FRAUNHOFER IZM RESEARCH FOR TOMORROW S PRODUCTS

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "FRAUNHOFER IZM RESEARCH FOR TOMORROW S PRODUCTS"

Transcription

1 FRAUNHOFER IZM RESEARCH FOR TOMORROW S PRODUCTS Name Klaus-Dieter Lang Abteilung Institutsleiter Overview Fraunhofer Gesellschaft 66 institutes 22,000 employees app. 1.9 billion turnover app. 70% contract research Information Technology Light & Surfaces Life Sciences Micro Electronics Production Defense & Security Materials & Components

2 Overview Fraunhofer Group Microelectronics Organization 13 institutes 2,700 employees 307 Mio budget (2011) More than 50% industrial contracts 18% basic funding 32% public projects / other revenues Competencies: Systems - Components - Technologies Business Fields Ambient Assisted Living & Health Energy Efficiency Mobility Smart Living Mission: From Microelectronics and Microsystems towards Smart Systems System Integration Technologies [m] [nm], [µm] Nanodimensions to Final Product Size

3 Mission Fraunhofer IZM Bringing Microelectronics into Application Research Focus Functionality Reliability Application Trends Form Factor Cost

4 Security Clothes for Emergency Staff High Performance 3D-Solarmodule Project: HighCom Assembly and Packaging technologies for for three dimensional bended solar modules with high efficient Si-Solarcells Demonstrator: helmet, P = 1.6 W Working range: -30 C + 60 C

5 Top 10 Breakthroughs of the Year 2012 Science Magazin, Vol Discovery of the Higgs Boson (CERN) 2. Denisovan Genom 3. Genome Engineering 4. Curiosity Landing ATLAS-Pixel-Detector-Module 80 mio 1,7 sqm, more than pixels/module Rapid data retrieval by 40 MHz Chip thickness: 150 μm, Module yield: 97% 5. X-ray Laser Advances against Sleeping Sickness 6. Eggs from Stem Cells 7. Majorana fermions 8. ENCODE-Project 9. Controlling prostheses by micro electrons in the brain 10. Neutrino Mixing Angle Top 10 Breakthroughs of the Year 2012 Science Magazin, Vol Discovery of the Higgs Boson (CERN) 2. Neuronal Interface for Smart Prostheses Denisovan Genom Wireless data and performance transmission, biocompatibility, 3. miniaturization Genome Engineering 4. Bumping of thinned chips, 3D integration (array + low Curiosity power signallanding amplifier), planar coil with ferrite for energy transmission and encapsulation technology 5. X-ray Laser Advances against Sleeping Sickness ATLAS-Pixel-Detector-Module 80 mio 1,7 sqm, more than pixels/module Rapid data retrieval by 40 MHz Chip thickness: 150 μm, Module yield: 97% 6. Eggs from Stem Cells 7. Majorana fermions 8. ENCODE-Project 9. Controlling prostheses by micro electrons in the brain 10. Neutrino Mixing Angle

6 Our Customers and Partners (Selection) Applications Equipment Manufacturers // Material Suppliers FROM IDEA TO PRODUCT WAYS OF COOPERATION NDA/Contract/IP Feasibility Study Research & Development Test Transfer Consulting/ 1 Innovation Workshop 2 Target Specification List System 3 Specification List 4 Functional Model 5 Prototype 6 Manufacturing Few days - 3 month 1 3 month 2-4 month 3-24 month 12 month 3 6 month IP-Research Concept Simulation Realization Reliability Optimization Qualification

7 Invisible, but Indispensable: Application Adapted Multifunctional Electronics Automotive/ Transportation Photonics Medical Engineering Safety & Security Power Electronics 3D Integration Industrial Electronics How to Work with Fraunhofer IZM Industrial Contract Research (e.g. R&D-projects world-wide, feasibility studies, technology & process development) Services for Industry (e.g. demonstrators, prototypes, technology service, equipment, personnel) Technology Transfer (technologies and processes) Strategic Alliances (e.g. packaging manufacturing lines, personnel) Cooperative Projects (funded jointly by public & industrial sources, State, EU) Common Basic Research (with institutes and universities world-wide)

8 European Research Cooperations and Networks ENIAC Joint Technology Initiative (JTI) on Nanoelectronics Domain team Heterogeneous Integration CATRENE Cluster for Application and Technology Research in Europe on NanoElectronics IEEE-CPMT (GC) German Chapter of IEEE-CPMT Platform system packaging and manufacturing challenges EPoSS European Research Platform Smart Systems Integration HTA Heterogeneous Technology Alliance Partners: CEA-Leti, CSEM, VTT, Fraunhofer VμE EURIPIDES Eureka Initiative for Packaging & Integration of μdevices & Smart Systems Research Cooperations in Asia and America UoU University of Utah Development of new universal interface models for implants KAIST Korea Advanced Institute of Science and Technology e.g. Semiconductor 3D Equipment and Materials Consortium ITRI Industrial Technology Research Institute, Taiwan UN-University United Nations University Global Initiative Solving the E- Waste Problem (Step) 50 partners JoiLIT Joint Laboratory IZM/Todai, University of Tokyo Electronic packaging development and ecodesign Asian Office Fraunhofer Representative Office Japan

9 Thank you for your attention! Fraunhofer Institute for Reliability and Microintegration IZM Director Prof. Klaus-Dieter Lang Gustav-Meyer-Allee Berlin Germany Phone URL

