碧 澄 實 業 公 司 BICHENG ENTERPRISE COMPANY
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1 A PCB Solution Provider! 碧 澄 實 業 公 司 BICHENG ENTERPRISE COMPANY Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong , China Tel: Fax: Unit 09, 25/F, Ho King Commercial, 2-16 Fa Yuen Street, Mong Kok, Kowloon, Hong Kong Tel: Fax:
2 ABOUT US Bicheng Enterprise Company is an established manufacturer, supplier and solution provider of high quality printed circuit board (PCB), headquartered in Hong Kong with a staff of more than 350 workers at the factory in Shenzhen, China since From its establishment, we ve been focusing on offering customers high quality PCB s, various types, 1 to 30 layers, no minimum order quantity (MOQ) required under the operation philosophy of help customers with PCB demands and realize products value-added. 关 于 我 们 碧 澄 实 业 公 司 是 一 家 高 品 质 电 路 板 制 造 商, 供 应 商 和 方 案 解 决 提 供 商 总 部 设 于 香 港, 工 厂 位 于 深 圳, 员 工 350 余 人 自 公 司 成 立 以 来, 一 直 专 注 于 为 客 户 提 供 高 品 质 的 印 制 电 路 板 产 品, 多 类 型,1-30 层, 无 最 小 订 单 数 量 要 求 并 以 帮 到 客 户 用 板 需 求, 实 现 产 品 增 值 为 经 营 理 念
3 HIGH EFFICIENT AND ENTHUSIASTIC TEAM Under the guidance of modern science management and instant information shared through the network technology, the high efficient working environment comes into being. Skilled manufacturing experience can bring out the best performance of the equipment. We believe you ll enjoy our professional super-value services after the satisfaction with the high quality PCB s and is willing to be a long term cooperation partner. 高 效 而 充 满 朝 气 的 团 队 运 用 现 代 企 业 管 理 科 学, 通 过 网 络 科 技 实 时 共 享 各 类 资 讯, 形 成 高 效 的 工 作 环 境 丰 富 的 制 造 经 验, 发 挥 设 备 的 最 佳 性 能 相 信 您 在 得 到 用 板 需 求 的 同 时 也 享 受 到 我 们 超 值 的 服 务 而 成 为 长 久 的 合 作 伙 伴 ACCEPTABLE DOCUMENT FORMAT 可 接 收 文 件 格 式 Gerber file RS-274-X format or RS-274-D with aperture list and drill file. File designed with Protel PAD2000 ORCAD POWERPCB Genisis2000
4 MANUFACTURING CAPABILITY 制 造 能 力 项 目 Item 层 数 ( 最 大 ) Layer count 1-30 板 材 类 型 Material type 最 大 尺 寸 Max. size 外 形 尺 寸 精 度 Contour precision 板 厚 范 围 PCB Thickness 板 厚 公 差 ( t 0.8mm) Tolerance of PCB Thickness 板 厚 公 差 ( t < 0.8mm) Tolerance of PCB Thickness 介 质 厚 度 Thickness of Dielectric 最 小 线 宽 Min. Track 最 小 间 距 Min. Gap 外 层 铜 厚 Out layer copper 内 层 铜 厚 Inner layer copper 钻 孔 孔 径 ( 机 械 钻 ) Drill hole (Mechanical) 成 孔 孔 径 ( 机 械 钻 ) Finished hole(mechanical) 孔 径 公 差 ( 机 械 钻 ) Tolerance of hole (Mechanical) 孔 位 公 差 ( 机 械 钻 ) Tolerance of hole registration(mechanical) 加 工 能 力 Capability FR-4, MCPCB, Microwave material, XPC(94HB), FR-1(94V0), CEM-1, CEM-3 500mm X800mm ± 0.13mm 0.20mm--6.00mm ± 8% ± 10% 0.075mm--5.00mm 0.08mm 0.08mm 35µm--175µm 17µm--175µm 0.15mm--6.35mm 0.10mm--6.30mm 0.05mm 板 厚 孔 径 比 Aspect ratio 12:1 阻 焊 类 型 Type of solder resist 最 小 阻 焊 桥 宽 Min. width of solder mask bridge 最 小 阻 焊 隔 离 环 Min. clearance ring of solder mask 塞 孔 直 径 Diameter of via plug 阻 抗 公 差 Tolerance of impedance control 表 面 处 理 类 型 Type of surface finish 0.075mm 感 光 油 墨 LPI 0.08mm 0.05mm 0.25mm--0.60mm ± 10% 喷 锡, 化 学 金, 化 学 锡, 化 学 银, OSP 等 HASL, ENIG, Immersion tin, Immersion silver, OSP etc
