Titre: Required Information For Submitting Databases to TELEDYNE DALSA Design & Product Support. Document : DES-0002.11 Création du document : December 22th, 2004 Bromont, Québec, Canada
2 DE 7 Database Submission Form Please refer to DES-0001 Terms and Conditions For Submitting Databases to TELEDYNE DALSA Design and Product Foundry Support for more information. Company Name: Contact Name: Contact Phone : Contact Email Address: Alternate Contact Name: Alternate Contact Phone : Alternate Contact Email Address: DALSA Process Family Used: CMOS Select the right process family. Technology To Be Used : 0.5um Select the right technology Chip 1 Customer Device Code : File Name : Top Structrure Name : Customer Device Code : File Name : Top Structrure Name : Customer Device Code : File Name : Top Structrure Name : Chip 2 Chip 3 Special Data Generation Required? If Yes, Please explain: No Select the right option. Magnification or Shrink Required? If Yes, Please explain: No Select the right option. Layout orientation change required? If Yes, Please explain: No Select the right option. Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: / Special Instructions
3 DE 7 - Please provide the number (s), for each mask level or design aid layers in the tables below. - Please indicate if the mask(s) need to be made or revised, indicated the Yes or No in column. - All numbers within the submitted database should be accounted for. Use the table provided in Varia Layer Table to list any mask levels not present in the tables below or to list any design aid layers which should be used by TELEDYNE DALSA to generate mask data. - If a TELEDYNE DALSA Design Kit as be used, consult the chapter in the User Guide document for specific tehnology. CMOS / HV CMOS Layer Table 10 P-Well 11 N-Well 12 HV_Def 16 HV_Well 18 N-Base 20 Active Area 21 P-Field 22 N-Field 24 Vtn Adjust 25 Vtp Adjust 26 Vtp Adjust 2 28 P-Base 29 Poly Cap Hi Res 30 Poly Gate 33 P-Buried 35 Poly Gate Hi Res 40 N+ Diffusion 41 N- Extended 44 N-DDD or LDD Implant 50 P+ Diffusion 51 P-Extended 52 P-Top 53 Poly Cap 58 Poly 3 59 P-DDD / LDD Implant 60 Contacts 70 Metal 1 76 Vias 1 77 Metal 2 80 Pads 86 Vias 2 87 Metal 3 96 Vias3 97 Metal 4 -- DRL -- HV Marker
4 DE 7 CCD Layer Table 02 Zero 10 Well 11 Well 2 / Barrier 0 12 Well 3 / HV_Definition 20 Active Area 23 Poly 0 27 Buried Channel 1 Implant 28 Buried Channel 2 Implant 29 Channel Stop Implant 30 Poly1 31 AB Implant / Nitride Definition 32 Poly 1 Repair 35 Poly 1 HiRes 40 Source / Drain Implant 41 PPD Implant 43 PPD Implant 2 50 Top Side Contact Implant 51 PPD Implant 3 52 Barrier 1 53 Poly 2 54 Nitride Definition 3 55 Poly 2 Repair 56 Barrier 2 57 Buried Contact / Nitride Definition 2 58 Poly 3 59 Nitride on Poly 60 Contacts 61 Contacts 2 65 Poly 3 Repair 70 Metal 1 75 Metal Resistor 76 Vias 1 77 Metal 2 or Lightshield 80 Pads 83 Green Filter 84 Blue Filter 85 Red Filter 86 Vias 2 87 Metal 3 90 Flood 95 Microlens 96 Vias 3 97 Anti Reflective 99 Pads for Microlens
5 DE 7 MEMS Layer Table 01 Marker 02 Zero 04 Clear Out 05 Locos 1 06 Locos 2 10 P-Well 11 N-Well / Buried Layer 12 HV_Defenition 13 Crystal Revealtant 15 Isolation 16 HV_Well 17 Trench 18 Nitride Etch 0 19 Nitride Etch 1 20 Active Area 21 P-Field 24 Vtn Adjust 25 Vtp Adjust 26 Vt Adjust 2 27 Trench 2 / Capacitor Implant 28 P-Base 29 Poly Cap Hi Res / Isolation 30 Poly Gate / Poly 1 31 Anchor 0 32 Poly 0 33 P-Buried 34 Dimple 35 Poly Gate Hi Res 36 Anchor 1 37 Poly 1 38 Mechanical Frame 39 Poly Via 40 N+ Diffusion 41 N- Extended 42 Anchor 2 43 Poly 2 47 Anchor 3 48 Poly 3 50 P+ Diffusion 52 P-Top / P- Resistor 53 Poly Cap / Poly 2 54 Bond Adjust 55 Diaphragm 56 Capacitor 57 SiCr Reistor 58 Poly Resistor / Barrier 60 Contacts 61 Contatcs 2 64 Waveguide / Grating 70 Metal 1 74 Etch Stop 75 Getter
6 DE 7 76 Vias 1 77 Metal 2 80 Pads 82 Pads 2 84 Polarisation Compensation 85 Seal Ring 86 Vias 2 87 Metal 3 88 Open 90 Gold Bond Pad 94 Cap Cavity / Aluminium Reflective Coating 95 Cavity 96 Vias 3 97 Metal 4 99 HF_Shield
7 DE 7 Varia Layer Table