MID, Flexible Circuits or Printed Circuit Boards? Technology Selection Based on Virtual Prototypes. 1 MID Congress 2010

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1 1 MID Congress 2010

2 Company Overview Company history 07/2003: Foundation by Dr. Thomas Krebs 09/2006: Named FlowCAD as distributor Product NEXTRA Innovative product technology Industries: Transportation, Consumer Electronics, Medical, IT, Industrial, Defense Background: CAD Experience e since 1985 Manufacturing & IT Brand mark NEXTRA Registered mark (EU, US) Patent for flex design process Partnerships FAPS Cadence (Connections Program) Spatial Technology (Dassault Systemès) IZM (Fraunhofer Gesellschaft) LPKF Essemtec 2 MID Congress 2010

3 Collaboration process with separated CAD systems in electronic and mechanical design Mechanical Design Electronic Design design of the mechanical environment definition of available space collision detection FEM analysis simulations (vibrations etc.) 2d board outline formats: IDF, IGES, DXF, STEP component positions transfer of 2d board outline placement of components routing simulation (function, ESD, thermal etc.) movement of critical components component positions take-over of replaced component positions re-routing reiterated simulations 3 MID Congress 2010

4 Supported Technologies Product Technologies Supported by NEXTRA Planar Circuit Carriers single or multi layer pcb and hybrids Multi board support Flexible Carriers (Foils) flexible flat cable (FFC) rigid-flex carriers (various stackups in different areas of the board) MID Laser Direct Structuring Placement and Routing CAM Output LDS Insertion in preparation: stamped sheet metal, wire harness, etc. 4 MID Congress 2010

5 Di Driving i Data for Mechatronical llayout tdesign Components Connectivity Design Technology Part Number Footprint (internal) Logic Pins Nets (component pins) Net properties (line widths) MID: LDS/Two-shot/Hot-Embossing Flex/Rigid-Flex: Number of layers, foil thickness, Planar: Stack-Up, Line widths, Electrical: High-speed, Antenna, 5 MID Congress 2010

6 Integration ti of NEXTRA in EDA systems Cadence Allegro/Orcad netlist, pcb-layout library and autorouter Mentor Graphics Expedition/BoardStation/PADS (AutoActive ) netlist, pcb-layout library and autorouter NEXTRA Zuken Visula/CR-5000/CadStar netlist, pcb-layout library and autorouter 6 MID Congress 2010

7 Design input into NEXTRA (Electronics) Import 2D PCB Design Data (Layout) Nextra Design (Planar Carrier) Design Data Courtesy of Wiesauplast Nextra imports all technology (e.g. board stack-up) component (e.g. footprint) and connectivity (netlist) data 7 MID Congress 2010

8 Design input into NEXTRA (Mechanical) Import 3D Mechanical Data Pro/Engineer Catia V4/V5 Siemens PLM NX STEP IGES Nextra Design plus 3D Geometry 3D Geometry can be used as MID substrate Delete planar board Project components onto MID substrate Place Components Route 8 MID Congress 2010

9 Finish i Design Layout on MIDs using NEXTRA Layout Creation Place components on any surface of the carrier as you like Route connections over any surface DRC check (line clearances ) Replace component block geometries with detailed 3D geometries Create copper outlines of all nets to be transferred to LDS machines 9 MID Congress 2010

10 Usage or Definition iti of Flex Carrier Import 3D Mechanical Data of Flex Bent Sheet or Flat Contour to be bend in NEXTRA Nextra Design plus 3D Geometry 3D Geometry can be used as MID substrate Delete planar board Project components onto MID substrate Place Components Route 10 MID Congress 2010

11 Transfer 2D Planar Layout onto Flex Carrier Overlay flex carrier contour over planar carrier in 2D and get your layout transferred onto 3D flex substrate! Layout design Route design Transfer to and from 2D pcb system 11 MID Congress 2010

12 Stack-Up Examples for Rigid-Flex id Carriers (Cross-Section) One Central Foil Different Connecting Foils Bookbinder Technology Copper Foil / Laminate 12 MID Congress 2010

13 Stack-Up Creation for Rigid-Flex id Carriers Derive technology based on stack-up that contains all layers to be used in the rigid-flex id carrier. Keep compatibility with 2D pcb design 2D design must have defined superset of all layers Each stack-up defines a consecutive list of layers Carrier stack-up assembles stack-ups by layer names 13 MID Congress 2010

14 Rigid-Flex id Carrier Creation using Defined Stack-Ups Rigid-Flex carrier creation Define areas for different stackups Default: Use superset stack-up for planar areas and derived stack-up for bent areas Assign stack-up to areas as wanted NEXTRA creates rigid-flex carrier from bent sheet (thickness 0!) taking into account thicknesses of each area and resulting displacements! Unfolding rigid-flex carriers unfolds as putting rigid-flex carrier onto a plane. Contour of rigid-flex differs from sheet body! 14 MID Congress 2010

15 Compare Realization Alternatives ti for One Design Integrate Electronic into Electromechanical Assembly Are requirements of integration and miniaturization met? Can electromechanical components e.g. connectors be avoided? Is a subdivision into multiple boards necessary? Can cables be avoided? Is assembly feasible? Cost vs. Performance Is price/cost of pcb relevant due to lot size and allover module cost? Does lot size pay out a mold tool? Does Technology meet requirements? Are requirements of temperature operation conditions met? Does technology meet assemble/disassemble cycles? Does fatigue impact technology selection? 15 MID Congress 2010

16 Thank you for your attention 16 MID Congress 2010

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