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1 Dear Customer, DSG s 10 million USD investment plan started in August and will be completed by December 2010 or earlier January During this period contractors will carried out work in the manufacturing area to install the new equipment and up grade the services accordingly. Departments involved will have some temporary screening and protection to make sure that employee could work safely and production will not be effected. Dongguan Somacis Graphic PCB Aug 24, 2010
2 Dongguan Somacis Graphic PCB Co. Ltd. Company Presentation
3 Plant View
4 Company Profile A 50/50 joint venture between SOMACIS pcb industries and Graphic plc SOMACIS pcb industries Headquarters: Italy Graphic plc Headquarters: UK Dongguan Somacis Graphic PCB Co. Ltd Chashan, Dongguan City, China
5 Global Presence UK (Y1968) Crediton, Devon ITALY (Y1972) Castelfidardo Manfredonia CHINA (Y2007) Chashan Dongguan Rigid PCB Manufacturing Rigid-Flex Manufacturing
6 Company Profile Company Name: Dongguan Somacis Graphic PCB Co. Ltd. Location: Chashan, Dongguan City, China Production start: April 2007 Products: RoHS Compliant Multilayer PCBs (from 6 up to 40 layers), HDI, SBU, Laser Drilling, Advanced Materials, Rigid-flex PCBs with Technology Enabler development UL number: E Globally supported R&D and prototype development from collective 78+ years of PCB manufacturing experience
7 Company Profile -SOMACIS pcb industries Company Name: SOMACIS pcb industries Established: 1972 Headquarters: Castelfidardo (AN) - Italy Locations: Castelfidardo (Italy), Manfredonia (Italy), Headcount: 400 Total facilities area: 23,000 m² (197,000 m² total campus) Sales revenue: 50M Re-investment levels: minimum 10% of sales revenue Products: RoHS Compliant advanced technology multilayer PCBs (from 2 to 30 layers), HDI, SBU, Laser Drilling, Advanced Materials, with Technology Enabler development, quick turn prototype Certifications: UNI EN ISO 9001:2000, UNI EN ISO 14001:2004, UNI EN ISO 9100:2005, UNI EN ISO 13485:2004; Nadcap UL number: E79889
8 Company Profile -Graphic plc Company Name: Graphic plc Established: 1968 Location: Crediton, Devon - UK Headcount: 174 Facility area: 6,600 m² Sales revenue: 19M Re-investment levels: minimum 10% of sales revenue Products: RoHS Compliant Rigid-flex & multilayer PCBs (from 2 to 30 layers), HDI, SBU, Laser Drilling, Advanced Materials, with Technology Enabler development, quick turn prototype Certifications: ISO 9001:2000, MIL-PRF-55110, MIL-PRF-50884, BSEN123100\200\300, IECQ, ISO 14001, OHSAS 18001, MIL-PRF-31032,AS9100 UL number: E79518 ESA (2010)/ NADCAP (in progress)
9 DSG Organization Chart Board of directors G.Tridenti -C.E.O R.Rozario D.Pike A.Scalmati M.Dallora Plant Mng. James Yang Technical Mng. Logistic Mng. Sales Director Financial Control James Yang Ken Zhong Richard Lei Felix Manufact. Mng, Liu Xiaogang H.R. Mng Monica Zheng Finance Mng. Edison Ma Quality Mng. Sam Wang I.T. Mng. Vacant Facility Mng. Ryan Guo
