Assembleon's answer to the changes in the manufacturing value chain

Size: px
Start display at page:

Download "Assembleon's answer to the changes in the manufacturing value chain"

Transcription

1 Assembleon's answer to the changes in the manufacturing value chain Marco van Oosterhout Senior Manager, Product Management and Marketing. AIMP 2014 Marketing in a disruptive world

2 1. Introduction 2. Market analysis 3. Resulting product portfolio 2

3 Plaatsen van SMD componenten IC s Discrete halfgeleiders R & C chips Apple iphone 5 3

4 Een typische flowline PCB laden Soldeerpasta aanbrengen Componenten plaatsen Solderen PCB ontladen 4

5 Assembléon s plaats in de flowline 5

6 Meer dan 30 jaar ervaring 400 professionals wereldwijd 18,000 geinstalleerde units (20kcph equivalent) Veldhoven, NL Suzhou Alpharetta, GA Hong Kong Singapore 6

7 Het leveren van concurrerende oplossingen voor de elektronische maakindustrie gebaseerd op onze sterkten in plaatsingsmachines 7

8 1. Introduction 2. Market analysis 3. Resulting product portfolio 8

9 Electronics value chain Source: Prismark partners,

10 World - All applications (Component consumption based) Autom. 5% Def./Aero 0% Med./Industr. 18% Comm. 19% Consumer 32% Computer 26% World Asia Europe Americas % in region % of world % in region % of world % in region % of world % in region Quality (Fit Core Competence) 23% 54% 17% 22% 37% 24% 42% Personal (Value oriented) 14% 79% 15% 15% 15% 6% 6% Personal (Price oriented) 30% 82% 33% 10% 21% 8% 18% Consumer (price oriented) 19% 83% 22% 9% 12% 8% 13% Other (price oriented?) 15% 67% 13% 14% 15% 19% 22% 100% 74% 100% 14% 100% 13% 100% Protec 2011 P&P (M$) 3,596 2,

11 Smart phones!

12 Smart phones MEMS & sensors in mobile phones 12

13 Industrial Electronics Power electronics applications overview 13

14 Automotive Electronics Example: Engine control unit (ECU) Most important requirement: reliability! Expected life time: > 12 to 15 years Large operating temperature variations: -40 C < T < +125 C Relative humidity variations: 25 % up to 99% RH Typical connector: ECU interface connector (H = 24 mm) 14

15 Automotive Electronics Typical component dimensions (automotive power electronics) SMD transformer (13.5 mm height; m = 9 gr.) Power storage chokes 15

16 1. Introduction 2. Market analysis 3. Resulting product portfolio 16

17 SWOT Analysis (2/2) O1 O2 O3 O4 O5 O6 O7 T1 T2 T3 T4 T5 T6 T7 S S S S S5 ++ S6 ++ S W W W W W W W

18 Competences analysis Core Intrinsic high quality and accuracy of placement process at high speed Competences Willingness to adapt system to specific needs Direct sales and service organization Willingness to adapt system to specific needs Environment conscious ( Green ) and Ethical business principles 18

19 Frame Component Alignment Component Feeding Key processes and competences Robot Board Alignment Placement Head Parallel single pick & place concept PCB Transport 19

20 Assembléon s Value Chain 1. Research & Development Using core competences Core 2. Design & Engineering 3. Prototyping & Industrialization Partially Core Non Core Assembléon is about - Strenghtening our own core competences - Using strong core competences of partners - Outsourcing non-core activities 4. Component production 5. System integration 6. Sales & Service 20

21 Front End Resulting into new solutions AX-iFlex SMT Common SMD iflex Q-Driven Markets Pin-in- Paste H1 Manual Insertion 0201 A-Series PoP Snap-in connectors SSD Memory Hybrid Memory Hybrid Modules Modules Hybrid Market Flip Chips Embedded Devices Flip Chip Stacking Hybrid Embedded Wire Bonding Semicon Backend Wafer Level Packaging (WLP) Wafer Level Processing Hybrid WLP Final Assembly Clinching Hand Mounting 21

22 Safety Critical / Industrial Factory Integration Advanced PCBA Thin board transport Factory Integration Product Portfolio WLP AX-301 Hybrid Modules - WLP Force control, 10µ accuracy Modules (e.g. SiP/MCM/PoP) AX-301 Hybrid Modules AX-501 Hybrid Modules 01005: force control, 35µ accuracy FC: force control, 18µ accuracy Embedded AX-301 Hybrid Embedded AX-501SHybrid Embedded 35µ embedded passive accuracy 18µ embedded active accuracy DRAM Scale-able AX-501 Hybrid Memory High Output (scale-able) Chip and DRAM shooting Scale-able AX-301 Scale-able AX-501 High Output (scale-able) Medium to large volume Best in class First Pass Yield Factory automation Scale-able Scale-able AX-301+iFlex AX-501+iFlex SMT Scale-able iflex Scale-able Small batch manufacturing Segmented changeovers Many Intelligent feeding positions Fast trolley changeovers Scheduling / Just in Time > 120 Output (kcph) 22

