PCI Express Right Angle Connector System

Transcription

1 PI Express Right ngle onnector System atalog E XXXXXX 09/08 Edition 1

2 atalog E XXXXXX 09/08 Edition 1

3 PI Express Right ngle onnector System Table of ontents General...2 Features...2 Electrical and Mechanical haracteristics...3 X1 36 Pin.... 4, 5 X4 64 Pin.... 6, 7 X8 98 Pin.... 8, 9 X Pin , 11 Part Number Index...12 atalog E XXXXXX 09/08 Edition 1 1

4 PI Express Right ngle onnector System General The PI Express (PIe) rchitecture was introduced into the market place in 2004 as a result of OEMs, including Intel, working together to design a next generation us rchitecture. The current PI us protocol has evolved from a 32 it PI to 64 it PI, PI-X, causing the industry s demand for greater speeds to outstrip the capabilities of PI. The development of the PIe protocol has allowed the industry to embrace a new bus architecture that will handle the demands for the next 10 years. ompletely compatible with PI, the PIe will allow designers greater flexibility when designing new systems and upgrading existing systems. The ERNI Right ngle PIe connector s footprint is identical to the standard vertical mount configuration. The connector pins are insert molded into the connector to allow for exact registration of the contacts on both the daughter card side and the board mount thru hole side. The connector itself is molded out of a high temperature plastic. This allows the connector to withstand the higher reflow and IR temperatures required for processing lead free components. The overall rugged construction of this connector is fabricated with the best materials available for the application requirements. The Right ngle design of the connector will enable the engineer to consider more options while designing the product where height is at premium. Features ngled PIe connector allows the system designer to solve space problems that cannot be solved with vertical PIe connectors onnector enables the add-on card to be mounted parallel to the motherboard, saving space in the overall height of the computer box vailable in X1, X4, X8 or X16 versions in stack heights of 5.84mm, 11.18mm, and 16.69mm Meets all PIe Local us Standards Rev. 2.0 Plastic cover protects connector from dust and debris Insert molded with liquid crystal polymer to provide stability in hybrid board applications involving SMs ompatible with wave soldering process 2 atalog E XXXXXX 09/08 Edition 1

5 PI Express Right ngle onnector System Electrical and Mechanical haracteristics Standard Right ngle Edge ard onnector Number of Pins X1=36 X4=64 X8=98 X16=164 Process-conditions Dip soldering temperature max. IE s at 260 Reflow soldering temperature max. Housing Materials Plastic material JEDE J-STD s at 260 LP 30% glass-filled L flame rating L 94 V-0 ontact Materials ase material Mating area Termination area u alloy Gold Flash over Ni Gold Flash over Ni Marking Technical Data Temperature range urrent rating Voltag rating Dielectric strength onductor resistance Insulation resistance apacitance at 1 khz Inductance at 10 khz Impedance rosstalk Propagation delay Insertion Loss (for connectors with Dim. = 5.84 mm) Return Loss (for connectors with Dim. = 5.84 mm) Product-approval L S -40 to continuous max 300 V >500 V at 60 Hz <40 mω >1 x 10 9 Ω at 500 VD s advertised s advertised s advertised Next >30 d at 2.0 GHz s advertised <1 d at 1.0 GHz <3 d at 2.5 GHz >12 d at 1.25 GHz >7 d at 1.5 GHz >4 d at 2.0 GHz In Preparation In Preparation atalog E XXXXXX 09/08 Edition 1 3

6 PI Express Right ngle onnector System X1 Link Width, 36 pin Dimensional Drawings 1,78 14,75 7,65 11,66 15,24 Mittellinie Leiterplatte enterline of daughter card PIN Offset von Führungssteg zu Referenzzapfen 0.15 Offset from guiding bar to reference peg 10 Datum Date code XXXX_XX ERNI R X 25,5 Lochbild für Leiterplatte (estückungsseite) oard hole pattern (component mounting side) ±0,08 0, ,24 2, ,48 2 3,12 (2x) 2,35 1,35 9,15 25,5 14,9 ll dimensions in mm. ll images in first angle projection 4 atalog E XXXXXX 09/08 Edition 1

7 PI Express Right ngle onnector System X1 Link Width, 36 pin Ordering Information Dim. Dim. Dim. No. of Pins Termination Packaging Part Number 9.4 mm 5.84 mm 2.54 mm 36 Solder Tray/20pcs mm mm 2.54 mm 36 Solder Tray/20pcs mm mm 2.54 mm 36 Solder Tray/20pcs atalog E XXXXXX 09/08 Edition 1 5