10 Location
11 Location - Why Chashan, Dongguan City? Strong support from local government Guaranteed power supply Strategic suppliers located in the area Facility located 1,5 hours from Hong Kong
12 Investments COMPANIES COMPANIES CAPITAL CAPITAL Millions Millions Euro Euro 50% 50% TOTAL TOTAL PROJECT PROJECT INVESTMENTS INVESTMENTS Millions Millions Euro Euro 4 years participation SIMEST + MAP Venture capital China found, Italian government venture company, controlled by the Ministero Attività Produttive
13 2009~2010 Production mix by Layer count Month Jun-09 Jul-09 Aug-09 Sep-09 Oct-09 Nov-09 Dec-09 Jan-10 Feb-10 Mar-10 Apr-10 May-10 Layer Count (L)
14 2009~2010 Product Type Sales Amount Month 6L 8L 10L 12L 14L HDI & SBU Heavy copper 2009 May~ 2010 Apr 3.00% 5.20% 7.20% 10.30% 20.50% 23.2% 30.6%
15 Contents: 1 General Capability 2 Material List 3 Typical Projects A: Conventional Multilayer B: HDI C: Heavy Copper D: Rigid Flex E: High Frequency& Metal Base
16 General Capability Item Standard Advanced Remark Max Layer Count Thickness Min Max 0.25mm 4.5mm 0.2mm 6.5mm Max Size Delivery Unit Production Panel 570x610mm 610x640mm 570x610mm 610x640mm Copper Thickness Inner Outer 1/3-6oz 1/7-6oz 1/3-12oz 1/7-6oz Inner layer Min Tracks Min Insulation 50um 75um 50um 50um Outer layer Min Tracks Min Insulation 75um 75um 50um 50um
17 General Capability Item Standard Advanced Remark Min Mechanical Drill Size 0.15mm 0.15mm Mechanical Via Pad Inner Outer 0.45mm 0.4mm 0.4mm 0.35mm Laser Drill Size mm mm CO 2 copper directly Laser Via Pad Inner Outer 0.25mm 0.25mm 0.23mm 0.23mm Aspect Ratio LBMV MVTH 1:1 1:12 1:1 1: mm drill size Min Dielectric Thickness Inner Core Prepreg 0.05mm 0.05mm 0.05mm 0.05mm Excluding copper 1x106 Standard = No need to make special checks. Can be used for mass production. Advanced = It is controlled but needs special checks. Can be used only for prototype.
18 General Capability Item Standard Advanced Remark HDI 3+N+3 (N 20) 4+N+4 (N 20) Without filling copper Max Aspect Ratio Plugging by Resin 1:8 1: mm drill bit, Plug by permanent resin Mechanical Depth Control Drilling +/-10um +/-10um Solder Mask Gap Bridge 38um 75um 25um 63um Surface Treatment 1. HAL (Lead & Lead Free) 2. ENIG 3. Immersion Tin 4. Immersion Silver 5. OSP ENEPIG will be implemented Standard = No need to make special checks. Can be used for mass production. Advanced = It is controlled but needs special checks. Can be used only for prototype.
19 General Capability Item Standard Advanced Remark Material Buried Capacitance 1. Normal Tg 2. High Tg 3. Lead Free 4. Halogen Free 5. Rogers 6. Polyimide 7. High frequency 8. PTFE 9. Taconic Dielectric thickness: 14um Capacitance /area: 6.4 nf/in 2 Breakdown Voltage: >100V 3M material, no need license All the material can be mixed Rigid Flex 16 layers 22 layers Standard = No need to make special checks. Can be used for mass production. Advanced = It is controlled but needs special checks. Can be used only for prototype.