23

K&S to Acquire Assembléon Transaction Overview

K&S to Acquire Assembléon Transaction Overview K&S to Acquire Assembléon Transaction Overview Safe Harbor Statement In addition to historical statements, this presentation and oral statements made in connection with it may contain statements relating

More information

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to

More information

Embedding components within PCB substrates

Embedding components within PCB substrates Embedding components within PCB substrates Max Clemons, Altium - March 19, 2014 Continued pressure for electronic devices that provide greater functionality in ever-smaller formfactors is not only providing

More information

SUSS MICROTEC INVESTOR PRESENTATION. November 2015

SUSS MICROTEC INVESTOR PRESENTATION. November 2015 SUSS MICROTEC INVESTOR PRESENTATION November 2015 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

Market trends 1999 2000 2001 2002

Market trends 1999 2000 2001 2002 Odd or SMD? Odd or SMD? At one time it was clear. An SMD component was placed on the surface of a PCB and all others were defined as 'odds' or 'specials'. For these components electronics manufacturers

More information

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com

More information

Be the best. PCBA Design Guidelines and DFM Requirements. Glenn Miner Engineering Manager March 6, 2014 DFM DFT. DFx DFC DFQ

Be the best. PCBA Design Guidelines and DFM Requirements. Glenn Miner Engineering Manager March 6, 2014 DFM DFT. DFx DFC DFQ and DFM Requirements DFM DFQ DFx DFT DFC Glenn Miner Engineering Manager Electronics, Inc. Not to be reproduced or used in any means without written permission by Benchmark. Guidelines and Requirements

More information

Brevis GPS SMD. The A10204 GPS antenna is intended for reception of GPS signals at 1575 MHz.

Brevis GPS SMD. The A10204 GPS antenna is intended for reception of GPS signals at 1575 MHz. Brevis GPS SMD Antenna Product Specification 1 Features GPS antenna designed for embedded applications Designed for use with the ground plane extended beneath the antenna Good efficiency to size ratio

More information

Advanced Technologies and Equipment for 3D-Packaging

Advanced Technologies and Equipment for 3D-Packaging Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling

More information

LO5: Understand commercial circuit manufacture

LO5: Understand commercial circuit manufacture Unit 6: Circuit simulation and manufacture LO5: Understand commercial circuit manufacture Commercial component and PCB types Instructions and answers for teachers These instructions should accompany the

More information

How to Improve Tablet PCs and Other Portable Devices with MEMS Timing Technology

How to Improve Tablet PCs and Other Portable Devices with MEMS Timing Technology How to Improve Tablet PCs and Other Portable Devices with MEMS Timing Technology The tremendous success of tablets and smart phones such as the ipad, iphone and Android based devices presents both challenges

More information

Company Presentation. February 2011. Sustainable Technologies Conference. June 8, 2011

Company Presentation. February 2011. Sustainable Technologies Conference. June 8, 2011 Company Presentation Sustainable Technologies Conference February 2011 June 8, 2011 Disclaimer This presentation contains forward-looking statements relating to the business, financial performance and

More information

Pandawill Circuits. Your PCB & PCBA partner in China. PCB Fabrication Parts Sourcing PCB Assembly 1

Pandawill Circuits. Your PCB & PCBA partner in China. PCB Fabrication Parts Sourcing PCB Assembly 1 Pandawill Circuits Your PCB & PCBA partner in China 1 PCB Fabrication Parts Sourcing PCB Assembly 1 Company Profile >10 years: Experience in the PCB manufacture and PCB assembly. >500 Employees: Skilled

More information

White Paper: Pervasive Power: Integrated Energy Storage for POL Delivery

White Paper: Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power Overview This paper introduces several new concepts for micro-power electronic system design. These concepts are based on the

More information

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT)

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT) Research and Development centre for Microelectronics and Microsystems Applied Research, Development and Production for Industry ISIT applies an ISO 9001:2000 certified quality management system. Certificate

More information

Multilevel Socket Technologies

Multilevel Socket Technologies Multilevel Socket Technologies High Performance IC Sockets And Test Adapters Overview Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs & Turn-Key Solutions