Heterogeneous Technology Alliance

Heterogeneous Technology Alliance Heterogeneous Technology Alliance MIKROELEKTRONIK Introduction Profile of Partners Europe is leading in the field of microsystem technologies both in research and industrial development. To strengthen

More information

Fraunhofer IZM-ASSID Targets

Fraunhofer IZM-ASSID Targets FRAUNHOFER INSTITUTE FoR Reliability and MiCroinTegration IZM Fraunhofer IZM ASSID All Silicon System Integration Dresden All Silicon System Integration Dresden Fraunhofer IZM-ASSID Fraunhofer IZM The

More information

Packaging Technologies for Smart Systems at Wafer and Panel Level

Packaging Technologies for Smart Systems at Wafer and Panel Level Packaging Technologies for Smart Systems at Wafer and Panel Level Name Abteilung Klaus-Dieter Lang OUTLINE Introduction Technology Solution Panel Level Packaging Packaging Trends Summary Technology Solution

More information

Faszination Licht. Entwicklungstrends im LED Packaging. Dr. Rafael Jordan Business Development Team. Dr. Rafael Jordan, Business Development Team

Faszination Licht. Entwicklungstrends im LED Packaging. Dr. Rafael Jordan Business Development Team. Dr. Rafael Jordan, Business Development Team Faszination Licht Entwicklungstrends im LED Packaging Dr. Rafael Jordan Business Development Team Agenda Introduction Hermetic Packaging Large Panel Packaging Failure Analysis Agenda Introduction Hermetic

More information

Heterogeneous Technology Alliance

Heterogeneous Technology Alliance Heterogeneous Technology Alliance Represented by André Perret CEO The partners CSEM, Inc. company, 400 empl. Micro & nanotechnologies, systems engineering, information and communication technologies, photonics,

More information

FRAUNHOFER IPMS: WE SHAPE THE LIGHT. PRODUCTS AND FIELDS OF APPLICATION

FRAUNHOFER IPMS: WE SHAPE THE LIGHT. PRODUCTS AND FIELDS OF APPLICATION FRAUNHOFER IPMS: WE SHAPE THE LIGHT. PRODUCTS AND FIELDS OF APPLICATION DR. HARALD SCHENK 10.03.2010 AGENDA Fraunhofer- Gesellschaft Fraunhofer-IPMS in Profile Products and Fields of Application AGENDA

More information

Leti Introduction and Overview

Leti Introduction and Overview Leti Introduction and Overview Leti Day in Tokyo, October 3rd 2012 Laurent Malier 2012 Leti 2012 1 CEA The CEA at a glance Commissariat à l Énergie Atomique et aux Énergies Alternatives is one of the largest

More information

PROVIDING TECHNICAL SOLUTIONS FOR BIOLOGICAL PROCESSES AND MEDICAL DEVICES

PROVIDING TECHNICAL SOLUTIONS FOR BIOLOGICAL PROCESSES AND MEDICAL DEVICES PROVIDING TECHNICAL SOLUTIONS FOR BIOLOGICAL PROCESSES AND MEDICAL DEVICES ABOUT LIFE SCIENCES ENGINEERING The joint Life Sciences Engineering business unit of Fraunhofer IPT and CMI has offices in Boston,

More information

Fraunhofer IZM Berlin

Fraunhofer IZM Berlin Fraunhofer IZM Berlin Advanced Packaging for High Power VCSEL Arrays Rafael Jordan, Lena Goullon, Constanze Weber, Hermann Oppermann Dr. Rafael Jordan, SIIT Fraunhofer IZM Berlin Advanced Packaging for

More information

Current situation of key enabling technologies in Europe

Current situation of key enabling technologies in Europe COMMISSION OF THE EUROPEAN COMMUNITIES Brussels, 30.09.2009 SEC(2009) 1257 final COMMISSION STAFF WORKING DOCUMENT accompanying the COMMUNICATION FROM THE COMMISSION TO THE EUROPEAN PARLIAMENT, THE COUNCIL,

More information

F R A U N H O F E R I N S T I T U T E F O R R E

F R A U N H O F E R I N S T I T U T E F O R R E FRAUNHOFER INSTITUTE FOR Reliability and MicroinTegration IZM Medical Engineering Medical progress through MicrosysteM technology Fraunhofer IZM is an independent research facility with more than 250 scientists.

More information

Yield Modeling and Patterns Prediction using Data Mining: a Preventive Approach. Vincent Barec, François Bergeret, Alexandre Couvrat

Yield Modeling and Patterns Prediction using Data Mining: a Preventive Approach. Vincent Barec, François Bergeret, Alexandre Couvrat Yield Modeling and Patterns Prediction using Data Mining: a Preventive Approach Vincent Barec, François Bergeret, Alexandre Couvrat We will introduce first the context and the two companies that have developed

More information

Automated Packaging of Photonic Communication Transceivers

Automated Packaging of Photonic Communication Transceivers Automated Packaging of Photonic Communication Transceivers Name Abteilung Gunnar Böttger (Work Group OIT - Optical Interconnection Technology - Henning Schröder) XI. Workshop Photonic Micro-Packaging,

More information

A Career that Revolutionises & Improves Lives

A Career that Revolutionises & Improves Lives OPTION GROUP B ELECTRONIC ENGINEERING presented by K Radha Krishnan Associate Professor, EEE 25 February 2015 1 A Career that Revolutionises & Improves Lives Scientists investigate that which already is,