20 Material List Supplier Type Tg Tg test method Td Lead free Halogen free With Filler Anti CAF Remark S DSC 310 NO NO NO NO S1141KF 140 DSC 350 YES NO NO YES SYL S1000 S DSC DSC YES YES NO NO YES NO YES YES Major laminate in DSG Major laminate in DSG S DSC 335 YES NO YES YES Major laminate in DSG S DSC 370 YES YES NO YES IT DSC 340 YES NO YES YES Major laminate in DSG ITEQ IT DSC 350 YES NO NO YES Major laminate in DSG IT180TS 175 DSC 350 YES NO YES YES MATSUSHITA R-1566W 140 DSC 330 YES YES YES YES MCL-BE- 67G 140 TMA 340 YES YES YES YES HITACHI MCL-E-679F 170 TMA 350 YES NO YES YES LX-67Y TMA YES NO NO YES high frequency, Dk= (1Ghz)
21 Material List Supplier Type Tg Tg test method Td Lead free Haloge n free With Filler Anti CAF Remark DSC 350 high speed, low loss material Nelco EP 210 DSC 350 outstanding thermal and support lead free SI 210 DSC 350 high speed, low loss multifunctional epoxy. Polyclad 370HR 180 DSC 350 YES NO YES YES ISOLA FR DSC high speed, low loss material P96 Polyimide material ROGER RO3000 series RO4000 series High frequency material High frequency material Taconic TLX series RF series High frequency material High frequency material 33N Polyimide material 35N Polyimide material Arlon 85N Polyimide material 49N Epoxy no flow prepreg 38N Polyimide no flow prepreg Stablcor ST10 ST325 Thermal conductivity:75w/m.k(with 1oz copper) Thermal conductivity:175w/m.k(with 1oz copper)
22 Strategic Customer which we focus on Heavy copper (3-6oz) High Layer count multilayer(>=12l) Special material such as Roger, Nelco, PTFE, Polyimide Rigid flex High reliability application PCB such as: Aerospace, Medical, Military, High end telecom PCB
23 Typical Project Conventional Multilayer (B ) Layer count: 8L 3mil line width for outer and 5mil for inner 0.5mm pitch BGA with 3mil line routing between PADS 0.15mm blind via drilled by mechanical depth control drilling 1.2mm finished thickness Impedance control ENIG finished surface FR4 lead free material
24 Typical Project Conventional Multilayer (B )
25 Typical Project Conventional Multilayer (T ) Layer count: 16L SBU 3.3mil line width High registration requirement with 6mil spacing from mechanical hole to copper in inner layer 1.8mm thickness and min 0.2mm mechanical hole 8:1 AR mechanical hole with copper plated over filled epoxy
26 Typical Project Conventional Multilayer (Q ) Layer count: 20L Material: Nelco mil line width Three type of thickness core 3.0mm thickness Back drilling from L20 to L7
27 Typical Project Conventional Multilayer (M ) 18L high speed server PCB Thickness: 2.7mm Unit size 429x476mm Min. drill size 0.25mm High density component, 40,000 holes per unit Min. line width/spacing: 3.5/4mil Impedance & resistance control ENIG Material: FR4 Tg 170 o C 10 o rotation in production panel for better impedance performance Rotate 10 o
28 Typical Project Conventional Multilayer (T30AA3001A) 30 L back panel Size 18.7x17.3 inch Min inner layer line width: 3.5mil Min drill size:0.55mm Finished thickness 4.0mm ENIG surface treatment Impedance control
29 Typical Project Conventional Multilayer (T A) Fine line with 0.4mm Pitch BGA) Min 2.5mil/2.5mil line width/spacing for both inner & outer layer 0.4mm pitch BGA with 2.5mil line between two PADs 4mil Microvia with 2.4mil annular ring ENIG
30 Typical Project HDI (Q ) Layer count: 8L Stagger Microvia 3mil line width for both inner and outer Thin thickness with 0.6mm 0.1mm size Microvia 0.2mm size mechanical hole
31 Typical Project HDI (H ) Layer count: 12L L1-L2/L1-L3/L10-L12/L11-L12 Microvia 3.5mil line width 0.25mm drill size 1.72mm finished thickness Immersion Ag finished surface POVF for L1-L2/L1-L3 Microvia