More information

Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions

Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions Innovative Wafer & Interconnect Technologies Outline Low cost RFID Tags & Labels Standard applications and

More information

Zigbee-Based Wireless Distance Measuring Sensor System

Zigbee-Based Wireless Distance Measuring Sensor System Zigbee-Based Wireless Distance Measuring Sensor System Ondrej Sajdl 1, Jaromir Zak 1, Radimir Vrba 1 1 Department of Microelectronics, Brno University of Technology, FEEC, Udolni 53, 602 00 Brno, Czech

More information

to realize innovative electronic products 2 June 13, 2013 Jan Eite Bullema 3D Printing to realize innovative electronic products

to realize innovative electronic products 2 June 13, 2013 Jan Eite Bullema 3D Printing to realize innovative electronic products Overview of 2 What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl

More information

Telematics & Wireless M2M

Telematics & Wireless M2M Telematics & Wireless M2M MODULE PORTFOLIO www.lairdtech.com Innovative Technology for a Connected World Innovative Technology for a Connected World About Laird Technologies Laird Technologies designs

More information

Hardware Specifications of V2AF Series Hybrid Card Reader

Hardware Specifications of V2AF Series Hybrid Card Reader B (1/ 14) Hardware Specifications of V2AF Series Hybrid Card Reader Rev. A Sep. 28, 1999 Rev. B Feb. 22, 2000 Card Business Promotion Division OMRON Corporation 1999 All Rights Reserved O M R O N B (2/

More information

BUILDING INSTRUCTIONS

BUILDING INSTRUCTIONS etap2hw 38 mm I2C to LCD Interface BUILDING INSTRUCTIONS October 2013 P. Verbruggen Rev 1.01 15-Oct-13 Page 1 Table of Contents Chapter 1 General Information 1.1 ESD Precautions 1.2 Further Supplies 1.3

More information

Programming Matters. MLC NAND Reliability and Best Practices for Data Retention. Data I/O Corporation. Anthony Ambrose President & CEO

Programming Matters. MLC NAND Reliability and Best Practices for Data Retention. Data I/O Corporation. Anthony Ambrose President & CEO Programming Matters MLC NAND Reliability and Best Practices for Data Retention Data I/O Corporation Anthony Ambrose President & CEO Flash Memory Summit 2013 Santa Clara, CA 1 Executive Summary As Process

More information

RISH CON - Hz. Salient Features : Application : Product Features: FREQUENCY TRANSDUCER

RISH CON - Hz. Salient Features : Application : Product Features: FREQUENCY TRANSDUCER Application : The RISH CON - Hz transducer is used for frequency measurement. The output signal is proportional to measured frequency and is either load independent DC Current or load independent DC Voltage.

More information

Investigation of Components Attachment onto Low Temperature Flex Circuit

Investigation of Components Attachment onto Low Temperature Flex Circuit Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase

More information

Energy Management Solutions

Energy Management Solutions Energy Management Solutions Introducing the world s most innovative intelligent Power Distribution Units (ipdus) designed to simplify rack energy and environmental management of your data center. Enlogic

More information

System Security Solutions for the connected world. www.infineon.com/ccs

System Security Solutions for the connected world. www.infineon.com/ccs System Security Solutions for the connected world www.infineon.com/ccs Solutions for rising security demands The right balance between hardware-based and software-based security mechanisms allows you to

More information

Using Stencils to Simplify the Printed Circuit Board Assembly Process

Using Stencils to Simplify the Printed Circuit Board Assembly Process Using Stencils to Simplify the Printed Circuit Board Assembly Process Author: Nolan Johnson CAD/EDA Manager njohnson@sunstone.com The process of creating a prototype circuit board requires multiple phases

More information

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings.

Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. Copyright 2008 IEEE. Reprinted from ECTC2008 Proceedings. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Amkor

More information

Development of a wireless sensor platform for quality control in the cold chain of the future

Development of a wireless sensor platform for quality control in the cold chain of the future Workshop & brainstorming 26 October 2012 Het Pand (Gent) Development of a wireless sensor platform for quality control in the cold chain of the future NVC Pasteur Seminar: consortium Verpakken meeting

More information

Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology

Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology Outline Introduction CAD design tools for embedded components Thermo mechanical design rules

More information

ECP Embedded Component Packaging Technology

ECP Embedded Component Packaging Technology ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous

More information

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility Valuetronics Holdings Limited A pictorial tour of our Daya Bay facility In early 2006, we acquired the land use rights to a 110,200 sqm land parcel in the Daya Bay Technology District, Huizhou City, Guangdong

