Improving Efficiency of Synchronous Rectification by Analysis of the MOSFET Power Loss Mechanism



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Improving Efficiency of Synchronous Rectification by Analysis of the MOSFE Power Loss Mechanism Infineon echnologies Austria AG Power Management & Multimarket Mößlacher Christian Guillemant Olivier

Edition 01-03-16 Published by Infineon echnologies Austria AG 9500 Villach, Austria Infineon echnologies Austria AG 01. All Rights Reserved. Attention please! HE INFORMAION GIVEN IN HIS APPLICAION NOE IS GIVEN AS A HIN FOR HE IMPLEMEN- AION OF HE INFINEON ECHNOLOGIES COMPONEN ONLY AND SHALL NO BE REGARDED AS ANY DESCRIPION OR WARRANY OF A CERAIN FUNCIONALIY, CONDIION OR QUALIY OF HE INFINEON ECHNOLOGIES COMPONEN. HE RECIPIEN OF HIS APPLICAION NOE MUS VERIFY ANY FUNCION DESCRIBED HEREIN IN HE REAL APPLICAION. INFINEON ECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANIES AND LIABILIIES OF ANY KIND (INCLUDING WIHOU LIMIAION WARRANIES OF NON-INFRINGEMEN OF INELLECUAL PROPERY RIGHS OF ANY HIRD PARY) WIH RESPEC O ANY AND ALL INFORMAION GIVEN IN HIS APPLICAION NOE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon echnologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon echnologies Office. Infineon echnologies Components may only be used in life-support devices or systems with the express written approval of Infineon echnologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN 01-03 Revision History: date (16-03-01), V. Previous Version: V.1 Subjects: Improving Efficiency of Synchronous Rectification by Analysis of the MOSFE Power Loss Mechanism Authors: Christian Mößlacher, Olivier Guillemant, Power Management & Multimarket We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [guillemant.olivier@infineon.com]

able of contents 1 Abstract... 4 Introduction... 4 3 Analyzing the turn off behavior of the SR MOSFE... 5 4 Development of a power loss model... 7 5 Reverse recovery charge of the body diode... 10 6 Optimizing SR MOSFE for efficiency... 11 7 Conclusion... 13 8 References... 14 3

1 Abstract Driven by the 80 PLUS [1] program the overall system efficiency in switched mode power supplies (SMPS) is targeting 90%. he main losses are the high diode forward losses of the secondary side rectification of an isolated converter. Reaching this efficiency level is therefore only possible with synchronous rectification (SR). For achieving ideal switching behavior, the power loss mechanism of a SR MOSFE has to be well understood. his paper analyzes the turn off process of the SR MOSFE and proposes a simple model for calculating the power losses to optimize the system efficiency. Introduction aking a look into a switched mode power supply, a rectification stage can be found on the secondary side of the converter. he task of this stage is to rectify the rectangular power signal, which is being transferred from the primary side to the secondary side of the SMPS via a transformer. ypically this rectification is done with power diodes (see Fig. 1). But due to the forward voltage drop of the diodes (0.5V and higher) combined with the high output currents, these devices produce high conduction losses and therefore have a major contribution to the efficiency of the whole converter. o minimize these rectification losses, the diodes can be replaced with modern power MOSFEs, which tremendously reduces conduction losses L D D C Uout GND Q L Q C Uout GND Fig. 1. Synchronous vs. diode rectification. especially at high output currents. Considering low load efficiency, not the conduction losses but the switching losses are in the main focus. hese are considerably higher compared to diodes. 4