32 Typical Project HDI (H ) Layer count: 20L SUB L1-L2/L19-L20 Microvia 4mil line width for inner 5mil line width for outer PCB size:9.8x13.9inch Big production pnl size with 21.6x25.2(3 units) 2.4mm finished thickness Min 0.25mm hole size ENIG finished surface FR4 lead free material
33 Typical Project HDI (H20AA3001) Layer count: 20L(1+18+1) 4mil line width 0.25mm drill size 2.2mm thickness Immersion Tin, min 1.2um Tin thickness Hitachi 679F(J) high reliability material
34 Typical Project HDI (H16AA5001) L1-L2/L15-L16 Microvia by laser L1-L3/L14-L16 Microvia by depth control mechanical drilling L1-L8/L9-L16 blind via L1-L16 capped via(pofv) Min line width 3.5mil Min drill size 0.25mm Thickness 1.7mm ENIG Drill by 0.25mm V shape bit
35 Typical Project Heavy Copper (T12A01001) Layer count: 12L Inner 5oz & outer 3oz heavy copper planar transformer 10mil line width for inner and 8mil for outer PCB size:2.28x0.9inch Copper thickness of hole wall 35um ENIG finished surface Dielectric thickness 0.08mm and finished board thickness less than 3.5mm 2kv dielectric strength test Inductance test Isola 370HR high reliability material
36 Typical Project Heavy Copper (M ) Layer count: 14L SBU Inner 3oz & outer 2oz heavy copper planar transformer L1-L8/L9-L14 blind via with unsymmetrical stack up Copper thickness of hole wall 25um ENIG finished surface FR4 Lead free material 3.25mm finished thickness 2.2kv dielectric strength test Inductance test IT158 lead free material
37 Typical Project Heavy Copper (B A) Layer count: 16L SBU Inner 3oz & 6oz outer 3oz heavy copper planar transformer L2-3/L4-5/L6-7/L8-9/L10-11buried holes with unsymmetrical stack up Copper thickness of hole wall 25um ENIG finished surface FR4 Lead free material, Hi-Tg 4.2 mm finished thickness 2.2kv dielectric strength test Inductance test 1 2.5oz finished 0.130mm prepreg 2 3oz finished 0.13mm laminate 3 3oz finished 0.153mm prepreg 4 3oz finished 0.13mm laminate 5 3oz finished 0.153mm prepreg 6 3oz finished 0.13mm laminate 7 3oz finished 0.153mm prepreg 8 3oz finished 0.13mm laminate 9 3oz finished 0.143mm prepreg 10 3oz finished 0.13mm laminate 11 3oz finished 0.236mm prepreg 12 6oz copper 0.13mm laminate 13 6oz copper 0.220mm prepreg 14 6oz copper 0.13mm laminate 15 6oz copper 0.284mm prepreg oz finished 3oz 6oz
38 Typical Project Rigid Flex Layer count: 6L L1-L2/L2-L3/L4-L5/L5-L6 0.1mm Microvia 3/3mil fine line/spacing for all layer 0.5mm finished thickness ENIG finished surface Adhesiveless FCCL
39 Typical Project Rigid Flex Layer count: 8L 4 mil minimum track PCB size: 15.3 x 4.5 inch Copper thickness of hole wall 25um ENIG finished surface Arlon N85 Polyimide rigid material Min 2um positive etching back IPC class 3 20 years quality warranty
40 Typical Project Rigid Flex F04A28001 Rigid flex( flex layer on outer) Layer count: 4L(2R+2F) Unbalance build up, flex on outer Finished thickness: 1.6mm Depth control routing ENIG
41 Typical Project Rigid Flex F14A26001 Layer count: 14L(10R+4F) Min line width/spacing: 5/4mil Board thickness 2.0mm ENIG
42 Typical Project 4 layers IMS PCB (Q ) Layer count: 4 layers 1.60mm Aluminium substrate material No-flow Perperg Immersion Ni/Au
43 Typical Project Cavity PCB (B ) Layer count: 4layers Circuit pattern on cavity bottom which locate in L3 instead of L1 No-flow Perperg Depth control routing Immersion Ni/Au 1 1oz finished 1.0mm laminate 2 Hoz copper 0.152mm prepreg 3 1oz copper 0.48mm laminate 4 1oz finished
44 Typical Project Stablcore PCB (Q12A29001) 12L with Stablcor ST325 material HAL+ Selective 40u hard gold Min line width 6mil Finished thickness 2.2mm Stablcor ST mm H/Hoz
45 Typical Project Aerospace RF PCB (Q ) Aerospace RF PCB Layer count: 10L, Material: RO3210+RO3203 PTFE base laminate+gore speed board C Perperg. L1-4 depth control cavity with target pad in L5. Conductive resin filling for blind via, and to be copper plated over conductive resin