More information

MACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society

MACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society MACHINE VISION FOR SMARTPHONES Essential machine vision camera requirements to fulfill the needs of our society INTRODUCTION With changes in our society, there is an increased demand in stateof-the art

More information

Circular Push-Pull Connector

Circular Push-Pull Connector Circular Push-Pull Connector INTRODUCTION Engineering Division Printed Circuit Board Division Component Division Green Technologies Division - PCB Layout Routing Services Library Services - Mechanical

More information

Microsystem technology and printed circuit board technology. competition and chance for Europe

Microsystem technology and printed circuit board technology. competition and chance for Europe Microsystem technology and printed circuit board technology competition and chance for Europe Prof. Udo Bechtloff, KSG Leiterplatten GmbH 1 Content KSG a continuously growing company PCB based Microsystems

More information

The new generation: WLL180T photoelectric sensor with fiber-optic cable. Around the corner at High Speed

The new generation: WLL180T photoelectric sensor with fiber-optic cable. Around the corner at High Speed P r o d u C t i n f o r m at i o n The new generation: WLL180T photoelectric sensor with fiber-optic cable Around the corner at High Speed WLL180T: World-class performance and scanning range SICK has been

More information

CIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE

CIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE Mohammad S. Sharawi Electrical Engineering Department, King Fahd University of Petroleum and Minerals Dhahran, 31261 Saudi Arabia Keywords: Printed Circuit

More information

Samsung Galaxy S6 Fingerprint Sensor New Synaptics Design

Samsung Galaxy S6 Fingerprint Sensor New Synaptics Design Samsung Galaxy S6 Fingerprint Sensor New Synaptics Design Second generation Samsung Galaxy fingerprint sensor: same capacitive technology but totally different design For the second time Samsung introduces

More information

The Impact of IoT on Semiconductor Companies

The Impact of IoT on Semiconductor Companies Advisory The Impact of IoT on Semiconductor Companies Rajesh Mani Director, Strategy and Operations April 15, 2015 The Internet of Things (IoT) has been defined in multiple ways here s our take! The collection

More information

Introduction. Refrigerant Leak Detecting System. Feature and Benefits

Introduction. Refrigerant Leak Detecting System. Feature and Benefits PSC European Refrigeration Controls Catalogue Catalog Section 9 Product Bulletin PD-GAS-E Refrigerant Leak Detecting System Introduction This range of refrigerant leak detecting systems is designed for

More information

End Effector Selection and Design. End Effector Types General Design Practices Specific Design Criteria Case Studies

End Effector Selection and Design. End Effector Types General Design Practices Specific Design Criteria Case Studies End Effector Selection and Design End Effector Types General Design Practices Specific Design Criteria Case Studies 1 End Effector Types Mechanical Grippers Negative Pressure (vacuum) Magnetic Hooks Ladles

More information

Design of High Temperature Electronics for Well Logging Applications

Design of High Temperature Electronics for Well Logging Applications Design of High Temperature Electronics for Well Logging Applications Bernard Parmentier Schlumberger, France BParmentier@clamart.oilfield.slb.com Ovidiu Vermesan SINTEF, Norway Ovidiu.Vermesan@sintef.no

More information

Powering Integrated Circuits (ICs), and managing ripple voltage as it relates

Powering Integrated Circuits (ICs), and managing ripple voltage as it relates Ripple Voltage & ESR Powering Integrated Circuits (ICs), and managing ripple voltage as it relates to ESR of capacitors Low voltage ICs require supply voltage (Vcc) to have reduced levels of ripple voltage

More information

Automatisierte, hochpräzise Optikmontage Lösungen für die Industrie

Automatisierte, hochpräzise Optikmontage Lösungen für die Industrie Automatisierte, hochpräzise Optikmontage Lösungen für die Industrie Alexander Steinecker, CSEM Trends in Micro Nano, HSLU, Horw, 5. Dezember 2013 High power laser sources Motivation Laser manufacturing

More information

R&D Access Touch 3.1 User Manual Version 1.00 Public 1 (13) User Manual. Access Touch 3.1

R&D Access Touch 3.1 User Manual Version 1.00 Public 1 (13) User Manual. Access Touch 3.1 Public 1 (13) User Manual Access Touch 3.1 Version Date Author Description 1.00 30.09.2011 Pah First version Public 2 (13) 1. Purpose of this user manual... 3 2. Description of Access Touch 3.1... 3 3.

