TEST SOLUTIONS CONTACTING - SEMICONDUCTOR

Transcription

1 ENGINEERED TO CONNECT CONTACTING - SEMICONDUCTOR TEST SOLUTIONS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR 3

2 SEries IC70 Single inline Package (SIP) - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polysulphone (PSF), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features 1.27 to 1.78mm pitch Dual wipe contacts ensure high reliability Low costs due to selective gold plating 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 40 C to +150 C 10,000 insertions min. Series No. of Contact Pins Design No. MF = Flanged Unmarked = Not Flanged Contact Plating (G = Gold Plating) Straight, Through Hole Type IC MF - G 4 Outline Socket Dimensions Outline Socket Dimensions for IC G4 only May be cut at points marked by into 3 separate sections Recommended PCB Layout Top View from Socket 1.27 to 1.78mm Pitch Pin Count Pitch A B C D IC **-G x 6 = 7.62 IC **-G x 11 = IC **-G x 14 = IC **-G x 19 = IC **-G x 22 = IC **-G x 23 = IC **-G x 29 = IC **-G x 29 = IC **-G x 29 = IC **-G x 55 = IC **-G x 55 = SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

3 Series IC39 Zig-Zag Inline Package (ZIP) - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polysulphone (PSF), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features 1.27 to 1.778mm pitch Applicable for Zig-Zag mounted leads Dual wipe contacts ensure high reliability 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 40 C to +150 C 10,000 insertions min. IC mf - G 4 Series No. of Contact Pins Design No. MF = Flanged Unmarked = Not Flanged Contact Plating (G = Gold Plating) Straight, Through Hole Type Outline Socket Dimensions Recommended PCB Layout A B C D 2- Ø PTH Devices - sip / Zip (contact position) B D H G F Pin Count Ø Ø 2.5 Top View from Socket 0.5 x 0.4 J 1.27 to 1.778mm Pitch Pin Count Pitch A B C D F G H J IC **-G x 11 = IC **-G x 13 = IC **-G x 14 = IC **-G x 15 = IC S**-G x 19 = IC **-G x 22 = IC **-G x 23 = IC **-G x 27 = SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 9

4 SEries IC37 Dual inline Package (DIP) - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute 20mΩ max. at 10mA/20mV max. 1A max. 40 C to +170 C (PPS) 25,000 to 50,000 insertions Materials and Finish Housing: Polyphenylenesulfide (PPS), glass filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features 2.54mm pitch Dual wipe contacts ensure high reliability Low costs due to selective gold plating Applicable for IC packages and side braze packages Ideal for automated burn-in IC37N R B G 4 Series No. Housing Material: R = PPS Contact Plating: B = Mating Terminals 0.3µm AU Solder Terminals 0.1µm AU No. of Contacts Row Space (0.3 = 0.3 inches) Gold Plating Straight Through Hole Type Outline Socket Dimensions Recommended PCB Layout 2.4 A B B±0.1 J±0.1 H J ± C D E F G (Contact pos.) G±0.1 Pin Count Top View from Socket 2.54mm Pitch Pin Count A B C D E F G H J IC37NRB-0083-G x 3 = IC37NRB-1403-G x 6 = IC37NRB-1603-G x 7 = IC37NRB-1803-G x 8 = IC37NRB-2003-G x 9 = IC37NRB-2004-G x 9 = IC37NRB-2203-G x 10 = IC37NRB-2204-G x 10 = IC37NRB-2403-G x 11 = IC37NRB-2404-G x 11 = IC37NRB-2406-G x 11 = IC37NRB-2803-G x 13 = IC37NRB-2804-G x 13 = IC37NRB-2806-G x 13 = IC37NRB-3203-G x 15 = IC37NRB-3204-G x 15 = IC37NRB-3206-G x 15 = IC37NRB-4006-G x 19 = IC37NRB-4206-G x 20 = IC37NRB-4806-G x 23 = SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

