Recent Developments in Active Implants. Innovation of interconnections for Active Implant Applications
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1 Recent Developments in Active Implants Innovation of interconnections for Active Implant Applications
2 Valtronic s Overview 1) Introduction of Valtronic: from Micro-technology to Medtech 2) Active Implants: application of miniaturized assembly technologies 3) From industry to Medtech: adaptation to specific constrains
3 30 Years in Micro Technology 1990 Electronic Module for Discovery Space Shuttle 1995 Chip for Formula One race 2000 World's smallest hearing aid 2006 World's smallest implantable pulse generator 2006 Retinal Implant for the Blind 2009 "Smart Pill" Wireless Motility Capsule
4 Smart Implants What Do We Mean By Smart? An implant that is able to provide in-vivo diagnostic biofeedback and/or treat a patient according to specific conditions Microsystem measuring and transmitting diagnostic data during or after implantation Needs to function in an autonomous way during the lifespan of a product which varies from six months to over fifty years
5 Monitoring Diabetics Acquires, processes and analyzes brain activity Implantable EEG Recorder Minimal Power Consumption no battery Tiny antenna and extreme miniaturization (COC, COB and SMD) Assembled in a RF transparent, bio-compatible material housing Measures 4mm thick x 17 mm diameter
6 Treating Glaucoma Allows ophthalmologists to observe the behavior of intraocular pressure continuously, particularly during while sleeping Built-in flexible electronics, silicone, ultrasonic flip-chip process and clean manufacturing
7 Preventing Heart Failure Stimulate/pace the heart through wireless transmission of energy Implantable leadless cardiac pacing device for treatment of heart rhythm management Six-layer flex board, 2mil lines and spaces, ENEPIG process.
8 Smart Implant Challenges Packaging / enclosure Reliable Processes & Technology Powering & Autonomy Detection & Sensing & Memory Interaction Communication
9 Design Constraint Trends in Stimulation Field More specific stimulation features: More electrodes & leads Innovative electrode design Channel modulation Device as minimally invasive as possible: Smaller Implant size Smaller and reliable interconnections
10 Application of micro-technology assembly to Active implant device Long term reliability of assembly Extreme miniaturization High computation power at low power
11 Miniaturization of micro-elecronics Wire-bonding with over molding Ultrasonic Flip-Chip
12 Miniaturization - Wire-Bonding with Over Molding Chip on Board 1.- Glue on substrate (FR4, Flex, G10 etc.) 2.- Die attach 3.- Wire bonding & testing Internal electronic of a cochlear implant Chip-on-board assembly with 0201 components Product lifetime 75 years!. 4.- Coating & testing
13 Miniaturization - Ultrasonic Flip Chip Bonding Assembly of flexible electronics in a silicone rubber lens Clean manufacturing 10x faster than glued flip-chip Lowest total cost of ownership Allows ophthalmologists to observe the behavior of intraocular pressure during sleep.
14 Ultrasonic Flip Chip PCB track PCB DIE PCB Temperature + Pressure + Ultrasonic Power Underfill of non-conductive adhesive DIE DIE PCB PCB
15 High Density Ultra-Sonic Flip-Chip Process Gold Bumping Dispensing Ultrasonic Flip-Chip Applied to active Implant interconnection lead
16 High density Ultra-Sonic Flip-Chip Process Process Characteristics:
17 High Density Ultra-Sonic Flip-Chip Process
18 High Density Ultra-Sonic Flip-Chip process
19 Innovative Interconnection Technology means: Reducing the required volume for the implants Allowing innovative electrodes design Ensuring the liability for long term implantation
20 How to get from Industry to Medtech? Apply and adapt known technologies to new fields Adaptation to constrains : QA structure (ISO13485) EU/US regulation and norms application Clean Manufacturing Verified and validated processes Culture change Organization and business model adaptation Develop bridging technologies
21 Valtronic Core Competencies Contract Manufacturing & Engineering service for Medtechs SMT Fine pitch to D chip-scale Wire bonding to 55µ density Flip-chip <100µ pitch, HDI flex circuitry 5 axis CNC Machining, thread cutting, HSM PEEK, Titanium, Pe-Hd, Chrome Cobalt, POM World-wide Supply Chain DFM & DOE Final packaging, sterilization & labeling Project management
22 Valtronic at a Glance Today Valtronic is a full-service provider of Engineering, Design and Contract Manufacturing services. We provide solutions ranging from micro-electronic and mechanical parts to the design for manufacturing of complete devices. Dr. Peter Ruppersberg, CEO Engineering Staff 70 Production Staff 480 Manufacturing Area Served Markets No. of Class 3 Projects (active implant) m 2 of which 540 m 2 clean room (Class ISO 7 & 10K) Medical Devices (70%) and Select Industrial 22 projects in development, clinical trials or production
23 In conclusion The initial core competences in Ultra-miniaturized assembly technologies are adapted to be the driver bringing a high added-value to the Medtec world.
24 Thank you for your attention Route de Bonport 2 ~ 1343 Les Charbonnières ~ Switzerland ~ ~
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