handbook, 2 columns handbook, halfpage 085 CS

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1 FEATURES Polarized aluminium electrolytic capacitors, non-solid, self healing Extended voltage and capacitance range SMD-version, fully moulded, insulated Flexible terminals, reflow and wave solderable Compact, rectangular shape Charge and discharge proof, no peak current limitation Supplied in blister tape on reel. handbook, columns CCB060 Fig. Component outline. APPLICATIONS SMD technology Industrial and professional applications handbook, halfpage 085 CS 85 C Telecommunications, automotive, EDP general industrial CCB003 Coupling, decoupling, smoothing, filtering, buffering, timing. QUICK REFERENCE DATA DESCRIPTION VALUE Nominal case sizes (L W H in mm) and Rated capacitance range, C R.0 to 0 µf Tolerance on C R ±0% Rated voltage range, U R 6.3 to 00 V Category temperature range 55 to +05 C Endurance test at 05 C 000 hours Useful life at 05 C 000 hours Useful life at 40 C;.3 l R applied hours Shelf life at 0 V, 05 C 500 hours Resistance to soldering heat test immersion in solder: 0 s at 60 C or 40 s at 5 C Based on sectional specification IEC 384-8/CECC 3300 Climatic category IEC 68 55/05/ Jan 9 00

2 Selection chart for C R, U R and relevant nominal case sizes (L W H in mm) Preferred types in bold. C R (µf) U R (V) SMD 998 Jan 9 0

3 MECHANICAL DATA handbook, full pagewidth O H R S ±0.3 G W L CCB06 Dimensions in mm. For dimensions see Table. Fig. Dimensional outline. Table Physical dimensions, mass and packaging quantities; see Fig. NOMINAL CASE SIZE L W H CASE CODE L max W max H max O max S G max R min MASS (g) PACKAGING QUANTITIES PER REEL MARKING Rated capacitance (in µf) Rated voltage (in V) Series number (39) Name of manufacturer (PHILIPS) Date code (year and month) in accordance with IEC 6 sign indicating the cathode. The anode is identified by bevelled edges. 998 Jan 9 0

4 MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards or hybrid circuits. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or adjacent components. For recommended soldering pad dimensions, refer to Fig.3 and Table. handbook, full pagewidth G D G D E B A F E B A F SMD C C CCB0 solder land/,,,,, solder paste pattern,,,,, solder resist pattern occupied area tracks or dummy tracks Fig.3 Recommended pad dimensions for reflow and wave soldering; see Table. Table Recommended soldering pad dimensions in mm (placement accuracy ±0.5 mm); see Fig.3 NOMINAL CASE SIZE FOR REFLOW SOLDERING FOR WAVE SOLDERING L W H A B C D E F G A B C D E F G Jan 9 03

5 Soldering Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. For maximum conditions of different soldering methods see Figs 4, 5 and 6. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. Maximum temperature load Table 3 Curing conditions for SMD-glue MAX. T amb ( C) 80 Thandbook, 4 columns PAD o ( C) MAX. EXPOSURE TIME (minutes) MBA t (s) 50 Fig.4 Maximum temperature load during infrared reflow soldering. 998 Jan 9 04

6 80 T handbook, PAD 4 columns o ( C) 60 MBA t (s) 50 Fig.5 Maximum temperature load during vapour phase reflow soldering. SMD 80 T handbook, 4 columns PAD o ( C) 60 MBA t (s) 50 Fig.6 Maximum temperature load during (double-) wave soldering. 998 Jan 9 05

7 ELECTRICAL DATA AND ORDERING INFORMATION Unless otherwise specified, all electrical values in Table 4 apply at T amb =0 C, P = 86 to 06 kpa, RH = 45 to 75%. SYMBOL DESCRIPTION C R rated capacitance at 00 Hz, tolerance ±0% I R rated RMS ripple current at 00 Hz,05 C I L max. leakage current after minute at U R Ordering example Electrolytic capacitor 39 series 00 µf/6 V; ±0% Nominal case size: mm; taped on reel Catalogue number: I L5 Tan δ ESR Z max. leakage current after 5 minutes at U R max. dissipation factor at 00 Hz equivalent series resistance at 00 Hz (calculated from tan δ max and C R ) max. impedance at 0 khz Table 4 Electrical data and ordering information; preferred types in bold U R (V) C R 00 H z (µf) NOMINAL CASE SIZE L W H CASE CODE I R 00 Hz 05 C (ma) I L min (µa) I L5 5 min (µa) Tan δ 00 Hz ESR 00 Hz (Ω) Z 0 khz (Ω) CATALOGUE NUMBER Jan 9 06