5 Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Series IC76 Materials and Finish Housing: Polysulphone (PSF), glass-filled Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 20mΩ max. at 10mA/20mV max. 1A max. 40 C to +170 C (PES) 25,000 to 50,000 insertions Features Shrink pitch (1.778mm) sockets for high-density mounting Dual wipe contacts ensure high reliability Shrink Dual Inline Package (SDIP) - TH IC76 Series No. Housing Material: 20 = PES No. of Contacts Row Space (0.6 = 0.6 inches) Contact Plating (G = Gold Plating) Straight Through Hole Type MF = Flanged Unmarked = Not Flanged G 4 mf PTH Devices - Dip / SDIP Outline Socket Dimensions Recommended PCB Layout A B H B H Pin Count 0.7 J 1.2 K C Spot facing ( 6.2, 3.0 deep) D (Contact pos.) E F G J G K Top View from Socket mm Pitch Pin Count A B C D E F G H J K IC G4 ** x 9 = IC G4 ** x 10 = IC G4 ** x 11 = IC G4 ** x 13 = IC G4 MF x 14 = IC G4 ** x 19 = IC G4 ** x 20 = IC G4 ** x 23 = IC G4 ** x 25 = IC G4** x 31 = SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 11

6 SEries IC121 Shrink Dual Inline Package (SDIP) - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Copper Alloy Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 20mΩ max. at 10mA/20mV max. 1A max. 40 C to +150 C 25,000 to 50,000 insertions Features Shrink pitch (1.778mm) sockets for high-density mounting Dual wipe contacts ensure high reliability Two terminal lengths (3mm / 5mm) available. The 5mm type can be used as a piggy-back socket Series No. No. of Contacts Row Space (0.6 = 0.6 inches) Contact Plating (G = Gold Plating) Straight Solder Dip Terminal Terminal Length Option: L = 5mm Unmarked = Not Flanged MF = Flanged Unmarked = Not Flanged IC G 4 L mf Outline Socket Dimensions Recommended PCB Layout A B R J ±0.1 D ±0.1 J C G F E D 1.2 H K 3.3 Hole 4.0 H ±0.1 B ± ± Top View from Socket 1.778mm Pitch Pin Count A B C D E F G H J K IC G4 ** IC G4 ** IC G4 ** IC G4 ** IC G4 ** IC G IC G4 ** IC G4 ** IC G4 ** SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

7 Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 40 C to +170 C Features Wiping action system: Cleans up IC lead surface during handling action Reliable 3 point contact system Cost performance: Different contact thickness for contact area and terminal area Depopulated versions available Also available with lever on the right hand side, standard type is lever on the left hand side Series np89 Pin Grid Array / Zero Insertion Force (PGA / ZIF) - TH Series No. No. of Contact Pins Design Number MF = Flanged Unmarked = Not Flanged Contact Plating (Gold) Contact Terminal Type NP mf G 4 PTH Devices - sdip / PGA-ziF Outline Socket Dimensions Recommended PCB Layout C A 2.54 B D 7.5 B E 0.55 G B F Lever left hand side (standard) Top View from Socket 2.54mm Pitch Pin Count Grid Size Socket and PCB Dimensions A B C D E F NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x NP **-G x SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 13 G

8 SEries np236 Pin Grid Array / Zero Insertion Force (Interstitial) - TH Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30mΩ max. at 10mA/20mV max. Current Rating: 1A max. Operating Temperature Range: 55 C to +170 C Pin Count: 1020 Materials and Finish Housing: Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper Plating: Gold over Nickel (B-class) Lever Shaft: Stainless Steel NP * Series No. No. of Contact Pins Design Number Contact Style of Matching IC Pin 1 = = Features 1.27mm pitch Outline Socket Dimensions NP * Outline IC Dimensions Recommended PCB Layout Top View from Socket NP * Ø max. (2.03) max. 0.4± ± x48=60.96± x48=60.96± ± (9.44) ± x48=60.96±0.1 (6.90) 14 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