More information

DIDO graf. Selling Guide BANKING AUTOMATION. Introduction

DIDO graf. Selling Guide BANKING AUTOMATION. Introduction BANKING AUTOMATION Selling Guide DIDO graf Introduction The concept behind the "DIDO" document dispensers manufactured by CTS electronics stems from the need to decentralize and make as widespread and

More information

Version Date Author Description 1.00 19.07.2010 Jpo First version 1.01 21.12.2010 Jpo FET output descriptions made clearer 1.02 04.02.

Version Date Author Description 1.00 19.07.2010 Jpo First version 1.01 21.12.2010 Jpo FET output descriptions made clearer 1.02 04.02. +3 # Version Date Author Description 1.00 19.07.2010 Jpo First version 1.01 21.12.2010 Jpo FET output descriptions made clearer 1.02 04.02.2011 Jpo Reset button added 1. Purpose of this user manual...

More information

World Manufacturing Process Management (MPM) Markets

World Manufacturing Process Management (MPM) Markets World Manufacturing Process Management (MPM) Markets 1 Market Drivers for the MPM Market Cost savings 100 100 80 Aging workforce 55 60 40 20 Product to market faster 95 0 System upgrade 65 75 Globalization

More information

DeltaV SISnet Repeater

DeltaV SISnet Repeater September 2013 Page 1 The DeltaV SIS platform is the world s smart SIS system to use the power of predictive intelligence for increasing the availability of the entire safety instrumented function. Fiber-optic

More information

Logistics. EMS manufacturing solutions can be supplied in any format to suit a customer s requirements, including;

Logistics. EMS manufacturing solutions can be supplied in any format to suit a customer s requirements, including; Vision EMS (Electronic Manufacturing Solutions Ltd,) offers a complete range of manufacturing solutions for the CEM electronics marketplace. EMS is focused on the provision of fast, cost effective solutions

More information

IP Camera/NVR Management System. Datasheet. Camera Models: aircam, aircam Dome, aircam Mini NVR Model: airvision-c. Camera/NVR Management Solution

IP Camera/NVR Management System. Datasheet. Camera Models: aircam, aircam Dome, aircam Mini NVR Model: airvision-c. Camera/NVR Management Solution IP Camera/NVR Management System Camera Models: aircam, aircam Dome, aircam Mini NVR Model: airvision-c Camera/NVR Management Solution Versatile Camera Settings Detailed Statistical Reporting Advanced Analytics

More information

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection

More information

Wireless Applications. Host Interfaces. te.com/products/ngff. TE Connectivity. M.2 (NGFF) Connector. Ultrabook/ Notebook. Smart TV. Server.

Wireless Applications. Host Interfaces. te.com/products/ngff. TE Connectivity. M.2 (NGFF) Connector. Ultrabook/ Notebook. Smart TV. Server. M2 NGFF Applications ULTRABOOK TABLET SSD SMART TV The list goes on and on... Miniature in size. Big in possibilities. 0.5MM PITCH WITH 67 POSITIONS & AVAILABLE IN VARIOUS HEIGHTS SAVES MORE THAN 20% PCB

More information

POWER FORUM, BOLOGNA 20-09-2012

POWER FORUM, BOLOGNA 20-09-2012 POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing

More information

Duct Humidity Transmitter

Duct Humidity Transmitter SDC-H Duct Humidity Transmitter Features Replaceable sensor element Humidity measurement for air ducts Minimum and maximum value memory 0 0V, 0 0mA or 0V, 4 0mA measuring signals selectable with jumpers

More information

3System. Solid State System (3S) 選 擇 鑫 創 選 擇 創 新 鑫 創 科 技 :3259

3System. Solid State System (3S) 選 擇 鑫 創 選 擇 創 新 鑫 創 科 技 :3259 3System Solid State System (3S) 選 擇 鑫 創 選 擇 創 新 鑫 創 科 技 :3259 3S Company Introduction Company Solid State System Founded November 1998 Chairman Jeffrey Lin Position Fabless IC Design House Headquarter

More information

MEMS & SENSORS PACKAGING EVOLUTION

MEMS & SENSORS PACKAGING EVOLUTION MEMS & SENSORS PACKAGING EVOLUTION Presented by Christophe Zinck ASE Group September 26th, 2013 Outline 1. Brief presentation of ASE Group 2. Overview of MEMS packaging 3. ASE MEMS packaging background

More information

Non- Carbon Fiber Electrical Heating Textile Introduction:

Non- Carbon Fiber Electrical Heating Textile Introduction: Non- Carbon Fiber Electrical Heating Introduction: This Heating is a new generation electrical heating system which is specially designed for mobile heating, energy saving and safety orientated requirements