Other important effects on system efficiency come from the gate drive and the snubber network for damping the turn-off voltage spike. As this system is very complex, the correlation of all parameters in respect to each other has to be well understood for optimizing the system efficiency. [] [3] 3 Analyzing the turn off behavior of the SR MOSFE o understand the turn-off process of a SR switch, a schematic diagram of the most important waveforms is shown in Fig.. he starting point for the analysis is the on state of the switch: gate voltage is at high level, drain-source voltage is almost zero and a current is flowing from source to drain. At point 1 the gate is turned off. his can also be seen in the U DS waveform in form of a little negative voltage dip coming from the discharge of the gate capacitance C G. his discharge produces a current peak with a high di/dt in the source connection of the MOSFE. Due to the inductive law di L dt U L = (1) this inductance in the source leads to a voltage drop in the U DS waveform. At point the MOSFE channel closes, but nevertheless the current has to keep on flowing, driven by the output choke. 5

his forces the current to commutate to the body diode of the MOSFE, resulting in a negative voltage drop U D over the switch. In Fig. this time slot is marked with t D. After switching the primary side at point 3, the current has to ramp down. If the switching of the primary side MOSFEs is fast, current commutation is limited by the secondary side loop inductances, resulting in a constant di/dt. In this phase t ramp a voltage drop, caused by the source inductance of the MOSFE, can be seen in the drain-source waveform, now into the positive direction due to negative di/dt. When the current crosses the zero line (4), no current is flowing any more through the body diode. herefore the forward voltage drop over the diode becomes zero, resulting in a further positive voltage drop at the U DS waveform with the value of the forward voltage drop of the body diode U D. After the zero crossing the current keeps on flowing with the same di/dt. But now the direction of the current is negative, removing the reverse recovery charge Q * rr of the body diode and charging the output capacitance C oss of the MOSFE. In this case the Q * rr is considered as only the MOSFE body diode reverse recovery charge, whereas the Q rr on datasheets is measured according to JEDEC standards and therefore contains besides the body diode Q * rr also some part of the output charge of the MOSFE Q oss (more details in section 4). While the C oss is being charged, the voltage over the MOSFE begins to rise towards the transformer voltage. In point 5 the maximum reverse current I rev_peak is reached, this means the C oss is now charged up to the transformer voltage. Ideally the system should now be stable, but there is still energy in the system defined by E ind 1 = Lstray Irev _ peak () his inductive energy is now triggering a LC oscillation circuit and forcing the stored energy in the stray inductances L stray to be transferred to the output capacitance of the MOSFE and therefore producing the turn off overvoltage spike. he LC circuit is defined by the inductance of the transformer, the layout, the package and the MOSFE C oss as seen in Fig. 3. Q on L drain L source L PCB C oss Lout U out Ltransformer ringing circuit C out L PCB C oss L out GND L drain L source Q off Fig. 3. LC turn-off oscillation circuit in a current doubler SR. 6

his circuit has an oscillation frequency of f 1 = π L stray C oss 0 (3) and is damped by the parasitic resistances in the loop (C oss = output capacitance of the MOSFE and L stray = L source + L drain + L PCB + L transformer ). his discussed shape of the waveform is only valid if the current commutation on the secondary side is inductively limited. his means, the di/dt is not limited by the switching speed of the primary side MOSFEs, but by the stray inductances on the secondary side of the power supply. 4 Development of a power loss model For the design of a high efficient power supply using SR, it is necessary to exactly know where the power losses in the SR MOSFE are generated. In the following all important sources of power losses are identified, based on ideal MOSFE switching behavior. Conduction losses are defined by the R DS(on) of the MOSFE. he calculation can be done with the following formula: P cond = I RMS RDS ( on) (4) Here the I RMS is the triangular current through the MOSFE, not the output current of the converter. For assuring an interlock between the two SR MOSFEs to avoid a current shoot through, a certain dead time has to be guaranteed. herefore the respective MOSFE has to be switched off before the primary side is turned on. his causes the current to commutate from the MOSFE channel to the MOSFE body diode, which can be seen in a negative voltage drop over drain source (Fig. 1). he time is called body diode on time t D. he calculation of the diode power loss can be done by using following parameters: forward voltage drop of the body diode U D, the source to drain body diode current I SD, the body diode on time t D and the converter switching frequency f sw : P diode = U D I SD td fsw (5) 7

