connector system general information Technical characteristics Transmission characteristics

Mini Coax connector system general information Technical characteristics Transmission characteristics Directory chapter 10 modules (press-fit) Page connector system general information...................... 10.02 Technical characteristics.......................................... 10.04 Transmission characteristics.......................................

More information

SMA Connectors. RF Coax Connectors. Product Facts

SMA Connectors. RF Coax Connectors. Product Facts SMA Connectors Product Facts Performance to 12.4 GHz and beyond Available in various base metal options, including stainless steel, brass and zinc diecast Uses industry standard crimp tools and processes

More information

HARDWARE DESIGN FUNDAMENTALS. George Hadley 2016, Images Property of their Respective Owners.

HARDWARE DESIGN FUNDAMENTALS. George Hadley 2016, Images Property of their Respective Owners. HARDWARE DESIGN FUNDAMENTALS George Hadley 2016, Images Property of their Respective Owners. OUTLINE PCB Design Objective PCB Manufacturing Process Design Automation Tools The Design Process Parts Schematics

More information

PRACTICAL RF PRINTED CIRCUIT BOARD DESIGN

PRACTICAL RF PRINTED CIRCUIT BOARD DESIGN PRACTICAL RF PRINTED CIRCUIT BOARD DESIGN Geoff Smithson. Overview The electrical characteristics of the printed circuit board (PCB) used to physically mount and connect the circuit components in a high

More information

Using Flex in High-Speed Applications

Using Flex in High-Speed Applications feature Figure 1: An automotive flex circuit designed to fit into a tight form factor. Using Flex in High-Speed Applications by Glenn Oliver DuPont Electronics and Communications Copper clad circuits in

More information

Designing with High-Density BGA Packages for Altera Devices

Designing with High-Density BGA Packages for Altera Devices 2014.12.15 Designing with High-Density BGA Packages for Altera Devices AN-114 Subscribe As programmable logic devices (PLDs) increase in density and I/O pins, the demand for small packages and diverse

More information

Bandpass Filter Embedded SwP (System with Probe) for High-Frequency Application

Bandpass Filter Embedded SwP (System with Probe) for High-Frequency Application Bandpass Filter Embedded SwP (System with Probe) for High-Frequency Application Keiji Matsumoto, Ryota Saito, Woon Choi and Hajime Tomokage Department of Electronics Engineering and Computer Science, Fukuoka

More information

Simulations in Guiding Gpbs PCB Design of Communication Systems

Simulations in Guiding Gpbs PCB Design of Communication Systems Abstract Simulations in Guiding Gpbs PCB Design of Communication Systems Zhen Mu Sycamore Networks Inc. 150 Apollo Dr., Chelmsford, MA 01824 USA This paper describes how to effectively use CAD tools for

More information

PCIE 16X CONNECTOR BOARD ROUTING RECOMMENDATIONS TABLE OF CONTENTS

PCIE 16X CONNECTOR BOARD ROUTING RECOMMENDATIONS TABLE OF CONTENTS TABLE OF CONTENTS 1.0 SCOPE 2.0 PC BOARD REQUIREMENTS 2.1 MATERIAL THICKNESS 2.2 TOLERANCE 2.3 HOLE DIMENSIONS 2.4 LAYOUT 3.0 HIGHSPEED ROUTING 3.1 GENERAL ROUTING EXAMPLE 3.2 HIGH-SPEED TRANSMISSION LINE

More information

High-Performance 75 Ohm BNC HDTV Interface: Measuring VSWR and Return Loss Up to 6 GHz

High-Performance 75 Ohm BNC HDTV Interface: Measuring VSWR and Return Loss Up to 6 GHz High-Performance 75 Ohm BNC HDTV Interface: Measuring VSWR and Return Loss Up to 6 GHz Introduction Charles Populaire, PhD Radiall With the introduction of high-definition video signals operating at data

More information

High Speed Characterization Report

High Speed Characterization Report ECUE-E-12-XXX-T1-P2 Mated with: UEC5-019-1-H-D-RA-1-A Description: FireFly Equalized Micro Flyover System, 36 AWG Micro Twinax Ribbon Cable Samtec, Inc. 2005 All Rights Reserved Table of Contents Cable

More information

Printed Circuit Boards

Printed Circuit Boards Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the

More information

Keysight Technologies Signal Integrity Analysis Series

Keysight Technologies Signal Integrity Analysis Series Keysight Technologies Signal Integrity Analysis Series Part 1: Single-Port TDR, TDR/TDT, and 2-Port TDR Application Note Introduction Interconnect Analysis is Simplified with Physical Layer Test Tools