More information

From ENIAC to ECSEL: challenges and opportunities

From ENIAC to ECSEL: challenges and opportunities From ENIAC to ECSEL: challenges and opportunities Andreas Wild Executive Director European Nanoelectronics Forum, Cannes, 2014 11 26 Content European snapshot FP7 progress: ARTEMIS+ENIAC JUs H2020 Strategy:

More information

Solar Energy Engineering

Solar Energy Engineering Online Training Modules in Photovoltaics Solar Energy Engineering Starting June 2, 2014 the University of Freiburg in cooperation with Fraunhofer will be offering free special training modules in Solar

More information

Acoustic/Electronic stack design, interconnect, and assembly Techniques available and under development

Acoustic/Electronic stack design, interconnect, and assembly Techniques available and under development Acoustic/Electronic stack design, interconnect, and assembly Techniques available and under development - supported by the European Commission under support-no. IST-026461 e-cubes Maaike M. V. Taklo :

More information

Recent Developments in Active Implants. Innovation of interconnections for Active Implant Applications

Recent Developments in Active Implants. Innovation of interconnections for Active Implant Applications Recent Developments in Active Implants Innovation of interconnections for Active Implant Applications Valtronic s Overview 1) Introduction of Valtronic: from Micro-technology to Medtech 2) Active Implants:

More information

North Rhine-Westphalia The economic powerhouse of Europe

North Rhine-Westphalia The economic powerhouse of Europe Enabling Technologies made in NRW, Cluster NanoMicro+Materials.NRW November, 10 th 2010 North Rhine-Westphalia The economic powerhouse of Europe 150 million consumers within about a 500-kilometer radius

More information

Energy-efficient piezo-mems tunable RF front-end antenna systems for mobile devices. RF-MST CLUSTER WORKSHOP Potsdam, Germany, 1 st of July, 2013

Energy-efficient piezo-mems tunable RF front-end antenna systems for mobile devices. RF-MST CLUSTER WORKSHOP Potsdam, Germany, 1 st of July, 2013 Energy-efficient piezo-mems tunable RF front-end antenna systems for mobile devices RF-MST CLUSTER WORKSHOP Potsdam, Germany, 1 st of July, 2013 Objective Reduction of transmission power levels in mobile

More information

IMEC S BUSINESS MODEL. M. Van Rossum

IMEC S BUSINESS MODEL. M. Van Rossum IMEC S BUSINESS MODEL M. Van Rossum Arenberg Doctoral School 2014 FACTS & FIGURES Total revenue in 2013 of 330 M R&D staff of >2100 people Collaboration with 600 companies & 208 universities, worldwide

More information

Medical technology Innovation for success Customized solutions in medical technology

Medical technology Innovation for success Customized solutions in medical technology Medical technology Innovation for success Customized solutions in medical technology Innovation for success The challenges in medical technology The purpose of medical technology is, in particular, to

More information

Dalla Ricerca all Impresa le Start up di IIT. Lorenzo De Michieli, Ph.D. Technology Transfer - Manager lorenzo.demichieli@iit.it

Dalla Ricerca all Impresa le Start up di IIT. Lorenzo De Michieli, Ph.D. Technology Transfer - Manager lorenzo.demichieli@iit.it Dalla Ricerca all Impresa le Start up di IIT Lorenzo De Michieli, Ph.D. Technology Transfer - Manager lorenzo.demichieli@iit.it Istituto Italiano di Tecnologia promotes excellence in fundamental and applied

More information

Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University

Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University An Overview for Prospective Students http://www.ece.osu.edu/ssep SSEP Area: Who Are We? First Row Betty

More information

F R A U N H O F E R I N S T I T U T E F O R R E

F R A U N H O F E R I N S T I T U T E F O R R E FRAUNHOFER INSTITUTE FOR Reliability and MicroinTegration IZM Power Electronics Fraunhofer IZM Power electronics is our passion Fraunhofer IZM is an independent research facility with more than 250 scientists.

More information

In Technology, the Key to Success is Delivering What s Next. First.

In Technology, the Key to Success is Delivering What s Next. First. In Technology, the Key to Success is Delivering What s Next. First. Page Our Role is to Help You Get to Market Faster The experience to help you create. Innovate. And deliver what s next Keysight is a

More information

Die Halbleiter Industrie in der Welt, in Europa und in Deutschland. Dr. Andreas Wild Executive Director

Die Halbleiter Industrie in der Welt, in Europa und in Deutschland. Dr. Andreas Wild Executive Director Die Halbleiter Industrie in der Welt, in Europa und in Deutschland Dr. Andreas Wild Executive Director Content 1. Semiconductors, a few basic ideas 2. Semiconductors in the world 3. Semiconductors in Europe

More information

The pole Optique-Rhône. Rhône-Alpes: a booster of innovation in Optics&Photonics

The pole Optique-Rhône. Rhône-Alpes: a booster of innovation in Optics&Photonics The pole Optique-Rhône Rhône-Alpes: a booster of innovation in Optics&Photonics The scientific and industrial forces of Rhône-Alpes region 1 000 20 000 5 400 8 000 1 000 1 000 2 500 1 500 500 2 500 1 500

More information

The Power of [Taiwan]

The Power of [Taiwan] The Power of [Taiwan] 2013 SEMI Taiwan. All Copyright Reserved. Taiwan / LED / PV Market September, 2013 Taiwan Ranked No. 2 in Global IC Design Industry The output value of the global IC design is expected