5 QUALITY CONTROL 品 质 控 制 Engineering design prevents problems from occurring in pre production. Products and Manufacturing are certified by authorized organizations. 100% tests inclusive of electrical test and AOI inspection. High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc. 制 作 前 工 程 设 计 预 防 控 制 产 品 及 生 产 通 过 权 威 机 构 认 证 100% 检 测 包 括 电 测 和 自 动 光 学 检 查 可 进 行 高 压 测 试, 阻 抗 控 制 测 试, 微 切 片, 可 焊 性 测 试, 热 冲 击 测 试, 可 靠 性 测 试, 绝 缘 电 阻 测 试 和 离 子 污 染 测 试 等 FAST SERVICE 快 速 反 映 Layer count Fastest lead time Normal lead time 2 layer 24 hrs 4 working days 4 layer 48 hrs 5 working days 6 layer 72 hrs 7 working days 8 layer 96 hrs 9 working days 10 layer 120 hrs 11 working days 12 layer 120 hrs 12 working days 14 layer 144 hrs 15 working days layer Depends on specifications 22 layer above Depends on specifications
6 KEYWORDS 关 键 词 You can find out more information about Bicheng through our keywords list. 您 可 以 通 过 以 下 关 键 词 来 了 解 碧 澄 更 多 的 讯 息 *Products - Quick turn PCB - Prototype, small volume, large mass production layer - Silver through holes (STH) - Impedance control - High Tg, high CTI - BGA, microbga, QFP, CSP - 1+C+1 HDI, blind via, buried via - RO4350B, RO4003C, TLX-8, TLY-5, F4B - XPC (94HB), FR-1 (94V0) - CEM-1, CEM-3 - Carbon pad, carbon through holes (CTH) - 100% laser cut SMT solder paste stencil - Bergquist T-clad, Laird T-preg, NRK, Polytronics - RO4350B + FR-4 mixed material - Al-based + FR-4 mixed material - Mini PCB 6mm*6mm - Aluminum LED strips. - Rigid-flex - 14 different sizes in 400*500mm panel *Technology - Hot air soldering level (HASL) - Lead free - Immersion gold over Electro less nickel (ENIG) - Push back punching - Wire bond (electro-plate gold) - Electro-plate gold for edge connector - Peel able mask - Heavy copper ( μm) - Punching tool, CNC rout, V-groove - SI simulation - Single ended / differential space impedance *Applications - Medical equipment - Electronic toys - IR camera - Energy, power supply - LED lighting - Security defense - Computer & peripheral - Telecommunication - Analogue and digital - SATA *Customer located - Olt - Suffolk - Parma - Monmouthshire - Johor - Istanbul - Castelfidardo - Avellino - Bollengo - NSW, WA, SA, VIC - Batam - Nairobi - Pathumthani - Ontario - Pinneberg - Vancouver - Cairo - Hanoi - Quezon
7 PRODUCT RATIO 产 品 比 率 16-18Layer 7% 12-14Layer 9% 8-10Layer 13% 20-30Layer 2% 1-2Layer 42% 4-6Layer 27% Telecommunications 29% Medical equipment Security defense 4% 14% Consumer electronics 11% & Computer peripheral 21% LED lighting 6% Energy & power supply 15%
8 TECHNOLOGY DEVELOPMENT 技 术 发 展 We actively research and build such high value added PCB projects as high-end HDI, fast PCB and back plane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end. 公 司 积 极 研 发 和 建 设 高 端 HDI,24 小 时 快 板 和 软 硬 结 合 板 等 高 附 加 值 的 PCB 项 目, 使 公 司 PCB 产 品 之 间 形 成 有 效 延 伸 和 互 补, 形 成 涵 盖 从 低 端 至 高 端 的 完 整 产 品 线 Item SPECS FR-4 high Tg M M M M Embedded passive P S&P P&S S&M Base PI&BT S&P S&M M M material RO4350B/R04003C S&P M M M Aluminum based M M M M EOCB S S&P S&P Layer 1-18 layer M M M M count layer S&P S S&M M Heavy Cu 6 oz 6 oz M 6 oz M 6 oz M 8 oz M Min trace/space inner layer 4/4mil M 3/3mil P 3/3mil P&M 2/2mil R&D 2/2mil P out layer 3/3mil P 3/3mil P&M Max board 5mm 5mm M 5mm M thickness 6mm 6mm P 6mm P 8mm P 10 mm P Min. mech. drill 0.15mm M 0.1mm R&D 0.1mm P 0.1mm P 0.1mm S Aspect ratio(max) M (12:1) M (15:1) Impedance ±10% M M M M control ±5% P S M M Mixed material P(Teflon Rogers +FR-4) +FR-4 P&S S&M 1+C+1 P P&M S&M M HDI 2+C+2 P P&S S M: Mass production P: Prototype S: Small volume
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