More information

CAPABILITIES Specifications Vary By Manufacturing Locations

CAPABILITIES Specifications Vary By Manufacturing Locations Revised June 2011 Toll Free: 1-800-979-4PCB (4722) www.4pcb.com sales@4pcb.com Material FR4 RoHS RF Materials CAPABILITIES Specifications Vary By Manufacturing Locations Number of Conductive Layers Standard

More information

Simulation and Design Route Development for ADEPT-SiP

Simulation and Design Route Development for ADEPT-SiP Simulation and Design Route Development for ADEPT-SiP Alaa Abunjaileh, Peng Wong and Ian Hunter The Institute of Microwaves and Photonics School of Electronic and Electrical Engineering The University

More information

IMAPS 2001 International Symposium on Microelectronics. RF Characterisation of No-clean Solder Flux Residues

IMAPS 2001 International Symposium on Microelectronics. RF Characterisation of No-clean Solder Flux Residues RF Characterisation of No-clean Solder Flux Residues Maeve Duffy +, Liam Floyd, Paul McCloskey +, Cian Ó Mathúna, NMRC, Ireland Karen Tellefsen, Mike Liberatore, A. Sreeram, Alpha Metals, Central Research

More information

Prototyping Printed Circuit Boards

Prototyping Printed Circuit Boards Prototyping Printed Circuit Boards From concept to prototype to production. (HBRC) PCB Design and Fabrication Agenda Introduction Why PCBs? Stage 1 Understanding the rules Stage 2 Planning the board. Stage

More information

Printed Circuit Boards: Layout Design

Printed Circuit Boards: Layout Design Printed Circuit Boards: Layout Design Review: Process Summary Manufacturing Constraints Gerber Schematic Board Manufacture Excellon Drill This is art! Ensure that the schematic is accurate. Run the ERC

More information

Bending, Forming and Flexing Printed Circuits

Bending, Forming and Flexing Printed Circuits Bending, Forming and Flexing Printed Circuits John Coonrod Rogers Corporation Introduction: In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed

More information

Managing Connector and Cable Assembly Performance for USB SuperSpeed

Managing Connector and Cable Assembly Performance for USB SuperSpeed Whitepaper Managing Connector and Cable Assembly Performance for USB SuperSpeed Revision 1.0 February 1, 2013 Abstract USB 3.0 connector and cable assembly performance can have a significant impact on

More information

AN PCB layout guidelines for NXP MCUs in BGA packages. Document information. Keywords

AN PCB layout guidelines for NXP MCUs in BGA packages. Document information. Keywords Rev. 2 15 April 2011 Application note Document information Info Keywords Abstract Content LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220,

More information

Moving Higher Data Rate Serial Links into Production Issues & Solutions. Session 8-FR1

Moving Higher Data Rate Serial Links into Production Issues & Solutions. Session 8-FR1 Moving Higher Data Rate Serial Links into Production Issues & Solutions Session 8-FR1 About the Authors Donald Telian is an independent Signal Integrity Consultant. Building on over 25 years of SI experience

More information

ASSEMBLY, INSTALLATION, AND REMOVAL OF CONTACTS AND MODULES

ASSEMBLY, INSTALLATION, AND REMOVAL OF CONTACTS AND MODULES ASSEMBLY, INSTALLATION, AND REMOVAL OF CONTACTS AND MODULES FOR 50 OHM COAXIAL CONTACTS AND MODULES TABLE OF CONTENTS SECTION 1 RECEIVER CONTACT ASSEMBLY INSTRUCTIONS SECTION 2 ITA CONTACT ASSEMBLY INSTRUCTIONS

More information

Comparison of Vector Network Analyzer and TDA Systems IConnect Generated S-Parameters

Comparison of Vector Network Analyzer and TDA Systems IConnect Generated S-Parameters Comparison of Vector Network Analyzer and TDA Systems IConnect Generated S-Parameters Purpose: This technical note presents single-ended insertion loss ( SE IL) and return loss ( SE RL) data generated

More information

Printed Omni Directional Wi-Fi Antenna for 5.6 GHz Dragoslav Dobričić, YU1AW

Printed Omni Directional Wi-Fi Antenna for 5.6 GHz Dragoslav Dobričić, YU1AW Printed Omni Directional Wi-Fi Antenna for 5.6 GHz Dragoslav Dobričić, YU1AW dragan@antennex.com Why printed antenna? Building antenna on SHF is associated with problems of manufacturing its parts with