More information

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to

More information

TechVision 2020. A SYSTEMATIC INNOVATION SERENDIPITY ENGINE Convergence Begets Innovation Begets Growth

TechVision 2020. A SYSTEMATIC INNOVATION SERENDIPITY ENGINE Convergence Begets Innovation Begets Growth TechVision 2020 A SYSTEMATIC INNOVATION SERENDIPITY ENGINE Convergence Begets Innovation Begets Growth Patent Activity Convergence Market Potential Funding Welcome to the Power Packed World of Top 50 Technologies

More information

Enterprise Interoperability in the Context of Simulation

Enterprise Interoperability in the Context of Simulation Enterprise Interoperability in the Context of Simulation An Experience of Non-Interoperability Remote Presentation (configuration on demand?) Next SOLUTION UK Non interoperability between the conference

More information

ECSEL Consortium Building Event 2015

ECSEL Consortium Building Event 2015 ECSEL Consortium Building Event 2015 Sub Project proposal (Anti Counterfeiting Technology Integration ON SC industrially relevant packaging environment) Stephanie Pesseguier, STMicroelectronics, Rousset

More information

ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS

ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Cyber Physical Systems Sicherheit für eine Welt im Wandel Harald Pötter RF & Smart Sensor Systems Cyber Physical Systems Sicherheit für eine Welt im Wandel Agenda

More information

Branson Laser Tooling Technology Changes What is Possible in Plastics Welding

Branson Laser Tooling Technology Changes What is Possible in Plastics Welding Laser Tooling Branson Laser Tooling Technology Changes What is Possible in Plastics Welding The technology is known as Simultaneous Through Transmission Infrared (STTIr) a technology made possible by a

More information

Gian Luca Sacco Marketing Director South & Central Europe. Smarter decisions, better products.

Gian Luca Sacco Marketing Director South & Central Europe. Smarter decisions, better products. Gian Luca Sacco Marketing Director South & Central Europe Smarter decisions, better products Smarter decisions, better products. Today s Product Challenges are More Difficult Than Ever Before Landing on

More information

SPIE INDUSTRY UPDATE THE DEFINITIVE GLOBAL BUSINESS RESOURCE FOR THE PHOTONICS INDUSTRY

SPIE INDUSTRY UPDATE THE DEFINITIVE GLOBAL BUSINESS RESOURCE FOR THE PHOTONICS INDUSTRY SPIE INDUSTRY UPDATE THE DEFINITIVE GLOBAL BUSINESS RESOURCE FOR THE PHOTONICS INDUSTRY SPIE Industry Update San Francisco, CA February 9, 2015 Stephen G. Anderson SPIE 3 In this talk National Photonics

More information

MID, Flexible Circuits or Printed Circuit Boards? Technology Selection Based on Virtual Prototypes. 1 MID Congress 2010

MID, Flexible Circuits or Printed Circuit Boards? Technology Selection Based on Virtual Prototypes. 1 MID Congress 2010 1 MID Congress 2010 Company Overview Company history 07/2003: Foundation by Dr. Thomas Krebs 09/2006: Named FlowCAD as distributor Product NEXTRA Innovative product technology Industries: Transportation,

More information

PROGRAMMABLE ANALOG INTEGRATED CIRCUIT FOR USE IN REMOTELY OPERATED LABORATORIES

PROGRAMMABLE ANALOG INTEGRATED CIRCUIT FOR USE IN REMOTELY OPERATED LABORATORIES PROGRAMMABLE ANALOG INTEGRATED CIRCUIT FOR USE IN REMOTELY OPERATED LABORATORIES Carsten Wulff (carsten@wulff.no) Prof. Trond Ytterdal (ytterdal@fysel.ntnu.no) Norwegian University of Science and Technology,

More information

Eurotraining survey on Microsytems training requirements

Eurotraining survey on Microsytems training requirements Eurotraining survey on Microsytems training requirements Hervé Fanet CEA LETI Annette Locher FSRM Chantal Tardif CEA INSTN Abstract One objective of the Eurotraining MST project is to identify training

More information

PRESS RELEASE FRAUNHOFER INSTITUTE FOR INTEGRATED CIRCUITS IIS DESIGN AUTOMATION DIVISION EAS. PRESSE RELEASE June 2, 2014 Page 1 5

PRESS RELEASE FRAUNHOFER INSTITUTE FOR INTEGRATED CIRCUITS IIS DESIGN AUTOMATION DIVISION EAS. PRESSE RELEASE June 2, 2014 Page 1 5 PRESS RELEASE June 2, 2014 Page 1 5 European Project VERDI provides Universal Verification Methodology (UVM) in SystemC to Accellera Systems Initiative as new industry standard proposal UVM-SystemC language

More information

OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING

OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING G. VAN STEENBERGE, E. BOSMAN, J. MISSINNE, B. VAN HOE, K.S. KAUR, S. KALATHIMEKKAD, N. TEIGELL BENEITEZ, A. ELMOGI CONTACT GEERT.VANSTEENBERGE@ELIS.UGENT.BE

More information

Smart Systems Community

Smart Systems Community Opportunities for the Smart Systems Community in the Three Pillars of Horizon 2020 and in the new JTI ECSEL - EPoSS Annual Forum - Willy Van Puymbroeck DG CONNECT 26 September 2013 Content of Presentation