46 Products SBU PCBs HIGH TECH AND HIGH INTERCONNECTION DENSITY PCBs WITH LASER DRILLING TECHNOLOGY STANDARD RIGID PCBs SPECIAL PCBs MADE WITH MATERIALS SUCH AS ROGERS, RCC, THERMOUNT, POLYIMIDE,TACONIC etc. HEAVY COPPER PCBs. METAL CORE PCBs BACKPLANE RIGID-FLEX PCBs PCBs WITH ALL TYPE OF SURFACE FINISHING
47 Products Dongguan SOMACIS GRAPHIC business strategy is market oriented, we acquired a solide position in many industry sectors, such as: Telecommunication Automotive Medical Information Technologies Industrial Avionics Industrial Aerospace Industrial Automation
48 Certification
49 Certifications Schedule ISO 9001:2008 Completed on September, 2007 ISO 14001:2004 Completed on November,2007 UL Completed on November,2007 ISO/TS 16949:2009 Completed on December, AS9100B Completed on December, NADCAP (in progress, the first audit date is 23-MAR-11)
50 Lean Manufacturing
51 Concept Design Building Mezzanine (2,000 sqm) Manufacturing area Services in the tunnels
52 Lay-out and Organisation Modern, state of the art advanced lean manufacturing layout design Production flow all in clockwise direction High level of automation (to be completed) Optimized distances between processes Minimal work in progress for optimum lead time Outstanding housekeeping All technical staff resident on the shop floor Continuous training program Employee empowerment principle adopted Bonus and incentives to reword performances and long time service Excellent campus environment Automatic loader and unload Training Room Recreation Area
53 Campus Areas Total land Manufacturing area Services area Dormitories & Canteen Waste Water Plant Pure Water Plant Land for expansion 66,000 sqm 11,000 sqm 2,000 sqm 6,000 sqm 1,500 sqm 1,200 sqm 48,000 sqm Current capacity can be doubled without any additional building
54 Campus Plan View Expansion Area 4 1. Offices 2. Production Plant 3. Waste Water Plant 4. Services Tunnels 5. Pure Water Plant 6. Chemicals store 7. Dormitory 8. Basketball ground 9. Football ground 10. Badminton court Plan view
55 Environment
56 Production Environment Exposure unit class < 1,000 Clean room class 10,000 Clean room class 100,000 1,500 sqm 1,000 sqm
57 Managing the Environment - The Green Approach Equipment and plant designed to minimize power, water and chemical consumption All wet process equipments protected by drip trays Extraordinary leaks diverted by gravity via service tunnel system to waste water plant (-8m fall) All wet process chemical requirements automatically dosed via service tunnel system from external protected storage tanks Exhausted fumes decontaminated by fume scrubber Copper recovery system under evaluation
58 Managing the Environment - The Green Approach Solar Panel Press Thermooil Heating System with energy saving design
59 Managing the Environment - The Green Approach Automatic filling system Fume scrubber Waste Water Plant Laboratory
60 Main Equipment
61 Main Equipments Exposures ILS - Bacher Roller coating machine Grow Up D.E.S. Schmid & PEPS - Bacher A.O.I. Machines - Camtek Oxide replacement line Atotech Bonding Machines Piergiacomi
62 Main Equipments Multilayer presses Lauffer X-Ray drilling machines Pluritec Drilling Machines - Schmoll Laser Drilling - Mitsubishi PTH line - Atotech Plating line - PAL
63 Main Equipments Dryfilm Exposure Unit Bacher SES Line Schmid Solder Mask Exposure Bacher HDI Tecnology Planarized Pola & Massa ENIG line - PAL Routing machines AEMG & Pluritec
64 Main Equipments Flying Probe Electrical Test - ATG Reliability Test Chemical and Physical Laboratory Quadruple Density Electrical Test -MASON Optical Gaging Machine OGP Final QA Laboratory
65 Fast Track Project
