3System. Solid State System (3S) 選 擇 鑫 創 選 擇 創 新 鑫 創 科 技 :3259

Transcription

1 3System Solid State System (3S) 選 擇 鑫 創 選 擇 創 新 鑫 創 科 技 :3259

2 3S Company Introduction Company Solid State System Founded November 1998 Chairman Jeffrey Lin Position Fabless IC Design House Headquarter Tai Yuen Hi-Tech Industrial Park Hsinchu, Taiwan Branches Taipei, ShenZhen Employee 150+ Sales & MKT 15% Production 2% Adm.12% Engineering 71% 2

3 3S Corporate Milestone 2000 World s fastest SLC CF Controller for Toshiba 2001 Toshiba launched investment in 3S 2002 World s 1st MLC CF Controller for Toshiba 2003 World s 1st MLC USB2.0 Controller for Toshiba 2004 World s 1st MLC xd Controller for Toshiba 2006 Kingston adopted USB2.0 SONOS Non-volatile Memory 2007 Officially listed at OTC (3259) USB Audio Controller USB Audio Controller MP3 Player Controller 3

4 3S Corporate Milestone 2008 Kingston adopted SD2.0 controller Kingston launched investment in 3S 2010 CMOS MEMS Microphone announced in Taitronics nm D2/eD3 USB & SD controller for Toshiba solution MEMS Microphone won Computex s Jury s Special Award 國 科 會 晶 片 系 統 國 家 行 科 技 計 畫 卓 越 計 畫 獎 經 濟 部 產 業 創 新 成 果 表 揚 獎 nm ed3 USB & SD controller for Toshiba solution MEMS Microphone won Taiwan Excellence Award 2013 Launch Digital CMOS MEMS microphone UMC Capital, PTI & Fortemedia launched investment in 3S 4

5 3S Product Family Flash Controller 5

6 3S Product Family USB Audio Controller 6

7 3S Product Family MEMS Microphone (MEMS, Micro-Electro-Mechanical-Systems) 7

8 MEMS vs ECM microphone Metal Cover Wire Bond PCB 8

9 Why MEMS Microphone MEMS Microphone ECM microphone Diaphragm semiconductor procee assemblyed with individual parts Footprint Smaller Thickness Thinner SNR Better Power Consumption Better PSRR Better ESD Better EMS Better Environment Endurance Better SMD device All SMD Mostly not SMD 9

10 Application Smart phone Hand free headset Bluetooth headset Notebook Tablet Smartwatch Google Glass Hearing Aid Microphone Array Voice recognition Voice is the most natural human-machine interface 10

11 WW MEMS Microphone Forecast Billion units Billions units Billions units (Estimated) Billions units, Sale US$1B (Forecast) CAGR:20.5% 11

12 Current Suppliers of MEMS Microphone Own technology providers Knowles, Wolfson, Invensence(ADI) NeoMEMS, Bosch, 3S Assembly & distribution AAC, GoerTek, Hosiden, STM, BSE, Sanico Sensor providers Infineon, OMROM 12

13 Market Segment Knowles ADI/Invensence STM 3S High End Wolfson SNR > 61dB Bosch Entry/Mainstream Knowles SNR 58dB AAC 3S GoerTek NeoMEMS SANICO 3S targets both High End and Entry/Mainstream market 13

14 Market Trend Growing Penetration Rate is increasing More, Small, Low Power Multi-Microphone Applications are proliferating Smart Function Integrated Microphone will kick off 14

15 CMOS MEMS Sensor & Single Chip CMOS MEMS and CMOS Circuit in one chip Integrated & Low power 3S CMOS MEMS Mic. Conventional MEMS Mic. CMOS Pre-Amp Circuit CMOS Pre-Amp ASIC CMOS MEMS Sensor MEMS Sensor made by Dedicated MEMS Fab 15

16 Chip Size Package Small - less space No Cover, No Wire Bond - less material Wafer Level - less assembly steps 3S Patented - Small and No Cover Single MEMS Chip Conventional Wire Bond & Metal Cover Wire Bond Metal Cover PCB Diaphragm PCB 16

17 Small Competitor s MEMS Microphones 3S CMOS MEMS Microphones 17

18 Uniform Characteristics Trimmed to uniform Sensibility Suitable for Microphone Array which requires uniform characteristics 18

19 CMOS MEMS Advantages Integrate MEMS & preamp in one chip combine more functions in one chip multi-mic. in one chip Small single chip and chip scale package Green simple assembly, least material, lower power Uniform microphone array applications 19

20 Patent Breakdown and Summary Classification Granted Pending Package 5 0 Device/Structure 7 5 Process 4 1 Circuit 2 0 Testing Apparatus 0 3 Total 18 9 A few new application drafts are ongoing 20

21 Own Technology and Patents Patent Litigation is critical Knowles v.s. AAC (Nov. 2006) Knowles v.s. Akustica (Dec. 2006) Knowles v.s. MEMSTECH (Jan. 2008) Knowles v.s. ADI and vice versa (2009 ~ Now) Knowles v.s. Goertek (Jun. 2013) 3S Owns Proprietary Technology and Patents - CMOS MEMS - Single Chip - Chip Size Package - Uniformity 21

22 Promotion Target Smart phone Hand free headset Bluetooth headset Notebook Tablet Smartwatch 22

23 Design-in Effort Promotion to Design - win takes time - Application design-in cycle - Different Dimension 23

24 Summary Promotion to Design - win lead time Application trend - Higher SNR, Smaller, Lower Power, Multiple CMOS MEMS advantage: Integrate preamp and MEMS in one chip Integrate more function in one chip Multiple microphones in one chip Best for picking up clean voice for recognition Competitiveness Own/unique CMOS technology Own Patents Plenty foundry capacity Lowest material cost 24

25 選 擇 鑫 創 選 擇 創 新 發 言 人 : 劉 志 成 代 理 發 言 人 : 鍾 榮 輝 鑫 創 科 技 :