More information

COMMUNICATION FROM THE COMMISSION TO THE EUROPEAN PARLIAMENT, THE COUNCIL, THE EUROPEAN ECONOMIC AND SOCIAL COMMITTEE AND THE COMMITTEE OF THE REGIONS

COMMUNICATION FROM THE COMMISSION TO THE EUROPEAN PARLIAMENT, THE COUNCIL, THE EUROPEAN ECONOMIC AND SOCIAL COMMITTEE AND THE COMMITTEE OF THE REGIONS EUROPEAN COMMISSION Brussels, 23.5.2013 COM(2013) 298 final COMMUNICATION FROM THE COMMISSION TO THE EUROPEAN PARLIAMENT, THE COUNCIL, THE EUROPEAN ECONOMIC AND SOCIAL COMMITTEE AND THE COMMITTEE OF THE

More information

CMP. A dynamic link between research and industry. Center of Microelectronics in Provence - Georges Charpak Campus. http://cmp.emse.

CMP. A dynamic link between research and industry. Center of Microelectronics in Provence - Georges Charpak Campus. http://cmp.emse. INSPIRING INNOVATION I INNOVANTE PAR TRADITION CMP Center of Microelectronics in Provence - Georges Charpak Campus http://cmp.emse.fr A dynamic link between research and industry THE CENTER OF MICROELECTRONICS

More information

Leadership pays. Proven path to new security-driven applications. www.infineon.com/payment

Leadership pays. Proven path to new security-driven applications. www.infineon.com/payment Leadership pays Proven path to new security-driven applications www.infineon.com/payment Opportunities Chance to tap into higher value cards Faster route to multi-application business models New form factors

More information

LI-ION BATTERY. for CELLS AND PACKS

LI-ION BATTERY. for CELLS AND PACKS ENERGY STORAGE LI-ION BATTERY PRODUCTION SOLUTIONS for CELLS AND PACKS MANZ AG /// high-tech for a green future /// 2 2015 Acquisition of KLEO, a company of the ZEISS Group; expansion of portfolio by laser

More information

Internet of Things Value Proposition for Europe

Internet of Things Value Proposition for Europe Internet of Things Value Proposition for Europe European Commission - DG CONNECT Dr Florent Frederix, (Online) Trust and Cybersecurity unit 7 th European Conference on ICT for Transport Logistics 5 th

More information

ASML 2011 Third Quarter Results Confirming expectation for record sales year Oct 12, 2011

ASML 2011 Third Quarter Results Confirming expectation for record sales year Oct 12, 2011 ASML 2011 Third Quarter Results Confirming expectation for record sales year Oct 12, 2011 / Slide 1 Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the

More information

Communicating waste baskets for intelligent waste management

Communicating waste baskets for intelligent waste management Communicating waste baskets for intelligent waste management Dr. Thomas Luckenbach, Fraunhofer FOKUS Michael Tost, BSR http://www.fi ppp outsmart.eu/ OUTSMART Provisioning of urban/regional smart services

More information

The Thales Group. Corporate Introduction THALES NEDERLAND B.V. PUBLIC. May. '09. ItTiN 2009 V02

The Thales Group. Corporate Introduction THALES NEDERLAND B.V. PUBLIC. May. '09. ItTiN 2009 V02 The Thales Group Corporate Introduction 1 THALES NEDERLAND B.V. THALES NEDERLAND B.V. AND/OR ITS SUPPLIERS. THIS INFORMATION CARRIER CONTAINS PROPRIETARY INFORMATION WHICH SHALL NOT BE USED, REPRODUCED

More information

HDI-Baugruppen der Zukunft - Applikationen, Entwurf, Technologien

HDI-Baugruppen der Zukunft - Applikationen, Entwurf, Technologien HDI-Baugruppen der Zukunft - Applikationen, Entwurf, Technologien 2,5D SiP Vertikale Integration heterogener Mikroschaltungen Stephan Guttowski 2), David Polityko 1), Herbert Reichl 1) 1) Technical University

More information

Module production and testing for the CMS pixel Phase 1 upgrade

Module production and testing for the CMS pixel Phase 1 upgrade Module production and testing for the CMS pixel Phase 1 upgrade GK Plenary Workshop, 28th 30th September 2015, Freudenstadt (IEKP) INSTITUT FÜR EXPERIMENTELLE KERNPHYSIK (IEKP), DEPARTMENT DEPARTMENT OF

More information

CRITICAL MANUFACTURING

CRITICAL MANUFACTURING CRITICAL MANUFACTURING Software solutions that take manufacturers to the next level in production efficiency and productivity www.criticalmanufacturing.com Critical Manufacturing creates leading edge software

More information

INTERNET OF THINGS EUROPE

INTERNET OF THINGS EUROPE INTERNET OF THINGS EUROPE www.internet-of-things.eu Internet of Things 2010 Conference 29-1 Nov/Dez 2010, Tokyo Workshop Session: From the INTRAnet of Things to the INTERnet of Things Establishing a common

More information

WE ENGINEER THE FUTURE INVESTOR PRESENTATION AUGUST, 2015

WE ENGINEER THE FUTURE INVESTOR PRESENTATION AUGUST, 2015 WE ENGINEER THE FUTURE INVESTOR PRESENTATION AUGUST, 2015 FIRST SENSOR COMPANY PROFILE First Sensor AG is one of the world's leading suppliers in the field of sensor systems. Our company develops and manufactures

More information

3D Component Packaging in Organic Substrate

3D Component Packaging in Organic Substrate 3D Component Packaging in Organic Substrate Mark Beesley Beyond 300mm, Grenoble April 2012 www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) 3842