More information

Phil Crowther, Product Management, April 2015 YuMi IRB 14000 Overview

Phil Crowther, Product Management, April 2015 YuMi IRB 14000 Overview Phil Crowther, Product Management, April 2015 YuMi IRB 14000 Overview YuMi: IRB 14000 Agenda Differentiated value proposition Overview and vision Main features Payload Working range Performance and accuracy

More information

airmax Wireless Broadband CPE Datasheet Models: AG-HP-2G16, AG-HP-2G20, AG-HP-5G23, AG-HP-5G27 High Performance, Long Range Integrated InnerFeed CPE

airmax Wireless Broadband CPE Datasheet Models: AG-HP-2G16, AG-HP-2G20, AG-HP-5G23, AG-HP-5G27 High Performance, Long Range Integrated InnerFeed CPE airmax Wireless Broadband CPE Models: AG-HP-2G16, AG-HP-2G20, AG-HP-5G23, AG-HP-5G27 High Performance, Long Range Integrated InnerFeed CPE Easy Assembly and Installation Utilizing InnerFeed technology,

More information

Solutions. Machine-to-Machine. Arrow Electronics. Complete, end-to-end solutions over the life of your product.

Solutions. Machine-to-Machine. Arrow Electronics. Complete, end-to-end solutions over the life of your product. AR R OW E L E CTR O N I CS A MERI CA S CO MP ONENTS machine machine-to- CAPABILITIES Arrow Electronics Americas Components m2m@arrow.com Arrow Electronics Machine-to-Machine Solutions Complete, end-to-end

More information

A Career that Revolutionises & Improves Lives

A Career that Revolutionises & Improves Lives OPTION GROUP B ELECTRONIC ENGINEERING presented by K Radha Krishnan Associate Professor, EEE 25 February 2015 1 A Career that Revolutionises & Improves Lives Scientists investigate that which already is,

More information

Industrial Roadmap for Connected Machines. Sal Spada Research Director ARC Advisory Group sspada@arcweb.com

Industrial Roadmap for Connected Machines. Sal Spada Research Director ARC Advisory Group sspada@arcweb.com Industrial Roadmap for Connected Machines Sal Spada Research Director ARC Advisory Group sspada@arcweb.com Industrial Internet of Things (IoT) Based upon enhanced connectivity of this stuff Connecting

More information

Agilent 4338B Milliohm Meter

Agilent 4338B Milliohm Meter Agilent 4338B Milliohm Meter 10 µω to 100 kω Technical Overview Introduction Ideal for precise measurements of extremely low resistances using an ac test signal, the Agilent Technologies 4338B suits bench-top

More information

Machine Vision Optimizing Electronics Production

Machine Vision Optimizing Electronics Production Expert Guide Machine Vision Optimizing Electronics Production Introduction Today, semiconductors cannot be manufactured without using machine vision. In fact, machine vision is an enabling technology that

More information

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz

More information

Low Bay High Bay. Lighting. Industrial Series. The best lighting level for better working performance.

Low Bay High Bay. Lighting. Industrial Series. The best lighting level for better working performance. Low Bay High Bay The best lighting level for better working performance. Industrial Series Lighting INDOOR LIGHTING Low Bay & High Bay Luminaries for interiors with low, medium, and high ceilings such

More information

Universal control module for motorized devices

Universal control module for motorized devices Ref: MOD-0105-N The MOD-0105-N is a universal module for motorized devices, blinds, awnings, curtains, doors, etc.. Allows, with vivimat BUS, the local or remote control of a motorized devices, ensuring

More information

WE SECURE BUSINESS PROCESSES AND FREE UP YOUR CAPACITIES

WE SECURE BUSINESS PROCESSES AND FREE UP YOUR CAPACITIES WE SECURE BUSINESS PROCESSES AND FREE UP YOUR CAPACITIES ECR is a Swiss specialist with many years of experience in industrialized development and manufacture of complex high-quality electronic components,

More information

Rufa 2.4 GHz SMD Antenna Part No. 3030A5839 / 3030A5887 Product Specification

Rufa 2.4 GHz SMD Antenna Part No. 3030A5839 / 3030A5887 Product Specification Product Specification 1 Features Designed for 2.4 GHz applications: Bluetooth, Wi-Fi (802.11b/g), ZigBee, etc. Easy to integrate Low profile design for use with no ground beneath the antenna High efficiency

More information

Embedded solutions. Embed an Anybus product into your device to connect to any fieldbus or industrial Ethernet network.