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12 SEries IC100 Small Outline J-Lead (Dead Bug Insertion) 1.27mm Pitch - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 55 C to +170 C 10,000 insertions min. Features For inserting SOJ packages in Dead-bug orientation Outstanding durability with low insertion withdrawal force Guides for automated operation The larger contact area and two-point contact design ensures high contact reliability Series No. No. of Contact Pins Row Space (03 = 300ML) (04 = 400ML) IC ** mf G Please specify the number of contacts if a depopulated version is required MF = Flanged Unmarked = Not Flanged Contact Plating Specification Outline Socket Dimensions Recommended PCB Layout 1.27 A Pattern I Pattern II B Orientation of Applicable IC (Dead Bug) Pin No1 D±0.1 # Pin Count 0.8 Pin No1 D±0.1 # Pin Count H E±0.1 G± ±0.05 E±0.1 G± ± ± F± F± ± X 0.25 Top View from Socket 1.27mm Pitch *) Flange not available Row Spacing Pin Count Socket Dim. PCB Dimensions A B D E F G Pattern IC **xx-G 300 mil x 9 = II 8.4 *IC **-G 300 mil x 11 = I 8.4 *IC G 300 mil x 12 = II 8.4 *IC **-G 300 mil x 12 = II 8.4 *IC **-G 300 mil x 13 = I 8.4 IC **xx-G 300 mil x 15 = I 8.4 IC **xx-G 400 mil x 13 = I 10.9 *IC **-G 400 mil x 15 = I 10.9 IC **xx-G 400 mil x 17 = I 10.9 IC **xx-G 400 mil x 19 = I 10.9 IC **xx-G 400 mil x 20 = II 10.9 IC **xx-G 400 mil x 21 = I 10.9 IC **xx-G 500 mil x 17 = I 13.5 IC Dim. H 18 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

13 Series IC107 Small Outline J-Lead (Live Bug Insertion) 1.27mm Pitch - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 55 C to +170 C 10,000 insertions min. Features For inserting SOJ packages in Live-bug orientation Outstanding durability with low insertion withdrawal force Guides for automated operation The larger contact area and two-point contact design ensures high contact reliability Series No. No. of Contact Pins Row Space (03 = 300ML) (04 = 400ML) IC ** mf G Please specify the number of contacts if a depopulated version is required MF = Flanged Unmarked = Not Flanged Contact Plating Specification SMT DEVICES - SOJ Outline Socket Dimensions Recommended PCB Layout 1.27 A Pattern I Pattern II B Orientation of Applicable IC (Live Bug) Pin No1 D±0.1 # Pin Count 0.8 Pin No1 D±0.1 # Pin Count H E±0.1 G± ±0.05 E±0.1 G± ± ± F± F± ± X 0.25 Top View from Socket 1.27mm Pitch 1) Flange not available Row Spacing Pin Count Socket Dim. PCB Dimensions A B D E F G Pattern IC **xx-G 300 mil x 11 = I 8.4 IC xx-G 300 mil x 12 = II 8.4 IC **xx-G 300 mil x 13 = I 8.4 IC **xx-G 300 mil x 15 = I 8.4 IC **-G 1) 350 mil x 12 = II 9.7 IC xx-G 400 mil x 13 = I 10.9 IC **xx-G 400 mil x 13 = I 10.9 IC **xx-G 400 mil x 17 = I 10.9 IC **xx-G 400 mil x 19 = I 10.9 IC **xx-G 400 mil x 20 = II 10.9 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 19 IC Dim. H

14 SEries IC51 Plastic Lead Chip Carrier 1.27mm Pitch (Clamshell) - TH Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30mΩ max. at 10mA/20mV max. Current Rating: 1A max. Operating Temperature Range: 55 C to +170 C Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series No. No. of Contact Pins Number of Sides with Contacts Design Number IC Features Clamshell socket for PLCC packages IC orientation, Live bug Outline Socket Dimensions A B D Typical PLCC Package C 1.27mm Pitch Pin Count A B C (open) D (closed) IC IC IC IC IC IC IC IC IC SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

