From Technologies to Applications

Transcription

1 Laboratoire d électronique et de technologie de l information From Technologies to Applications J.R. Lèquepeys, Head of Silicon Component Division 2012 INTEL ERIC

2 AGENDA Brief overview of CEA-Leti Some of our technology roadmaps Leti plays a key role for boosting innovation through: Close partnership with industrial partners Startup creation INTEL ERIC

3 CEA-Leti The CEA at a glance Commissariat à l Énergie Atomique et aux Énergies Alternatives is one of the largest research organizations in Europe, focused on energy, health, information technologies, and national defense >16,000 People (10% PhD and Post Doc) 10 Research centers INTEL ERIC

4 CEA-Leti About Leti Founded in 1967 as part of CEA 1,700 researchers 210 PhD students + 30 post PhD with 85 foreign students (35%) 250 M budget ~ 30M CapEx Over 1,880 patents 273 generated in % under license CEO Dr. Laurent Malier 50 start-ups & 365 industrial partners INTEL ERIC

5 CEA-Leti Mission and Focus A single mission: Create innovation & transfer it to industry A clear focus: µ-nanotechnologies, with critical mass in Si Advanced devices for new applications Pilot Line Mass Production Applied Research Basic Research INTEL ERIC

6 CEA-Leti Cooperation model Corp Lab Proprietary Industrial R&D Business Units Disruptive concepts External Integration Lab New products Academic Lab Academic Lab Academic Lab Academic Lab Academic Lab Academia Lab Open INTEL ERIC

7 CEA-Leti Cooperation model and postionning Corp Lab Proprietary Industrial R&D Business Units Disruptive concepts Focus on IP Mix of precomp & comp External Integration Lab Pre competitive & generic focus New products Academic Lab Academic Lab Academic Lab Academic Lab Academic Lab Academia Lab Open INTEL ERIC

8 CEA-Leti A Complete Set of Research Platforms Nanotec 300 Advanced CMOS 200 MEMS 200 Nanoscale Characterization Smart Systems Integration Design Integrative Chemistry & Biology Photonics INTEL ERIC

9 CEA-Leti From Technologies to Applications CONSUMER AUTOMOTIVE SPACE & SCIENCE APPLICATIONS NEW PRODUCTS More Moore & More than Moore + IC Design + Embedded Software SECURITY & SAFETY ENERGY & ENVIRONMENT INDUSTRY & MEDICAL WIRELESS & SMART DEVICES INTEL ERIC

10 AGENDA Brief overview of CEA-Leti Some of our technology roadmaps CMOS, Memory, 3D, Sensors, Actuators, RF, Photonics, Power devices, Litho, Imagers, displays Leti plays a key role for boosting innovation through : Close partnership with industrial partners Startup creation INTEL ERIC

11 Roadmap CMOS activities and devices at Leti Nanowire for detection Electrode for actuation (111) Our main goal: find an alternative to planar Bulk with a good Speed/Power tradeoff: Variability reduced by 2 Speed improved by 30% Power consumption reduced up to 40% Functionality Memory Charge based envm Resistive envm Our vision Planar FDSOI is the right choice for 20 and 14nm: Simpler process than FinFET Excellent Speed/Power tradeoff Nanowire will emerge for 10nm Alternative 3D integration process for further scaling 3D Sensing Logic 20nm ssoi UTBOX 14nm 3D stacked devices Nanowires for sensors Nanowires Dual channel xssoi Si/SiGe nm (a)si NWs (b) Rectangular Si NW (c SiN HM NWs 20nm (001) 10nm 1 INTEL ERIC

12 Roadmap E-Memory activities at Leti Our main goal: Explore embedded non-volatile memory Reduced fabrication cost Reduced power consumption(10x) Reduced latency Increased endurance (reach 1e15) Device level Circuit level System level «Embedded resistive memories» One-to-one industrial collaborations Technologies: PCM, CBRAM, OxRAM, MRAM Objectives: Cost reduction, short latency, low power consumption, high endurance a Applications: Microcontrollers for automotive, smart cards & telecom Internal research program PhDs New applications Non volatile logic with resistive switching devices Applications: Reconfigurable circuits, resilient and non volatile logic circuits Objectives: to reduce circuit size, power consumption and delays New systems European and national projects Neuromorphic systems using resistive synapses Applications: vision, security, transport, robotics, computing, neurosciences Our vision: Resistive memories (as PCM, CBRAM, OXRAM and MRAM) can offer these advantages => back-end solutions, low-voltages, fast speed, high endurance, good reliability, high scalability INTEL ERIC

13 Roadmap 3D at Leti Roadmap for Silicon Demonstrators Si interposer TSV Ø10µm, 50µm pitch Mechanical Stress management modules (stress buffer, compliant int.) Specific packaging solutions Dicing, direct-on-board, biocompatibility TSV Cu Damascene line Bonding Thinning RDL Bumps TSV last Technology add-on Stacking Interconnects, underfill, P&P Core 3D Technology (200 & 300 mm) Silicon on Flex Modules Thermal management modules Modules for RF (integrated antenna) Bio Techno Modules Biocomp, Memory on Logic Logic-on-analog Logic-on-logic (Advanced on Mature) 3D Technology Toolbox 200 & 300 mm Active interposer (NOC interconnect) Modular and Stackable processor (NOC interconnect) Cache memory on many core (3D network-in-memory) Fine grain partitionning Pitch <10µm INTEL ERIC

14 Roadmap Sensor at Leti (M&NEMS Platform) MEMS size inertial mass + Nano-size piezoresistive gauge Miniaturized sensors Generic platform for sensor integration sensors fusion No parasitic sensitive An approach for low power consumption 3D Accelero 3D gyro 3D magneto Microphone & Pressure sens. All these sensors on the same die, with the same IC for readout INTEL ERIC