Embedded solutions. Embed an Anybus product into your device to connect to any fieldbus or industrial Ethernet network. Embedded solutions Embed an Anybus product into your device to connect to any fieldbus or industrial network. Anybus: One solution for all networks! How can I connect my products to all networks on the

More information

Würth Elektronik ibe Automotive solutions

Würth Elektronik ibe Automotive solutions Würth Elektronik ibe Automotive solutions July 2016 Page 1 The Würth Group The Würth Group Over 69,000 employees, 11 billion sales More than 400 companies In more than 80 countries The Würth Elektronik

More information

Electronics Manufacturing Services, Since 1986

Electronics Manufacturing Services, Since 1986 Page 1 of 5 Electronics Manufacturing Services, Since 1986 Professionalized Products and Services, Inc. (PPSI) is a contract manufacturer, located in the Houston area, specializing in PCB assembly and

More information

ALL-ZC-2140P-DVI PCoIP Zero Client Overview

ALL-ZC-2140P-DVI PCoIP Zero Client Overview ALL-ZC-2140P-DVI PCoIP Zero Client Overview TERA2140 DVI PCoIP Zero Client Overview Teradici is the developer of the PC-over-IP (PCoIP) remote desktop protocol, which is leveraged in several VDI solutions

More information

The Quality Connection. High Performance Cable Solutions for the World of Semiconductors

The Quality Connection. High Performance Cable Solutions for the World of Semiconductors The Quality Connection High Performance Cable Solutions for the World of Semiconductors 2 Total Flexibility for Applications with the Toughest Requirements LEONI is your long-term, reliable partner supplying

More information

The Quality Connection. High Performance Cable Solutions for the World of Semiconductors

The Quality Connection. High Performance Cable Solutions for the World of Semiconductors The Quality Connection High Performance Cable Solutions for the World of Semiconductors 2 Total Flexibility for Applications with the Toughest Requirements LEONI is your long-term, reliable partner supplying

More information

RC2200DK Demonstration Kit User Manual

RC2200DK Demonstration Kit User Manual Demonstration Kit User Manual Table of contents TABLE OF CONTENTS... 1 QUICK INTRODUCTION... 2 INTRODUCTION... 3 DEMONSTRATION BOARD... 4 POWER SUPPLY SECTION... 5 RS-232 INTERFACE... 6 CONNECTORS... 7

More information

Adapters - Overview. Quick-Turn Solutions for IC Supply Issues

Adapters - Overview. Quick-Turn Solutions for IC Supply Issues Adapters - Overview BGA to BGA Adapter BGA to PGA BGA to QFP BGA to BGA QFP to BGA SMT to DIP SMT to SMT PGA to PGA BGA to QFP Adapter with VR using FlexFrame Interconnect TSOP Adapter Packaged Die to

More information

ERNI Electronic Solutions

ERNI Electronic Solutions ERNI Electronic Solutions Development and production of electronic assemblies www.erni-es.com Catalog E 074599 07/10 Edition 1 Welcome to ERNI Electronic Solutions! Your specialist for electronics development,

More information

How To Control A Power Supply With A Mini Transmitter And Switch (Power Supply)

How To Control A Power Supply With A Mini Transmitter And Switch (Power Supply) transmitter (2 wire) / switch for continuous or On/Off Control Indication, monitoring, transmitting and continuous or On/Off control in one device Output signal 4...20 ma, 2-wire for continuous control

More information

30-120 3 Phase Modular Finally the benefits of Modular ups are for all

30-120 3 Phase Modular Finally the benefits of Modular ups are for all MUST 30-120 3 Phase Modular UPS Finally the benefits of Modular ups are for all MUST 30-120 MUST means Modular UPS System Three-phase MUST 30-120 is an uninterruptible power supply with double conversion

More information

Assembly services on demand Jan de Louw. HTE 2007, Evoluon Eindhoven 1

Assembly services on demand Jan de Louw. HTE 2007, Evoluon Eindhoven 1 Assembly services on demand Jan de Louw HTE 2007, Evoluon Eindhoven 1 EUPASS mission: Results: - Extreme short time-to-market or time-to-volume (target is 2-3 months) - return-on-investment based on the

More information

sontheim Wir leben Elektronik! We live electronics! Industrie Elektronik GmbH Computer-on-Modules Overview of our Computer-on-Modules

sontheim Wir leben Elektronik! We live electronics! Industrie Elektronik GmbH Computer-on-Modules Overview of our Computer-on-Modules Wir leben Elektronik! We live electronics! sontheim Industrie Elektronik GmbH Computer-on-Modules Overview of our Computer-on-Modules 04 Computer-on-Modules Overview of our Computer-on-Modules Computer-on-Modules