More information

Ecodesign Directive: An Overview of the Preparatory Study on Enterprise Servers and Storage

Ecodesign Directive: An Overview of the Preparatory Study on Enterprise Servers and Storage Ecodesign Directive: An Overview of the Preparatory Study on Enterprise Servers and Storage D. Polverini, European Commission Thibault Faniger, BIO Intelligence Service Ecodesign Preparatory Study DG ENTR

More information

Commencement for Smart Community Project in Greater Manchester, UK

Commencement for Smart Community Project in Greater Manchester, UK FOR IMMEDIATE RELEASE Commencement for Smart Community Project in Greater Manchester, UK Tokyo, March 13, 2014 Hitachi, Ltd. (TSE:6501/ Hitachi ), Daikin Industries, Ltd. (TSE:6367/ Daikin ), and Mizuho

More information

EPoSS Strategy Paper Smart Systems for the Full Electric Vehicle

EPoSS Strategy Paper Smart Systems for the Full Electric Vehicle Joint EC/EPoSS Expert Workshop Smart Systems for the Full Electric Vehicle Brussels 25-26 June 2008 EPoSS Strategy Paper Smart Systems for the Full Electric Vehicle August 2008 1. Introduction Growing

More information

Secure Services and Quality Testing SST. Security Engineering Privacy by Design Trusted Solutions. Mario Hoffmann. for Service Ecosystems

Secure Services and Quality Testing SST. Security Engineering Privacy by Design Trusted Solutions. Mario Hoffmann. for Service Ecosystems Secure Services and Quality Testing SST Security Engineering Privacy by Design Trusted Solutions for Service Ecosystems Mario Hoffmann Head of Department Fraunhofer AISEC in a nutshell Fraunhofer Profile

More information

White Paper: Pervasive Power: Integrated Energy Storage for POL Delivery

White Paper: Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power Overview This paper introduces several new concepts for micro-power electronic system design. These concepts are based on the

More information

Nidec corporation General Application Motor & Solutions Business Unit

Nidec corporation General Application Motor & Solutions Business Unit Nidec corporation General Application Motor & Solutions Business Unit 1.Company overview Company profile Company: NIDEC CORPORATION (logo: ) Founder: Shigenobu Nagamori (Chairman of the Board, President

More information

Bio@IT Lisboa, July 2, 2012. Bioelectronics. Luís Alcácer. 2005, it - instituto de telecomunicações. Todos os direitos reservados.

Bio@IT Lisboa, July 2, 2012. Bioelectronics. Luís Alcácer. 2005, it - instituto de telecomunicações. Todos os direitos reservados. Lisboa, July 2, 2012 Luís Alcácer 2005, it - instituto de telecomunicações. Todos os direitos reservados. Outline Organic Organic Nanoelectronics Molecular Electronics 2 July 2, 2012 Lisboa Sensu lato

More information

ECSEL-Austria History, Common Fields of Interest, Success-Stories Austrian R&D&I Roadmap on Automated Vehicles

ECSEL-Austria History, Common Fields of Interest, Success-Stories Austrian R&D&I Roadmap on Automated Vehicles Electronic Components and Systems for European Leadership Austria ECSEL-Austria History, Common Fields of Interest, Success-Stories Austrian R&D&I Roadmap on Automated Vehicles Presented by: Erwin Schoitsch,

More information

The Fraunhofer Heinrich Hertz Institute

The Fraunhofer Heinrich Hertz Institute The Driving the Gigabit Society, Einsteinufer 37, 10587 Berlin www.hhi.fraunhofer.de Association 60 Institutes in Germany and around the world offer research services to industry and government staff of

More information

Development of Ultra-Multilayer. printed circuit board

Development of Ultra-Multilayer. printed circuit board Development of Ultra-Multilayer Printed Circuit Board Yasuyuki Shinbo Using the multilayer and characteristic impedance control technologies cultivated in the field of telecommunications, OKI Printed Circuits

More information

Preview of the leading trade fair for suppliers to the medical technology industry

Preview of the leading trade fair for suppliers to the medical technology industry Press Release No. 1 Trend Report 8th COMPAMED Spring Convention - "Medical Technology To Go" Preview of the leading trade fair for suppliers to the medical technology industry Solutions from the field

More information

Applied and Integrated Security. C. Eckert

Applied and Integrated Security. C. Eckert Applied and Integrated Security 1 Joseph von Fraunhofer (1787-1826) Researcher discovery of Fraunhofer Lines in the sun spectrum Inventor new methods of lens processing Entrepreneur head of royal glass

More information

Address by Stefania Giannini Minister of Education, Universities and Research on the occasion of LET s 2014 " Bologna, October 1, 2014

Address by Stefania Giannini Minister of Education, Universities and Research on the occasion of LET s 2014  Bologna, October 1, 2014 Address by Stefania Giannini Minister of Education, Universities and Research on the occasion of LET s 2014 " Bologna, October 1, 2014 Dear Authorities, Dear Colleagues, Ladies and Gentlemen, The dense

More information

SEMI Microelectronic Manufacturing Supply Chain Quarterly Market Data - CYQ1 2016 www.semi.org/marketinfo

SEMI Microelectronic Manufacturing Supply Chain Quarterly Market Data - CYQ1 2016 www.semi.org/marketinfo SEMI Microelectronic Manufacturing Supply Chain Quarterly Market Data - CYQ1 2016 www.semi.org/marketinfo March 2016 Economic Trends Weakening Currency, especially Yen & Euro, dampened 2015 industry figures