15 AGENDA Brief overview of CEA-Leti Some of our technology roadmaps Leti plays a key role for boosting innovation through: Close partnership with industrial partners Startup creation INTEL ERIC

16 A key partner With industrial Partners / Customers One-to-one collaboration Global Capabilities Dedicated personnel Research Proof-of-concept Prototypes Volume production Long-term IP approach and careful IPR management Common labs Access to Technological platforms Broad expertise provided INTEL ERIC

17 A key partner Transfer with industrial partners Our model for cooperation : Joint programs Joint teams Permanent & Continuous Transfer License Agreement Win-Win partnership INTEL ERIC

18 A key partner Main Industrial transfers in microelec. /microsystems INTEL ERIC

19 A key partner Open Collaboration with World Class Academia Partners Cambridge Berkeley Caltech IBM (Albany, Fishkill) Network of Carnot institutes (CSEM, FhG, VTT) HTA a technology one stop-shop for industry Tokyo Institute of Technology MicroMachine Center Tsukuba Innovation Arena partners : AIST, NIMS, Tsukuba University Leti: the gateway for greater access to technology thanks to world class links with academia and Research Labs INTEL ERIC

20 Key Accomplishments Industrial Transfer TSV Camera for Mobile Phone VGA (300kpixels) Camera size evolution 3D impact on Embedded Cameras Image S Megapixel Image S Megapixel Module final S 754 INTEL ERIC

21 Key Accomplishments Industrial Transfer Bolometer based Infrared Detector Arrays Pixel 17µm transferred Pixel 12µm demonstrated Wafer Pixel Packaging NETD = 50 mk Mechanical holder Detector to read-out circuit contact pad Thermal insulation CMOS readout circuit Amorphous Silicon Reflector Commercial product 640 x µm INTEL ERIC

22 Key Accomplishments Industrial Transfer 125Mb/s RFID for remote powering High Capacity Data Storage Coupling RFID (UHF & 13.56MHz) and UWB impulse radio Data rate from 54 to cm Power consumption: 5mW Chip area: 4mm² ST CMOS 130nm, 1.2V VLSI 10 Nokia World 09 Nokia World 11 JSSC 12 Download time of 10s for a 1 Gigabit of content from battery-less memory tags INTEL ERIC

23 Key Accomplishments Industrial Transfer DNA detection and IR Camera used for flu detection (Avian flu, H1N1 flu) INTEL ERIC

24 Key Accomplishments Industrial Transfer Accelerometers (automotive market) low G accelerometer On-Chip-Sealing on 200 mm 640 SOI wafers processed in LETI INTEL ERIC

25 Key Accomplishments Industrial Transfer 3D Stacking Memory on logic Wide I/O demonstrator (application smartphone) Array of ~1000 TSVs Memory Array of ~1000 bumps 4 x 200MHz 12.8GBps Leti Mag 3D platform Array of ~1000 TSVs Channel 0 Channel 1 Bank 0 Bank 2 Bank 0 Bank 2 Bank 1 Bank n Bank 1 Bank n Memory Array of ~1000 µ- bumps 4 x 200MHz 12.8GBps Bank 0 Bank 2 Bank 0 Bank 2 Bank 1 Bank n Bank 1 Bank n Channel 2 Channel 3 INTEL ERIC

26 Key Accomplishments Industrial Transfer 3D High Density Interposer Ligne 2 Ligne 1 Via TSV 10x100µm 100 µm thick interposer 10 µm diameter TSV intercos / Chip 0.5 µm resolution RDL Available 200mm Transfer to 300mm running INTEL ERIC

27 Key Accomplishments Industrial Transfer Micro-displays for embedded entertainment Pixel size = 3µm Embedded color filters Collective packaging 1 Mpixel RGB Above CMOS OLED displays: A low-power solution HD-TV compatible A natural 3D-view extension Colored filters Collective packaging cathode OLED anode Metal CMOS Substrat Si INTEL ERIC

28 Key Accomplishments Industrial Transfer New generation of pacemaker 2 Functionalized surface sensor driver RF Cardiac Rhythm Management (CRM) 1 hermeticity Multi-connecting 1. Heart activity measurement Ventricular micro-probe: Asic + MEMS accelerometer 2. Heart activity stimulation peripheral Asic + electrodes 3. Ultra Low Power RF Links High integration Reliability Full hermeticity Blood biocompatibility High autonomy RF Link 3D for integration PICS RF Die PICS ~1.2mm ~900um INTEL ERIC

29 Transfers Key dates Key Accomplishments Industrial Transfer MEMs: 28 years of industrial transfer Comb drive accelero patent Surface micromachining Above IC MEMS demonstration M&NEMS concept NEMS for gas detection MEMS technology bulk technology Waferscale packaging Thin film packaging «Intra-CMOS» demonstration year Quartz accelerometer Weight sensor Hygrometer Pressure sensor Pacemaker accelerometer Geophone Accelerometer Inertial platform Startup LETI / Caltech Alliance NanoSystems Partnership Common lab. Startup APIX INTEL ERIC

30 AGENDA Brief overview of CEA-Leti Some of our technology roadmaps Leti plays a key role for boosting innovation through : Close partnership with industrial partners Start-up creation INTEL ERIC

31 Leti, 45 years of history INTEL ERIC

32 ACQUIRED (20%) DISCONTINUED (20%) Leti, 50 start-ups created START-UPS CREATION: An efficient way to transform ideas/technologies into value/jobs INTEL ERIC