PC85XJF Series/PC85XJF Series PC85XJF Series PC85XJF Series DIP pin Darlington Phototransistor Ouput, High Collector-emitter Voltage Photocoupler Description PC85XJF Series/PC85XJF Series contains an IRED optically coupled to a phototransistor. It is packaged in a -pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.kV. Collector-emitter voltage is 5V and CTR is MIN. % at input current of ma. Agency approvals/compliance. Recognized by UL577, file No. E68 (as model No. PC85/PC85). Approved by VDE, DIN EN677-5- (*) (only for PC85XJF series as an option), file No. 887 (as model No. PC85). Package resin : UL flammability grade (9V-) (*) DIN EN677-5- : successor standard of DIN VDE88 Features. pin DIP package. Double transfer mold package (Ideal for Flow Soldering). High collector-emitter voltage (V CEO : 5V). Durlington phototransistor output (CTR : MIN. % at I F =ma, V CE =V) 5. Large collector power disspation : PC85XJF (P C : mw) 6. High isolation voltage between input and output (V iso(rms) : 5kV) 7. Lead-free and RoHS directive compliant Applications. Telephone line interface/isolation. Interface to power supply circuit. Controller for SSRs, DC motors Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D-AEN Date Jun.. 5 SHARP Corporation
PC85XJF Series/PC85XJF Series Internal Connection Diagram 5 Anode Cathode Emitter Collector Outline Dimensions PC85XJF Series. Through-Hole [ex. PC85XJF] Anode mark. ±..6 ±. PC85 6.5 ±.5 Factory identification mark Date code.5 ±.5.58 ±.5 7.6 ±..58 ±.5 (Unit : mm). Through-Hole (VDE option) [ex. PC85XYJF]. ±. Anode mark.6 ±. SHARP mark "S" PC85 6.5 ±.5 Factory identification mark Date code.5 ±.5.58 ±.5 VDE identification mark 7.6 ±..58 ±.5.5 ±.5.5 TYP..5 ±.5 Epoxy resin.6 ±. θ θ θ : to Product mass : approx..g.7 ±.5.5 TYP.. ±.5.5 ±. Epoxy resin.6 ±. θ θ : to θ Product mass : approx..g.7 ±.5. ±.5.5 ±.. SMT Gullwing Lead-Form [ex. PC85XIJF]. ±. Anode mark.6 ±..6 ±.. +. PC85 6.5 ±.5 7.6 ±. Epoxy resin. +.5 Factory identification mark Date code.5 ±.5.5 ±.5. +..58 ±..5 ±.5.58 ±.5.5 ±.5. SMT Gullwing Lead-Form (VDE option) [ex. PC85XPYJF]. ±. Anode mark.6 ±..6 ±.. +. SHARP mark "S" PC85 6.5 ±.5 7.6 ±. Epoxy resin. +.5 Factory identification mark Date code.5 ±.5.5 ±.5. +..58 ±. VDE identification mark.5 ±.5.58 ±.5.5 ±.5 Product mass : approx..g Product mass : approx..g Plating material : SnCu (Cu : TYP. %) Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series PC85XJF Series. Through-Hole [ex. PC85XJF] Anode mark. ±..6 ±. PC85 Factory identification mark Date code.58 ±.5 (Unit : mm). SMT Gullwing Lead-Form [ex. PC85XIJF] Anode mark Factory identification mark. ±..6 ±. PC85 Date code.58 ±. 6.5 ±.5.5 ±.5 6.5 ±.5.5 ±.5 7.6 ±..58 ±.5 7.6 ±..58 ±.5 Epoxy resin.6 ±. θ θ θ : to Product mass : approx..g.7 ±.5. ±.5.5 ±.5.5 TYP..5 ±..6 ±.. +. Epoxy resin. +.5 Product mass : approx..g.5 ±.5. +..5 ±.5.5 ±.5 Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Date code ( digit) st digit Year of production nd digit Month of production A.D. 99 99 99 99 99 995 996 997 998 999 Mark A B C D E F H J K L M N A.D 5 6 7 8 9 Mark P R S T U V W X A B C Month January February March April May June July August September October November December Mark 5 6 7 8 9 O N D repeats in a year cycle Factory identification mark Factory identification Mark no mark Country of origin Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark There is no rank mark indicator. Sheet No.: D-AEN
Absolute Maximum Ratings (T a =5 C) Parameter Symbol Rating PC85XJF PC85XJF Unit Forward current I F 5 ma * Peak forward current I FM A Reverse voltage V R 6 V Power dissipation P 7 mw Collector-emitter voltage V CEO 5 V Emitter-collector voltage V ECO. V Collector current I C 5 ma Collector power dissipation P C 5 mw Total power dissipation P tot mw * Isolation voltage V iso (rms) 5. kv Operating temperature T opr to + C Storage temperature T stg 55 to +5 C * Soldering temperature T sol 6 C Input Output * Pulse width µs, Duty ratio :. * to 6%RH, AC for minute, f=6hz * For s PC85XJF Series/PC85XJF Series Electro-optical Characteristics Parameter Symbol Conditions MIN. TYP. MAX. Input Forward voltage Reverse voltage Terminal capacitance V F I R C t I F =ma V R =V V=, f=khz.. 5 Output Collector dark current I CEO V CE =V, I F = Collector-emitter breakdown voltage BV CEO I C =.ma, I F = 5 Transfer characteristics Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Cut-off frequency I C V CE (sat) R ISO C f f C I F =ma, V CE =V I F =ma, I C =ma DC5V, to 6%RH V=, f=mhz V CE =V, I C =ma, R L =Ω, db 5.6 7 5.. Rise time t r Response time V CE =V, I C =ma, R L =Ω Fall time t f (T a =5 C) Unit V µa pf na V ma V Ω pf khz µs µs 5 Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Model Line-up PC85XJF Series Lead Form Package DIN EN677-5- Model No. PC85XJF Series - PC85XJF Through-Hole Sleeve pcs/sleeve Approved PC85XYJF - PC85XIJF SMT Gullwing Taping pcs/reel - PC85XPJF Approved PC85XPYJF Lead Form Package DIN EN677-5- Model No. Through-Hole Sleeve pcs/sleeve SMT Gullwing Taping pcs/reel - PC85XJF - PC85XIJF - PC85XPJF Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D-AEN 6