More information

Industry Report Photonics 2013 Common Market Analysis

Industry Report Photonics 2013 Common Market Analysis Industry Report Photonics 2013 Common Market Analysis Industry Report Photonics 2013 Management Report World Industry Report Photonics 2013 Photonics A Strong Industry With Excellent Prospects Photonics

More information

Testimony of Elizabeth Rogan CEO The Optical Society House Commerce, Justice, and Science Subcommittee House Appropriations Committee March 22, 2012

Testimony of Elizabeth Rogan CEO The Optical Society House Commerce, Justice, and Science Subcommittee House Appropriations Committee March 22, 2012 Testimony of Elizabeth Rogan CEO The Optical Society House Commerce, Justice, and Science Subcommittee House Appropriations Committee March 22, 2012 Good morning, Chairman Wolf and Ranking Member Fattah.

More information

An Introduction to Fraunhofer Gesellschaft and Fraunhofer USA Patrick Bressler

An Introduction to Fraunhofer Gesellschaft and Fraunhofer USA Patrick Bressler An Introduction to Fraunhofer Gesellschaft and Fraunhofer USA Patrick Bressler The Fraunhofer-Gesellschaft at a Glance The Fraunhofer-Gesellschaft undertakes applied research of direct utility to private

More information

Microsystem technology and printed circuit board technology. competition and chance for Europe

Microsystem technology and printed circuit board technology. competition and chance for Europe Microsystem technology and printed circuit board technology competition and chance for Europe Prof. Udo Bechtloff, KSG Leiterplatten GmbH 1 Content KSG a continuously growing company PCB based Microsystems

More information

Dynamic mechanical load testing

Dynamic mechanical load testing Dynamic mechanical load testing Solar Power International Workshops on Bankability Chicago, IL October 21, 2013 Geoffrey S. Kinsey, Ph.D. Director of PV Technologies Fraunhofer Center for Sustainable Energy

More information

International Cluster Collaboration in Photonics for Digital Societies 2020 convenient & reliable & affordable

International Cluster Collaboration in Photonics for Digital Societies 2020 convenient & reliable & affordable 10 th Anniversary Innovative Applications of Light with Photonic Micro Sensors 4.0 and Digital Image Processing 26.08.-, Jena Dietrich Hofmann Randolf Margull Paul-Gerald Dittrich Daniel Kraus International

More information

H2020 LEIT ICT "Future Internet" ICT 9 - Tools and Methods for Software Development

H2020 LEIT ICT Future Internet ICT 9 - Tools and Methods for Software Development H2020 LEIT ICT "Future Internet" ICT 9 - Tools and Methods for Software Development Jorge GASOS Jorge.Gasos@ec.europa.eu DG CONNECT Software & Services, Cloud Computing H2020-70 billion (2014-20) three

More information

From research to industrial applications. Knowledge. for everyday life improvement. www.asgsuperconductors.com

From research to industrial applications. Knowledge. for everyday life improvement. www.asgsuperconductors.com From research to industrial applications Knowledge for everyday life improvement www.asgsuperconductors.com the Company ASG Superconductors designs and manufactures resistive and superconducting magnet

More information

Fujitsu Laboratories R&D Strategy April 13, 2007 Kazuo Murano President Fujitsu Laboratories, Ltd.

Fujitsu Laboratories R&D Strategy April 13, 2007 Kazuo Murano President Fujitsu Laboratories, Ltd. FY2007 Fujitsu Laboratories R&D Strategy Briefing Fujitsu Laboratories R&D Strategy April 13, 2007 Kazuo Murano President Fujitsu Laboratories, Ltd. Rise of Global Competition in R&D Common global market

More information

Customized solutions Rigid, flexible and rigid-flexible printed circuit boards of the very highest quality

Customized solutions Rigid, flexible and rigid-flexible printed circuit boards of the very highest quality printed circuitboards Customized solutions Rigid, flexible and rigid-flexible printed circuit boards of the very highest quality Competent. Innovative. Tailor-made. The quality of the thinking determines

More information

History 02.02.2010. www.roodmicrotec.com

History 02.02.2010. www.roodmicrotec.com Zwolle Dresden Nördlingen Stuttgart certified by. History - 1969: Foundation of German Signetics GmbH, test and assembly location, in Nördlingen (Germany) - 1974: Takeover by Philips Semiconductors - 1983:

More information

Function-integrated Lightweight Design Structures for Next Generation Ground Vehicles 09-10.10.2014, IEA Workshop

Function-integrated Lightweight Design Structures for Next Generation Ground Vehicles 09-10.10.2014, IEA Workshop Function-integrated Lightweight Design Structures for Next Generation Ground Vehicles 09-10.10.2014, IEA Workshop Dipl.-Ing. Gundolf Kopp Dipl.-Ing. Andreas Höfer Dipl.-Ing. Diego Schierle Prof. Dr. -Ing.

