Transcription

1 Company Overview

2 Index History Organization Annual Revenue Vision Production Capacity Technical Capability Lead Time Quality System Management Strategy Advantage Main Customer Certification Quick Process Looking Product 2/25

3 Established : Feb,2004 Location : Incheon, Korea Land : 4,000m2 Capacity 10,000 m2/month Staff : 160 Persons Tel : Fax : Established : May,1997 Location : Seoul, Korea Land : 1,000m2 Staff : 50 Persons Tel : Fax : /25

4 History May, 1997 Established EOSI Co., Ltd ( CAD Division ) Jay, 2004 Established EOSI Co., Ltd ( SMT Division ) Feb, 2004 Established EOS Corporation ( PCB Division ) Aug, 2004 Certificate UL System ( D/S, Multi B/D, Heavy Copper ) Dec, 2004 R&D Center Jan, 2005 Certificate Quality System ( ISO9001/14001) Nov,2006 Award for usd 5million Export Achievement(KITA) 4/25

5 Organization CEO R&D Center Planning Team Art-work Division PCB Division SMT Division 5/25

6 Annual Revenue Unit : million $(USD) /25

7 Vision Great Company Great People Top 1 Quick-turn Special PCB Manufacturer in the World Eco-Friendly PCB Manufacturer Sustainable Quality Control PCB Manufacturer Taking Corporate Social Responsibility 7/25

8 Management Strategy One-Stop Total Solution : PCB Art-work, Manufacture, Assembly Quick-Turn : Miracle system for delivery Quality First Customer Satisfaction : ERP -One Day Feed back System 8/25

9 Advantage Expert 30% employee over 10 years experience ERP Real time process checking available Turnkey System ( Total Solution ) Art-work, PCB Production, SMT High-End Technical PCB Supplier 9/25

10 Main Customer 10/25

11 Production Capacity CONTENTS GENERAL ITEM SPECIAL ITEM REMARKS HEAVY OZ 2~8 Layers 10~14 Layers 3,4,5,6, 7oz Copper Power Supply Board METAL BASE 1~2 Layers with Aluminum or Copper base 4~12 Layers with Aluminum or Copper base Metal Plate High Heat Dissipation property (Heat- sink) BVH 4~12 Layers 14~24 Layers Blind Via Hole Buried Via Hole BUILD-UP UP 6~8 Layers 10~16 Layers High Technology MLB RIGID- FLEXIBLE 4~8 Layers 10~22 Layers High Layers Rigid-Flex HIGH-COUNT MULTILAYER 4~20 Layers 22~42 Layers High Layers MLB High Layers Probe Card 11/25

12 Technical Capability CONTENTS LAYERS STANDARD BOARD 2~20 Layers SPECIAL BOARD 22~42 Layers THICKNESS 4LAYERS 6LAYERS 8LAYERS 10LAYERS 0.4~3.2mmt(16~126mils) 0.6~3.2mmt(24~126mils) 0.8~3.2mmt(31~126mils) 1.0~3.2mmt(39~126mils) Max 8mmt ( 310mils ) LINE WIDTH & SPACE MECHANICAL HOLE SIZE Min. 0.1mm(4mils) Min. 0.25mmΦ(10mils) Min mm(3mils) 0.20~0.15mmΦ(8~6mils) LASER HOLE SIZE Min. 0.10mmΦ(4mils) 0.08~0.09mmΦ(3.15~3.54mils) MAX. PCB SIZE IMPEDANCE mm(20 607mm(20 24inch) 24inch) ± 10% mm(24 800mm(24 31inch) ± 5% 12/25

13 Lead Time SAMPLE Small LOT 2L 4L 6L 8L Over 10L 2L 4L 6L 8L Miracle Mach Standard (Working day) 13/25

14 Quality System Incoming QC Incoming Inspection Vendor QC Vendor Quality Audit Vendor Quality Review Document Control Quality System Control : ISO 9001 Document Control : Internal & External Customer Satisfaction Customer Customer Complaint Management Process QC Analysis Operator Certification Gage R&R Traceability Reliability Lab Coupon Evaluation : Daily & weekly Reliability Test Outgoing QA Outgoing Inspection 14/25

15 Certification 15/25

16 Quick Process Looking CAM Cut Inner Exposure D.E.S Inner AOI Oxide 16/25

17 Quick Process Looking Press CNC Drill Laser Drill Plating Outer Exposure D.E.S 17/25

18 Quick Process Looking Outer AOI PSR Router Electrical Test Final Inspection Reliability 18/25

19 Backplane Applications Back Plane for Network or Server Wafer Probe Card Key Technology Hole Cleanning Pulse plating Impedance Registration Control ITEM GENERAL SPECIAL Layer Board Thickness Board Size Min. Drill Size Aspect Ratio Impedance mm mm 0.3mm 12 ± 10% mm mm 0.25mm 16 ± 5% Material High Tg FR-4 Low Dk/Df Material Available 19/25

20 Network / Server Applications Network Back Plane / Server Key Technology Fine Pattern Impedance Registration Control ITEM Layer Board Thickness Line Width / Space Min. Drill Size GENERAL mm μm 0.25mm SPECIAL mm 75μm 0.2mm Construction Blind / Buried / Sequential Lamination Impedance Material ± 10% High Tg FR-4 Low Dk/Df Material Available ± 5% 20/25

21 BVH ( Buried / Blind ) Applications Communication Key Technology Fine Pattern Impedance Registration Control ITEM Layer Board Thickness Line Width / Space Min. Drill Size GENERAL mm μm 0.25mm SPECIAL mm 75μm 0.2mm Construction Blind / Buried / Sequential Lamination Impedance Hole Plugging ± 10% Epoxy Resin / Metallic Ink ± 5% 21/25

22 Build-up ITEM GENERAL SPECIAL Construction Key Technology Stack Via Standard RCC FR-4 Conformal Copper Opening Stack Via Standard RCC FR-4 Via Filling Conformal Copper Opening 22/25

23 Heavy Copper Applications Power Amplifier, Power Module, Power Supplier Key Technology Pressing Drilling Registration Control ITEM GENERAL SPECIAL Layer Board Thickness 8 2.4mm mm Copper Thickness Material Max Inner : 7oz Outer : 12oz High Tg (Over 180 ) :FR-4 Less than Total 32oz Copper thickness In case of BVH Board, Must Be via Filling with Filling Ink 23/25

24 Rigid-Flexible Applications Missile / Space / Aerospace / Medical / Key Technology Pressing Impedance Registration Control ITEM Layer Board Thickness GENERAL mm SPECIAL mm Construction Impedance Material 2 / 6 / 10 ± 10% ± 5% High Tg (Over 180 ) :FR-4 / Polyimide Polyimide( FCCL ) 24/25

25 Location Enlargement SEOUL EOSI CORP. CAD/SMT DIVISION INCHEON EOS CORP. PCB DIVISION INCHEON Airport 45 minutes 50KM. 25/25