PC85XJF Series/PC85XJF Series Fig. Forward Current vs. Ambient Temperature 6 Fig. Diode Power Dissipation vs. Ambient Temperature Forward current IF (ma) 5 Diode power dissipation P (mw) 8 7 6 5 5 75 5 Ambient temperature T a ( C) 5 5 55 75 5 Ambient temperature T a ( C) Fig.-a Collector Power Dissipation vs. Ambient Temperature (PC85XJF) Fig.-b Collector Power Dissipation vs. Ambient Temperature 5 (PC85XJF) Collector power dissipation PC (mw) 5 5 Collector power dissipation PC (mw) 5 5 5 Fig. Total Power Dissipation vs. Ambient Temperature Total Power dissipation Ptot (mw) 5 5 5 75 5 Ambient temperature T a ( C) PC85XJF PC85XJF Fig.5 Peak Forward Current vs. Duty Ratio Peak forward current IFM (ma) 5 5 75 5 Ambient temperature T a ( C) Pulse width µs T a=5 C 5 5 75 5 Ambient Temperature T a ( C) Duty ratio 7 Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Fig.6 Forward Current vs. Forward Voltage Forward current IF (ma) T a =75 C 5 C 5 C C 5 C Fig.7-a Current Transfer Ratio vs. Forward Current Current transfer ratio CTR (%) 5 (PC85XJF) V CE =V T a =5 C.5..5..5..5. Forward voltage V F (V) Forward current I F (ma) Fig.7-b Current Transfer Ratio vs. Forward Current Current transfer ratio CTR (%) 5 V CE =V T a =5 C (PC85XJF) Fig.8-a Collector Current vs. Collectoremitter Voltage Collector current IC (ma) I F =ma 5mA ma.5ma ma ma.5ma (PC85XJF) T a =5 C P C (MAX.)..5mA 5 Forward current I F (ma) Collector-emitter voltage V CE (V) Fig.8-b Collector Current vs. Collectoremitter Voltage Collector current IC (ma) I F =ma 5mA ma.5ma.5ma (PC85XJF) ma ma T a =5 C P C (MAX.) Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Relative current transfer ratio (%) 5 5 I F =ma V CE =V.5mA 5 6 8 Collector-emitter voltage V CE (V) Ambient Temperature T a ( C) 8 Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Fig. Collector - emitter Saturation Voltage vs. Ambient Temperature Collector-emitter saturation voltage VCE (sat) (V)..8.6.. 6 8 Ambient temperature T a ( C) I F =ma I C =ma Fig. Response Time vs. Load Resistance Fig. Collector Dark Current vs. Ambient Temperature Collector dark current ICEO (A) 5 6 7 8 9 V CE =V 6 8 Ambient temperature T a ( C) Fig. Test Circuit for Response Time Response time (µs) V CE =V I C =ma T a =5 C t r t f t d t s Input R D R L V CC Output Input Output V CE t d t r Please refer to the conditions in Fig.. t s t f % 9%.. Load resistance R L (kω) Fig. Frequency Response Voltage gain Av (db) 5 5 5 R L =kω Ω Ω. Frequency f (khz) V CE =V I C =ma T a =5 C Fig.5 Collector-emitter Saturation Voltage vs. Forward Current Collector-emitter saturation voltage VCE (sat) (V) 5 I C =5mA ma ma 5mA 7mA ma 5 Forward current I F (ma) T a =5 C Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. 9 Sheet No.: D-AEN
Design Considerations Design guide While operating at I F <.ma, CTR variation may increase. Please make design considering this fact. PC85XJF Series/PC85XJF Series This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (5% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 8..7.5. (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D-AEN
Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. ( C) PC85XJF Series/PC85XJF Series Terminal : 6 C peak ( package surface : 5 C peak) Preheat 5 to 8 C, s or less Reflow C or more, 6s or less (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 7 C and within s. Preheating is within the bounds of to 5 C and to 8s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within s when the point of solder iron is below C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Cleaning instructions Solvent cleaning: Solvent temperature should be 5 C or below Immersion time should be minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride,..-trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (/95/EC). Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. sleeves in one case. Sleeve outline dimensions. 5 ± 5.8.8 6.7 (Unit : mm) Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G I J H H A B C K C D E Dimensions List A B 6. ±. 7.5 ±..75 ±. 8. ±. H I J K. ±.. ±.5. ±. 5. ±.. ±. 5 MAX. (Unit : mm) F G. ±. φ.5 +. Reel structure and Dimensions e d g c a f b Dimensions List (Unit : mm) a b 7.5 ±.5 c ±. d ±.5 e ±. f. ±.5 g. ±.5 Direction of product insertion Pull-out direction [Packing : pcs/reel] Sheet No.: D-AEN
PC85XJF Series/PC85XJF Series Important Notices The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E] 5 Sheet No.: D-AEN