More information

Artisan Technology Group is your source for quality new and certified-used/pre-owned equipment

Artisan Technology Group is your source for quality new and certified-used/pre-owned equipment Artisan Technology Group is your source for quality new and certified-used/pre-owned equipment FAST SHIPPING AND DELIVERY TENS OF THOUSANDS OF IN-STOCK ITEMS EQUIPMENT DEMOS HUNDREDS OF MANUFACTURERS SUPPORTED

More information

Content Company Overview Products & Technology Products & T Sales & Marketing Financial Overview New Business

Content Company Overview Products & Technology Products & T Sales & Marketing Financial Overview New Business Content Company Overview Products & Technology Sales & Marketing Financial Overview New Business 2 Company Profile TXC Corporation, founded in 1983, is a leading professional frequency control product

More information

The Current status of Korean silicon photovoltaic industry and market. 2011. 3.17 Sangwook Park LG Electronics Inc.

The Current status of Korean silicon photovoltaic industry and market. 2011. 3.17 Sangwook Park LG Electronics Inc. The Current status of Korean silicon photovoltaic industry and market 2011. 3.17 Sangwook Park LG Electronics Inc. contents 1.Introduction (World PV Market) 2.Korean PV market 3.Photovoltaics in LG Electronics

More information

Automation - future trends and innovation

Automation - future trends and innovation Automation - future trends and innovation Dr. Gerd-Ulrich Spohr Siemens I IA Strategy Innovation & Technology VDI October, 6th 2009 in Karlsruhe Contents Automation - future trends and innovations Contents

More information

Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation

Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation Mat. Res. Soc. Symp. Proc. Vol. 681E 2001 Materials Research Society Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation J. Bagdahn

More information

European Policy in support of the emerging Internet of Things

European Policy in support of the emerging Internet of Things European Policy in support of the emerging Internet of Things Dr. Florent Frederix, Head of Sector Information Society and Media European Commission This document does not necessarily reflect any official

More information

Investor Presentation June 2016

Investor Presentation June 2016 A global leader powered by engineered material solutions that fully satisfy our customers Investor Presentation June 2016 Our Technologies for Tomorrow s Innovations www.ii vi.com NASDAQ: IIVI Safe Harbor

More information

FOR HIGH-TECH PRODUCTION

FOR HIGH-TECH PRODUCTION AUTOMATION & METROLOGY AUTOMATION & METROLOGY SOLUTIONS FOR HIGH-TECH PRODUCTION key technologies for multiple industries MANZ AG /// hightech solutions /// 5 2015 Acquisition of KLEO, a company of the

More information

Electronic Business in the Transport Equipment Industries

Electronic Business in the Transport Equipment Industries Electronic Business in the Transport Equipment Industries Philipp Koellinger, M.Sc. An initiative of the e-business W@tch Annual Event Brussels, 7th July 2004 European Commission e-business W@tch Workshop

More information

Mobile Devices and Systems Lesson 04 Smart Systems Labels, RFID and tokens

Mobile Devices and Systems Lesson 04 Smart Systems Labels, RFID and tokens Mobile Devices and Systems Lesson 04 Smart Systems Labels, RFID and tokens Oxford University Press 2007. All rights reserved. 1 Smart systems Smart Labels Smart labels RFID Smart tokens Oxford University

More information

Automation Industry Market Report

Automation Industry Market Report Automation Industry Market Report The Global Industrial Automation Industry After weathering a difficult economic recession, the global automation industry is once again on the upswing, with many industry

More information

State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop

State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Photos placed in horizontal position with even amount of white space between photos and header State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Michael Holmes Manager, Mixed Signal ASIC/SoC

More information

Embedded Eletronics. Results of the study for the inclusion of electronics in existing industrial products

Embedded Eletronics. Results of the study for the inclusion of electronics in existing industrial products Embedded Eletronics Results of the study for the inclusion of electronics in existing industrial products Overview: Global electronic industry 2/3 of global production in Asia Global Electronic Industry,

More information

LECTURERS TEAM: Juan M. López González y Pablo Ortega. CONTACT HOURS: 3 hours (2 h concepts + 1 h application)

LECTURERS TEAM: Juan M. López González y Pablo Ortega. CONTACT HOURS: 3 hours (2 h concepts + 1 h application) NAME: HIGH FREQUENCY AND OPTOELECTRONIC DEVICES LECTURER COORDINATOR: Juan M. López González LECTURERS TEAM: Juan M. López González y Pablo Ortega LANGUAGE OF INSTRUCTION: English/Catalan/Spanish CONTACT

More information

Assembly services on demand Jan de Louw. HTE 2007, Evoluon Eindhoven 1

Assembly services on demand Jan de Louw. HTE 2007, Evoluon Eindhoven 1 Assembly services on demand Jan de Louw HTE 2007, Evoluon Eindhoven 1 EUPASS mission: Results: - Extreme short time-to-market or time-to-volume (target is 2-3 months) - return-on-investment based on the

More information

ECSEL in 2015. Alun Foster Head of Plans and Dissemination. ARTEMIS-IA and EPoSS Brokerages Amsterdam - 21 st - 23 rd January 2015

ECSEL in 2015. Alun Foster Head of Plans and Dissemination. ARTEMIS-IA and EPoSS Brokerages Amsterdam - 21 st - 23 rd January 2015 ECSEL in 2015 Alun Foster Head of Plans and Dissemination ARTEMIS-IA and EPoSS Brokerages Amsterdam - 21 st - 23 rd January 2015 ECSEL in 2015 What is ECSEL about anyway? Call 2014 outcome Securing the

More information

Structural materials in energy

Structural materials in energy Structural materials in energy Survey answers Prof. Anne-Christine Ritschkoff Researcher Maria Oksa 3RD Worlds Materials Research Institute Forum, General Assembly Symposium on Materials Challenge for

More information