66 DSG is Quick-Turn Focused High Technology QTA - 12L conventional multilayer - HDI, SBU, Via-Resin Fill - 10L, 3-6 oz heavy copper - High performance material such as: * Nelco (13 EP,13 SI, 13 EPSI) * Isola FR408, FR408HR * Panasonic Megtron 4, Megtron 6 * Roger 3000 series, 4000 series * Taconic TLX series, RF series * Polyimide -Rigid flex -Thermal Management Solutions such as cavity, coin attach, high thermal conductivity
67 DSG is Quick-Turn Focused Prototype & Production Quick Turn Fabrication 11,000 SQM of Manufacturing, 350 employees with high level automation 24 Hour / 7 Days a week support With capacity to run larger quantities in quick turn Experienced DFM team can provide feedback to reduce cost and ease transition to production One stop shop: from prototype to mass production Same materials Same stackup Same shop making your PCB in China with high technology DSG
68 Services 1. Ability to support both rigid PCB and rigid flex PCB Small volume to High volume High reliability such as aerospace, military, medical, etc Advanced technology to standard technology Codesign, coengineering, QTA, mass production all in one stop shop 2. SAP system Barcode data collection for WIP tracking Automatic order input and shipping confirmations 3. Front end system Genesis 2000 CAM Tooling Integration Capacity to 100 new jobs per month by the end of 2010
69 Services 4. Raw Material Stocking 0.5 hour far away from key laminate supplier s location Standard FR4 laminate from 2-12mil thickness H/H, 1/1 oz laminate is always backup in store Special laminate will be backup in store based on customer forecast 18x24 standard panel size regardless layer count 5. Planning and Production Production and plan are charged by dedicated team Internal P/N identified by S with green color for all QTA traveller, a dedicated logo will be placed on the QTA traveller Individual machine & people for QTA, first priority by green channels in production * Front end * Inner & outer layer image process * Mechanical drilling` * Screen printing * Electric. Test & FQA report
70 Processes & Machines 1. LDI without phototools system for both inner & outer layer image transfer MIN. 1mil line width capability +/-0.5mil layer to layer registration capability With auto loader & unloader, up to 100 pnl per hour high throughput CAM data LDI Developed
71 Processes & Machines 2. Special design with max 2pnls/opening only, better temperature and pressure distribution, minimize capacity loss per cycle for QTA 3. High level automation to minimize operator handing problem Outer layer exposure from panel loading, exposuring, cooling, mylar removing, developing all in line Most of equipment with auto. loader & unloader Top plate PCB(Max 2pnls) Bottom plate Loader & unloader for PTH line Loader & unloader for pattern plate line Loder, outer exposure, mylar remove, developing all in line
72 Processes & Machines 4. Fly probe tester with auto unloader for small volume including QTA ATG A6 fly probe with 16 head Unloader system for fly probe tester
73 Processes & Machines 5. Layout & Organisation Production flow all in clockwise direction Optimized distances between processes, lean manufacturing in processes Minimal work in progress for optimum lead time Elec. Test & FQC Combined to minimize processes and minimize production lead time
74 Front End DFM Engineering 1. Provide solutions to optimize our customer s success from prototype to mass production with high quality 2. Maximize manufacturability of the design by standard procedure 3. Cost down as much as possible 4. Coengineering, Prototype, Production Transition support. 5. Post fabrication review and feedback 6. Support array making for best panel utilization
75 Front End DFM Engineering 7. Customer technical communication Standard DFM rule communication with customer at the beginning to minimize future confirmation on by one
76
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