8 PI Express Right ngle onnector System X4 Link Width, 64 pin Dimensional Drawings 21,65 1,78 14,75 11,66 15,24 Mittellinie Leiterplatte enterline of daughter card PIN Offset von Führungssteg zu Referenzzapfen 0.15 Offset from guiding bar to reference peg Datum Date code XXXX_XX ERNI R X 39,5 Lochbild für Leiterplatte (estückungsseite) oard hole pattern (component mounting side) , ,7 ±0, ,12 2,5 4,48 (2x) 1,35 14,9 2,35 23,15 39,5 ll dimensions in mm. ll images in first angle projection 6 atalog E XXXXXX 09/08 Edition 1

9 PI Express Right ngle onnector System X4 Link Width, 64 pin Ordering Information Dim. Dim. Dim. No. of Pins Termination Packaging Part Number 9.4 mm 5.84 mm 2.54 mm 64 Solder Tray/20pcs mm mm 2.54 mm 64 Solder Tray/20pcs mm mm 2.54 mm 64 Solder Tray/20pcs atalog E XXXXXX 09/08 Edition 1 7

10 PI Express Right ngle onnector System X8 Link Width, 98 pin Dimensional Drawings 38,66 1,78 14,75 11,66 15,24 Mittellinie Leiterplatte enterline of daughter card PIN Offset von Führungssteg zu Referenzzapfen 0.15 Offset from guiding bar to reference peg Datum Date code 10 XXXX_XX ERNI R X 56,5 Lochbild für Leiterplatte ( estückungsseite) oard hole pattern ( component mounting side) 1.) ±0,08 0, ,5 15, ,12 4,48 (2x) 2,35 40,15 56,5 1,35 14,9 ll dimensions in mm. ll images in first angle projection 8 atalog E XXXXXX 09/08 Edition 1

11 PI Express Right ngle onnector System X8 Link Width, 98 pin Ordering Information Dim. Dim. Dim. No. of Pins Termination Packaging Part Number 9.4 mm 5.84 mm 2.54 mm 98 Solder Tray/20pcs mm mm 2.54 mm 98 Solder Tray/20pcs mm mm 2.54 mm 98 Solder Tray/20pcs atalog E XXXXXX 09/08 Edition 1 9

12 PI Express Right ngle onnector System X16 Link Width, 164 pin Dimensional Drawings 1,78 14,75 71,66 11,66 Mittellinie Leiterplatte centerline of daughter card 15,24 Lochbild für Leiterplatte ( estückungsseite) oard hole pattern (component mounting side) ±0,08 0, , , Offset von Führungssteg zu Referenzzapfen 0.15 Offset from guiding bar to reference peg 10 PIN 1 Datum Date code XXXX_XX ERNI R X 89, ,12 4,48 (2x) 2,35 73,15 1,35 14,9 89,5 ll dimensions in mm. ll images in first angle projection 10 atalog E XXXXXX 09/08 Edition 1

13 PI Express Right ngle onnector System X16 Link Width, 164 pin Ordering Information Dim. Dim. Dim. No. of Pins Termination Packaging Part Number 9.4 mm 5.84 mm 2.54 mm 164 Solder Tray/20pcs mm mm 2.54 mm 164 Solder Tray/20pcs mm mm 2.54 mm 164 Solder Tray/20pcs atalog E XXXXXX 09/08 Edition

14 PI Express Right ngle onnector System Part Number Index Part Number Page , , , , , , , , , , , , atalog E XXXXXX 09/08 Edition 1

15 Member atalog E XXXXXX 09/08 Edition 1

16 ERNI Electronics GmbH Seestrasse delberg/germany Tel Fax [email protected] Europe South merica frica Japan ERNI Electronics, Inc Westwood ve Richmond, V 23230/S Tel Fax [email protected] North merica anada Mexico ERNI sia Holding Pte Ltd. lk 4008 ng Mo Kio venue 10 #04-01/02 Techplace I Singapore Tel Fax [email protected] sia ustralia New Zealand ERNI Electronics GmbH & o. KG 2008 Printed in Germany. policy of continuous improvement is followed and the right to alter any published data without notice is reserved. MicroStac, MicroSpeed, Miniridge, Maxiridge, ERmet, ERmet ZD, ERbic and ERNIPRESS are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & o. KG. atalog E XXXXXX 09/08 Edition 1