More information

RFTECHNOLOGY. European Microwave Week Conference Preview and Technical Program Highlights INSIDE THIS ISSUE: DESIGN NEWS RF FUNDAMENTALS

RFTECHNOLOGY. European Microwave Week Conference Preview and Technical Program Highlights INSIDE THIS ISSUE: DESIGN NEWS RF FUNDAMENTALS RFTECHNOLOGY I N T E R N A T I O N A L www.rfti.com A worldwide forum for engineering ideas and information September 2012 INSIDE THIS ISSUE: European Microwave Week Conference Preview and Technical Program

More information

Utilizing Time Domain (TDR) Test Methods For Maximizing Microwave Board Performance

Utilizing Time Domain (TDR) Test Methods For Maximizing Microwave Board Performance The Performance Leader in Microwave Connectors Utilizing Time Domain (TDR) Test Methods For Maximizing Microwave Board Performance.050 *.040 c S11 Re REF 0.0 Units 10.0 m units/.030.020.010 1.0 -.010 -.020

More information

Cinch Connectivity Solutions. High Frequency End Launch Connectors

Cinch Connectivity Solutions. High Frequency End Launch Connectors Cinch Connectivity Solutions High Frequency End Launch Connectors Applications High Frequency SMA End Launch Connectors For Microwave PC Board Substrates The Johnson Patent Pending High Frequency End Launch

More information

EM Noise Mitigation in Circuit Boards and Cavities

EM Noise Mitigation in Circuit Boards and Cavities EM Noise Mitigation in Circuit Boards and Cavities Faculty (UMD): Omar M. Ramahi, Neil Goldsman and John Rodgers Visiting Professors (Finland): Fad Seydou Graduate Students (UMD): Xin Wu, Lin Li, Baharak

More information

PCB Design and Layout Melissa Hamada Sunday, November 23rd, 2014

PCB Design and Layout Melissa Hamada Sunday, November 23rd, 2014 PCB Design and Layout Melissa Hamada msh276@cornell.edu Sunday, November 23rd, 2014 High level description Basic definitions Schematic and layout tips Choosing components Companies for manufacturing and

More information

Ultra Reliable Embedded Computing

Ultra Reliable Embedded Computing A VersaLogic Focus on Reliability White Paper Ultra Reliable Embedded Computing The Clash between IPC Class 3 Requirements and Shrinking Geometries Contents Introduction...1 Case in Point: IPC Class 3

More information

EIA/JEDEC STANDARD. High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. JESD51-7

EIA/JEDEC STANDARD. High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. JESD51-7 EIA/JEDEC STANDARD High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-7 http://www.resheji.com FEBRUARY 1999 ELECTRONIC INDUSTRIES ALLIANCE JEDEC Solid State Technology

More information

BGA Socket Considerations - Prototype to Reality

BGA Socket Considerations - Prototype to Reality BGA Socket Considerations - Prototype to Reality Background For many products designed with today s high-performance integrated circuits, BGA socketing systems are an essential option during the design,

More information

Printed Circuit Boards. EELE 461/561 Digital System Design. Module #4 Interconnect Construction (Printed Circuit Boards) Printed Circuit Boards

Printed Circuit Boards. EELE 461/561 Digital System Design. Module #4 Interconnect Construction (Printed Circuit Boards) Printed Circuit Boards Topics EELE 461/561 Digital System Design Module #4 Interconnect Construction (Printed Circuit Boards) 1. Printed Circuit Board Construction 2. Printed Circuit Board Design Textbook Reading Assignments

More information

Low Power RF Designs Layout Review Techniques. Suyash Jain FAE Training Oslo January 2011

Low Power RF Designs Layout Review Techniques. Suyash Jain FAE Training Oslo January 2011 Low Power RF Designs Layout Review Techniques Suyash Jain FAE Training Oslo January 2011 1 Abstract The presentation provides guidelines and a checklist to copy TI reference designs for optimum performance.

More information

Webinar HDI Microvia Technology Cost Aspects

Webinar HDI Microvia Technology Cost Aspects Webinar HDI Microvia Technology Cost Aspects www.we-online.com HDI - Cost Aspects Seite 1 1 July, 2014 Agenda - Webinar HDI Microvia Technology Cost Aspects Reasons for the use of HDI technology Printed

More information

Field Replaceable. Flange Mount. Cable Connector. Cable Connectors (Features & Benefits)... 67. Field Replaceable... 68. Cable Connectors...