Gate drive losses of the SR MOSFE are defined by the gate charge Q g, the gate driving voltage U g and the switching frequency f sw : P gate = Qg U g fsw (6) hese losses are generated due to the gate charge of the MOSFE, but they are dissipated in the gate resistor and the gate driver. he output charge Q oss and the reverse recovery charge Q * rr also produce losses while turning off the SR MOSFE. his formula can be derived from a simplified model of the turn-off behavior (Fig. 4). Upeak Icomm UDS Utrafo di/dt=const Q oss Q * rr ID time Irev_ peak t Ipeak t Upeak t rev Fig. 4. Simplified model of the SR MOSFE turn-off. By using the following approximations, a triangular shape of the current waveform and a constant output capacitance of the MOSFE, a calculation of the turn off energy can be done. he triangular shape of the current waveform can be assumed if the current commutation is inductively limited, which is the case for most applications. o calculate the equivalent constant capacitance C const of the MOSFE at a certain transformer voltage U, the time variant nonlinear output capacitance c oss(t) has to be known: Q oss U U 1 = coss const const U 0 ( t) u( t) dt = U C C = c ( t) u( t) dt 0 oss (7) 8

For calculating the turn-off switching losses, first the reverse current peak I rev_peak has to be fixed: I rev di _ peak trev trev = dt I rev _ peak = (8) di dt he di/dt can be calculated by using the transformer voltage and the inductances in the current commutation loop: di dt U = (9) Lstray Now the switching charge Q sw =Q oss +Q rr * can be evaluated: Q sw Irev _ peak trev Irev _ peak = = Irev _ peak = Q di / dt sw di dt (10) From this derivation the inductive switching energy is calculated: E ind = 1 L stray I rev _ peak = L stray di Q dt sw E sw = U Q sw (11) Looking at the point t Ipeak an inductive energy is stored in the stray inductances and a capacitive one in the C oss. As a result an energy comparison can be done: E lost E = E lost ind = U E * cos s = U ( Qoss + Qrr ) * ( 1 Q + Q ) oss rr 1 C oss U (1) his energy is then transferred to the output capacitance of the MOSFE (Fig. 4), there it produces an overvoltage spike and then gets dissipated through the resistive part of the LC oscillation circuit (Fig. 1, point 6). Consequently, the switching-off power losses are fixed: P sw = U * ( Qoss + Qrr ) fsw 1 (13) 9

he accuracy of this calculation depends on the switching behavior of the MOSFE. It has to be assured that no second order effect like dynamic turn-on or avalanche is occurring. Furthermore best results are achieved for hard switched topologies. Any resonant soft switching topology may lead to a deviation. In this case the MOSFE can be optimized for lower R DS(on), as some part of the switching energy can possibly be recovered. 5 Reverse recovery charge of the body diode he internal body diode of a MOSFE plays an important role if an optimization regarding efficiency has to be done. As it is typically flooded with current every switching cycle before the MOSFE gets turned off, a reverse recovery charge Q rr * is being build up. Already mentioned in section 3, the real Q rr * is not adequately represented by the Q rr on datasheets. Datasheet values are measured with a di/dt of 100 A/µs, the diode is applied with the maximum drain current and the conduction time before turn off is in the range of up to 500 µs and more. his leads to a maximum possible Q rr *. Furthermore the measurement method of the JEDEC standard includes besides the Q rr * also some part of the output charge of the MOSFE, which gives in total a huge value not representing reality. Highlighting the real application, a di/dt of up to 1000 A/µs can be seen, which would increase Q rr * compared to lower di/dt s. However, the main impact on the Q rr * comes from the current and the flooding time of the diode. herefore the application shows much lower Q rr * values, due to currents of half the maximum drain current and below and a diode flooding time of 50 ns to 150 ns. 10 nc 100 nc technology 1 technology technology 3 80 nc Qrr* [nc] 60 nc 40 nc 0 nc 0 nc 0 ns 0 ns 40 ns 60 ns 80 ns 100 ns 10 ns 140 ns body diode charging time [ns] Fig. 5. Q rr * dependency of body diode charging time. 10