8 Additional electrical data Voltage PARAMETER CONDITIONS VALUE Surge voltage for short periods Reverse voltage U s.5 U R U rev V Current Leakage current after minute at U R I L 0.0C R U R +3µA after 5 minutes at U R I L5 0.00C R U R +3µA Inductance Equivalent series inductance (ESL) nominal case size mm typ. 8 nh nominal case size mm typ. 8 nh SMD 998 Jan 9 07

9 Capacitance (C). handbook, 4 columns C C 0. MGB09 3,4, Curve : 6.3 V. Curve : 0 V. Curve 3: 6 V. Curve 4: 5 V. Curve 5: 40 V to 00 V. C 0 = capacitance at 0 C, 00 Hz , o Tamb ( C) Fig.7 Typical multiplier of capacitance as a function of ambient temperature. MGB0 handbook, 4 columns.0 C C Curve : 6.3 V. Curve : 0 V. Curve 3: 6 V. Curve 4: 5 V. Curve 5: 40 V to 00 V. C 0 = capacitance at 0 C, 00 Hz f (Hz) 0 4 Fig.8 Typical multiplier of capacitance as a function of frequency. 998 Jan 9 08

10 Equivalent series resistance (ESR) 0 handbook, 4 columns 3 ESR ESR 0 MGB 0 3 Curve : 6.3 V. Curve : 40 V to 50 V. Curve 3: 63 V to 00 V. ESR 0 = typical at 0 C, 00 Hz Tamb ( o C) Fig.9 Typical multiplier of ESR as a function of ambient temperature. SMD.0 handbook, 4 columns ESR ESR 0.6 MGB Curve : 6.3 V. Curve : 40 V to 50 V. ESR 0 = typical at 0 C, 00 Hz f (Hz) 0 5 Fig.0 Typical multiplier of ESR as a function of frequency. 998 Jan 9 09

11 Impedance (Z) 0 3 handbook, 4 columns Z (Ω) MBA Curve : 0 µf, 50 V. Curve : µf, 5 V. Curve 3: 47 µf, 5 V. Curve 4: 00 µf, 6 V. Curve 5: 0 µf, 6.3 V. T amb =0 C f (Hz) 0 6 Fig. Typical impedance as a function of frequency. 998 Jan 9 0

12 RIPPLE CURRENT AND USEFUL LIFE Table 5 Multiplier of ripple current (I R ) as a function of frequency FREQUENCY I R MULTIPLIER (Hz) U R = 6.3 to 6 V U R =5to50V U R = 63 to 00 V handbook, full pagewidth I A I R MEA SMD.8.6 lifetime multiplier ) I T amb ( o A = actual ripple current at 00 Hz. C) I R = rated ripple current at 00 Hz, 05 C. () Useful life at 05 C and I R applied: 000 hours. Fig. Multiplier of useful life as a function of ambient temperature and ripple current load. 998 Jan 9

13 SPECIFIC TESTS AND REQUIREMENTS General tests and requirements are specified in this handbook, Section Tests and Requirements. Table 6 Test procedures and requirements TEST NAME OF TEST REFERENCE Mounting IEC 384-8, subclause 4.3 Endurance IEC 384-8/ CECC 3300, subclause 4.5 Useful life CECC 3030, subclause.8. Shelf life (storage at high temperature) IEC 384-8/ CECC 3300, subclause 4.7 PROCEDURE (quick reference) shall be performed prior to tests mentioned below; reflow or (double-) wave soldering; for maximum temperature load refer to Chapter Mounting T amb = 05 C; U R applied; 000 hours T amb = 05 C; U R and I R applied; 000 hours T amb = 05 C; no voltage applied; 500 hours after test: U R to be applied for 30 minutes, 4 to 48 hours before measurement C/C: ±5% tan δ spec. limit I L5 spec. limit REQUIREMENTS U R 6.3 V; C/C: +5/30% U R = 0 to 00 V; C/C: ±5% tan δ.3 spec. limit Z spec. limit I L5 spec. limit U R 6.3 V; C/C: +45/50% U R = 0 to 00 V; C/C: ±45% tan δ 3 spec. limit Z 3 spec. limit I L5 spec. limit no short or open circuit total failure percentage: % for requirements see Endurance test above 998 Jan 9