Field Replaceable. Flange Mount. Cable Connector. Cable Connectors (Features & Benefits)... 67. Field Replaceable... 68. Cable Connectors... Standard Flange Mount Termination Connector Miniature Flange Mount Termination Field Replaceable Flange Mount Connector Field Replaceable Connector End Index... Page (Features & Benefits)... 67 Field Replaceable...

More information

2000 Mixed-Signal Products SLLA014A

2000 Mixed-Signal Products SLLA014A Design Notes 2000 Mixed-Signal Products SLLA014A IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service

More information

SLOW-WAVE STRUCTURES

SLOW-WAVE STRUCTURES inside track with MERCURY COMPUTER SYSTEMS p.32 IAN DUNN DESIGNING SYNTHESIZERS with UNCONVENTIONAL PLLs V out The Old and the new at IMS + p.86 pp.38, 58 th Anniversary may 11 Trusted engineering resource

More information

Eatman Associates 2014 Rockwall TX 800-388-4036 rev. October 1, 2014. Striplines and Microstrips (PCB Transmission Lines)

Eatman Associates 2014 Rockwall TX 800-388-4036 rev. October 1, 2014. Striplines and Microstrips (PCB Transmission Lines) Eatman Associates 2014 Rockwall TX 800-388-4036 rev. October 1, 2014 Striplines and Microstrips (PCB Transmission Lines) Disclaimer: This presentation is merely a compilation of information from public

More information

USB 3.0 INTERNAL CONNECTOR AND CABLE SPECIFICATION

USB 3.0 INTERNAL CONNECTOR AND CABLE SPECIFICATION USB 3.0 INTERNAL CONNECTOR AND CABLE SPECIFICATION Revision 1.0 August 20, 2010 2007-2010 Intel Corporation All rights reserved. Legal Disclaimers THIS SPECIFICATION IS PROVIDED AS IS WITH NO WARRANTIES

More information

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road

More information

PCB Design Guidelines for LVDS Technology

PCB Design Guidelines for LVDS Technology PCB Design Guidelines for LVDS Technology INTRODUCTION Technology advances has generated devices operating at clock speeds exceeding 100 MHz With higher clock rates and pico seconds edge rate devices PCB

More information

PCB Design Tools. Orcad (Cadence) Allegro (Cadence) Eagle (Cadsoft) P-CAD (Altium)

PCB Design Tools. Orcad (Cadence) Allegro (Cadence) Eagle (Cadsoft) P-CAD (Altium) What Is PCB? A PCB is a printed circuit board, also known as a printed wiring board. It is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic

More information

Surface Finishes for High-Speed PCBs

Surface Finishes for High-Speed PCBs column BEYOND DESIGN Surface Finishes for High-Speed PCBs by Barry Olney The Nickel Doesn t Make Cents! PCB surface finishes vary in type, price, availability, shelf life, assembly process and reliability.

More information

Transmission Line Transitions

Transmission Line Transitions 4 Transmission Line Transitions Transmission line transitions are required in nearly every microwave subsystem and component. A transition is an interconnection between two different transmission lines

More information

SIM800H&L-TE_Schematic and PCB_Reference Design_V1.00

SIM800H&L-TE_Schematic and PCB_Reference Design_V1.00 SIM800H&L-TE_Schematic and PCB_Reference Design_V1.00 Document Title SIM800H&L-TE_Schematic and PCB_ Reference Design Version 1.00 Date 2013-10-14 Status Document Control ID Release SIM800H&L-TE_Schematic

More information

2003; Bayatmaku et al., 2011; Chawla & Khanna, 2012).

2003; Bayatmaku et al., 2011; Chawla & Khanna, 2012). J.Natn.Sci.Foundation Sri Lanka 2014 42 (3): DOI: http://dx.doi.org/10.4038/jnsfsr.v42i3.7403 * Department of Electronics and Communication Engineering, Thapar University, Patiala, Punjab, India. In this

More information

Making Sense of Laminate Dielectric Properties By Michael J. Gay and Richard Pangier Isola Group December 1, 2008

Making Sense of Laminate Dielectric Properties By Michael J. Gay and Richard Pangier Isola Group December 1, 2008 Making Sense of Laminate Dielectric Properties By Michael J. Gay and Richard Pangier Isola Group December 1, 2008 Abstract System operating speeds continue to increase as a function of the consumer demand

More information

Automated Contact Resistance Tester CR-2601

Automated Contact Resistance Tester CR-2601 Automated Contact Resistance Tester CR-2601 What s New What s New Summary of Hardware Improvements: The middle Stiffener has been improved and no longer comes in direct contact with the main board thus

More information

Ultra Compact Chip Antenna Data Guide

Ultra Compact Chip Antenna Data Guide Ultra Compact Chip Antenna Data Guide Table of Contents 1 Description 1 Features 2 Applications 2 Ordering Information 2 Electrical Specifications 3 Footprints 3 Pin Configuration 4 Theory of Operation

More information

Top View (Near-side) Side View Bottom View (Far-side) ± ±.08. 4x.28. Orientation Marker Balanced port 1.