As shown in Fig. 5 there is a strong influence of the MOSFE gate timing on the effective present Q * rr. he longer the time the body diode is conducting current before turn off, the higher the reverse recovery charge will be. his will decrease efficiency and lead to a higher turn off voltage spike. As an example, technology 3 in Fig. 5 can be taken. Going from a perfect timing of just 0 ns up to 140 ns, an additional power loss of about 0.5W (transformer voltage = 40V, switching frequency = 15 khz) can influence efficiency dramatically, especially at low load conditions. Depending on MOSFE technology and flooding time of the body diode, the Q rr, often is of secondary importance as the output capacitance is typically dominant. Furthermore no application relevant Q rr value is provided on datasheets. 6 Optimizing SR MOSFE for efficiency For optimizing the SR MOSFE regarding efficiency, a well balanced ratio between switching losses and conduction losses has to be found. Considering light load condition, the R DS(on) conduction losses play a minor role, as there is just a small current flowing through the MOSFE. In this case the switching losses, which are more or less constant over the whole load range, are dominant. In case of high output current the conduction losses are the biggest portion and therefore contribute the most to the total power losses, see Fig. 6. 3.5 power dissipation [W] 3.0.5.0 1.5 1.0 output capacitance losses gate drive losses conduction losses 0.5 0.0 10 30 50 output current [A] Fig. 6. Power loss distribution varying output current for the IPP08N08N3 G; f sw = 15 khz, U = 40V. 11

For choosing the best fitting MOSFE, special attention has to be given to the R DS(on) class, which is illustrated in Fig. 7. Going beyond the optimum point (higher R DS(on) ) will increase total power losses linearly. But lowering the R DS(on) under the optimum will lead to dramatically increased losses. Furthermore in Fig. 7 can be seen, that the range of minimum power losses is quite wide. 3.5 3.5 Optimum R DS(on) conduction losses switching losses total losses Pv [W] 1.5 1 0.5 0 0 1 3 4 5 R DS(on) [mohm] Fig. 7. Power losses vs. R DS(on) for the OptiMOS 3 80V technology; V = 40V, f sw = 150 khz, I MOSFE = 0 A. V gate = 10V Between 1 mohm and 3 mohm total losses stay roughly the same. But a further decrease of R DS(on) of 0.5 mohm will double the power losses and therefore extremely hurt the efficiency of the power converter. 1

he impact of different MOSFE R DS(on) classes in the real application can be seen in Fig. 8. A measurement in a server power supply unit was done the IPP08N08N3 G and the IPP057N08N3 G. 90 89 88 87 86 efficiency [%] 85 84 83 8 81 IPP057N08N3 G IPP08N08N3 G 80 79 78 77 10 0 30 40 50 60 output current [A] Fig. 8. Measured efficiency comparison of two SR MOSFE R DS(on) classes in server power supply unit. Going for light load efficiency, the higher ohmic MOSFE gives much better efficiency. his device has a lower output capacitance and a lower gate charge, which in total gives lower switching losses. On the other hand efficiency is getting lower as the output current is increasing. In this case the lower ohmic switch gives a better performance. For optimizing efficiency over the whole current range, a balanced selection of the optimum SR MOSFE has to be done. 7 Conclusion his Application Note presents a method to analyze power losses in the SR stage of switched mode power converters. An analytical, yet simple model for calculating the switching losses was developed. With these results developers of switched mode power supplies using synchronous rectification have the possibility to optimize topology and MOSFE selection. A rough calculation of the SR power losses can be done, which helps to speed up the design process and to boost efficiency. 13

8 References [1] http://www.80plus.org, February 009. [] Michael ao Zhang, Electrical, hermal, and EMI Designs of High-Density, Low-Profile Power Supplies, Dissertation, Blacksburg-Virginia, 1997, Chapter. [3] Ionel Dan Jitaru, Higher Efficiency Power Conversion through Intelligent Power Processing, PCIM Europe, 008, Chapter. [4] Rudy Severns, Design of Snubbers for Power Circuits, www.cde.com/tech/design.pdf, February 009. [5] exas Instruments, Control Driven Synchronous Rectifiers In Phase Shifted Full Bridge Convertes, Application Note SLUA87, March 003. [6] Unitrode, Phase Shifted Zero Voltage ransition Design Considerations and the UC3875 PWM Controller, Application Note SLUA107, May 1997. 14