More information

Products / Applications / Solutions. Your Intelligent Robotics Par tner

Products / Applications / Solutions. Your Intelligent Robotics Par tner A d e p t R o b o t i c s f o r P a c k a g i n g Products / Applications / Solutions Your Intelligent Robotics Par tner Adept Viper s1700 Adept Viper s850 Adept Quattro s650h and s650hs Robotics For Packaging

More information

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level

More information

2009 April 22, Cambridge UK

2009 April 22, Cambridge UK 13.05.2009 1 Astride the Packaging Roadmap Access to Packaging Case Study 2009 April 22, Cambridge UK certified by RoodMicrotec. eltek MilleniumMicrotec Zwolle (NL) Dresden (D) Noerdlingen (D) Stuttgart

More information

EGSTON Standard E2xFxWx 12W

EGSTON Standard E2xFxWx 12W General description The family of switchmode power supplies offers an unmatched degree of flexibility and performance fulfilling even the most stringent requirements. Highly flexible electrical configuration

More information

Quality through Competence Services made to order

Quality through Competence Services made to order PCB Quality through Competence Services made to order An initiative of the PCB and Electronic Systems Division within ZVEI EMS Who we are EMS suppliers listed in this brochure are full service providers

More information

Robots are ready for medical manufacturing

Robots are ready for medical manufacturing Robotics Industry focus Robots are ready for medical manufacturing Robots provide new twists, bends, and rolls for automated medical manufacturing. Leslie Gordon Senior Editor R Robotic automation has

More information

T-SERIES INDUSTRIAL INCLINOMETER ANALOG INTERFACE

T-SERIES INDUSTRIAL INCLINOMETER ANALOG INTERFACE T-SERIES INDUSTRIAL INCLINOMETER ANALOG INTERFACE T-Series industrial inclinometers are compact high performance sensors used to determine inclination in roll and pitch axes with excellent precision and

More information

FLYPORT Wi-Fi 802.11G

FLYPORT Wi-Fi 802.11G FLYPORT Wi-Fi 802.11G System on module 802.11g WIFI - Infrastructure mode - softap mode - Ad hoc mode Microchip PIC 24F 16 bit processor Microchip MRF24WG0MA/MB - Native WiFi 802.11g transceiver - PCB

More information

Fusca 2.4 GHz SMD Antenna

Fusca 2.4 GHz SMD Antenna Product Specification 1 Features Designed for 2.4 GHz applications: Bluetooth, Wi-Fi (802.11a/b/g/n), ZigBee, etc. as well as 2.3 GHz WiMAX, 2.5 GHz WiMAX and WiBro. Easy to integrate Low profile design

More information

類 比 與 MEMS 感 測 器 啟 動 智 慧 新 生 活 The Smart-World Started with ST (Analog, MEMS and Sensors)

類 比 與 MEMS 感 測 器 啟 動 智 慧 新 生 活 The Smart-World Started with ST (Analog, MEMS and Sensors) 類 比 與 MEMS 感 測 器 啟 動 智 慧 新 生 活 The Smart-World Started with ST (Analog, MEMS and Sensors) 郁 正 德 資 深 技 術 行 銷 經 理 意 法 半 導 體 Robert Yu Sr. Technical Marketing Manager STMicroelectronics. laubarnes on flickr

More information

Collaborating Objects Workshop. Bart Van Poucke IMEC

Collaborating Objects Workshop. Bart Van Poucke IMEC Collaborating Objects Workshop Bart Van Poucke IMEC imec 2005 Non-E World Sensor Node Challenges (ISSCC 2005 Keynote H. De Man) 20μW 20μW 40μW 20μW 80 Mops 2nJ/b Sensor CE-ADC Processor Radio DSP&storage

More information

Dry Film Photoresist & Material Solutions for 3D/TSV

Dry Film Photoresist & Material Solutions for 3D/TSV Dry Film Photoresist & Material Solutions for 3D/TSV Agenda Digital Consumer Market Trends Components and Devices 3D Integration Approaches Examples of TSV Applications Image Sensor and Memory Via Last

More information

ZM400/ZM600 Quick Reference Guide

ZM400/ZM600 Quick Reference Guide ZM400/ZM600 Quick Reference Guide Use this guide to operate your printer on a daily basis. For more detailed information, refer to the User Guide. Contents External View...........................................................

More information

Company Presentation. October 2015

Company Presentation. October 2015 Company Presentation October 2015 A global semiconductor leader 2014 revenues of $7.40B Listed: NYSE, Euronext Paris and Borsa Italiana, Milan Who we are 2 Research & Development Main Sales & Marketing

More information

PCB Quality Inspection. Student Manual

PCB Quality Inspection. Student Manual PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the

More information