Top View (Near-side) Side View Bottom View (Far-side) ± ±.08. 4x.28. Orientation Marker Balanced port 1. Model BD2FA Ultra Low Profile 168 Balun Ω to Ω Balanced Description The BD2FA is a low profile sub-miniature balanced to unbalanced transformer designed for differential input locations on data conversion

More information

PCB Board Design. PCB boards. What is a PCB board

PCB Board Design. PCB boards. What is a PCB board PCB Board Design Babak Kia Adjunct Professor Boston University College of Engineering Email: bkia -at- bu.edu ENG SC757 - Advanced Microprocessor Design PCB boards What is a PCB board Printed Circuit Boards

More information

Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications

Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications The MPI Material Advantage Advantages: High-Density - Scalable Pitches down to 0,8 mm pitch possible - Scalable

More information

[INTRODUCTION TO PCB ARTIST]

[INTRODUCTION TO PCB ARTIST] 2013 ECE 480 Design Team 3 Justin Bohr [INTRODUCTION TO PCB ARTIST] This document will provide a guide of how to create relatively simple printed circuit board (PCB) with the PCB Artist tool. An overview

More information

Practical PCB design techniques for wireless ICs Controlled impedance layout 100Ω balanced transmission lines

Practical PCB design techniques for wireless ICs Controlled impedance layout 100Ω balanced transmission lines APPLICATION NOTE Atmel AT02865: RF Layout with Microstrip Atmel Wireless Features Practical PCB design techniques for wireless ICs Controlled impedance layout 50Ω unbalanced transmission lines 100Ω balanced

More information

APPLICATION NOTE. AT09567: ISM Band PCB Antenna Reference Design. Atmel Wireless. Features. Description

APPLICATION NOTE. AT09567: ISM Band PCB Antenna Reference Design. Atmel Wireless. Features. Description APPLICATION NOTE Features AT09567: ISM Band PCB Antenna Reference Design Atmel Wireless Compact PCB antennas for 915MHz and 2.4GHz ISM bands Easy to integrate Altium design files and gerber files Return

More information

PCB PADS CIC PCB Design Flow Manual

PCB PADS CIC PCB Design Flow Manual PCB PADS CIC PCB Design Flow Manual Ver.1.0 0 2015/04/30 1.0 2015.4.30 Ver.1.0 1 2015/04/30 ... 1 1. PADS... 5 1.1 (Library)... 7 1.1.1 PADS Logic Library... 7 1.1.2 PADS Layout Library... 9 1.2 PART...

More information

How to avoid Layout and Assembly got chas with advanced packages

How to avoid Layout and Assembly got chas with advanced packages How to avoid Layout and Assembly got chas with advanced packages Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design

More information

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES! 4/3/2013 S THROUGH YOUR PCB FABRICATOR S EYES! Brett McCoy Eagle Electronics Schaumburg IL. New England Design and Manufacturing Tech Conference Brett McCoy: Vice President / Director of Sales Circuit

More information

Minimizing crosstalk in a high-speed cable-connector assembly.

Minimizing crosstalk in a high-speed cable-connector assembly. Minimizing crosstalk in a high-speed cable-connector assembly. Evans, B.J. Calvo Giraldo, E. Motos Lopez, T. CERN, 1211 Geneva 23, Switzerland John.Evans@cern.ch Eva.Calvo.Giraldo@cern.ch Tomas.Motos-Lopez@cern.ch

More information

San Jose State University. EE Microwave 2x2 Dipole Antenna Array Dr. Ray Kwok

San Jose State University. EE Microwave 2x2 Dipole Antenna Array Dr. Ray Kwok 1 San Jose State University EE 172 - Microwave Dr. Ray Kwok by Hanbo Tao May 25 th, 2011 2 Abstract This report will explain the theory of dipole antenna, and a 2x2 half wave dipole antenna will be designed

More information