15 Series IC120 Plastic Lead Chip Carrier 1.27mm Pitch (Open Top) - TH Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 40 C to +170 C 10,000 insertions min. Materials and Finish Housing: Upper Body:- Polyphenylenesulfide (PPS) Lower Body:- Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features Two-point contacts and a larger contact width ensures high reliability Auto-ejecting type for automated operation (IC is inserted in one touch operation and pushing the cover raises it for easy IC removal) Available for two types of IC orientation (Live-bug & Dead-bug) Outline Socket Dimensions Series No. No. of Contact Pins Number of Sides with Contacts IC mf Terminal Arrangement and IC Orientation Design Number MF = Flanged Unmarked = Not Flanged Note: Mounting Flange is not available for 18, 20 and IC SMT DEVICES - PLCC 0.35 x 0.25 A C B 1.27mm Pitch Dead-bug type Dead Bug *Most compatible socket type Live-bug type Live Bug Inserting Direction of IC DB = Dead-bug LB = Live Bug Pin Count IC Insertion Socket Dimensions A B C *IC LB IC DB *IC DB IC DB *IC DB IC DB IC LB IC DB IC LB *IC DB *IC LB IC DB *IC LB IC DB IC LB *IC DB *IC LB IC DB IC LB IC DB Pin Count IC Insertion Socket Dimensions A B C IC LB *IC DB *IC LB IC DB IC LB IC DB IC LB *IC DB *IC LB *IC DB *IC LB IC DB IC LB *IC DB *IC LB IC LB IC LB *IC LB *IC LB SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 21

16 SEries Overview *SOP (Small Outline Packages, Gullwing Leads) Series IC51 (Clamshell - TH) to 1.27mm Pitch SOP, Tsop Type I & ii Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C (for type PSF) 55 C to +170 C (for type PES & PEI) Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series No. No. of Contact Pins Number of Sides with Contacts Design Number MF = Flanged Unmarked = Not Flanged IC mf Series IC189 (Open Top - TH) to 1.27mm Pitch SOP, Tsop Type I & ii Specifications Insulation Resistance: 1,000MΩ min. at 100V DC, pitch 0.4, 0.5 1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27 Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, V AC for 1 minute, pitch V AC for 1 minute, pitch 0.8, 1.27 Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C Mating Cycles: 10,000 insertions Contact Force: 20g to 80g per pin Materials and Finish Housing: Polysulphone (PSF), glass-filled Polyethersulphone (PES), glass-filled Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin IC * * Protection Key** K = With Protection Key Unmarked = Without Protectin Key ** Protection Key: Prevents IC from releasing during transportation Series IC235 (Open Top - TH) to 1.27mm Pitch SOP, Tsop Type ii Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C Mating Cycles: 10,000 insertions min. Contact Force: 20g to 80g per pin Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin IC * 22 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

17 Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Contact Force: SEries Overview Series IC191 (Open Top - TH) mm Pitch Thin Small Outline Package (Tsop Type I) Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 500V DC 700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 1A max. 40 C to +170 C 40 C to +150 C (type -004*) 10,000 insertions min. 20g to 80g per pin *SOP (Small Outline Packages, Gullwing Leads) Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin Unmarked = With Positioning Pin IC * SMT DEVICES - SOP (Gullwing) Contact Styles Series IC51 Series IC189 / IC191 Series IC235 Specialities Series IC (kelvin) Series IC (two point Contact) *SOP variations e.g. TSSOP... cont d next page SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 23

18 Applicable Dimensions SOP (Small Outline Packages, Gullwing Leads) Clamshell Type Sockets E B IC51 Series D Open Top Type Sockets D D D E E E IC235 Series IC189 Series IC191 Series SO package Type I C A C A Type II C B A A = Body width B = Lid size for IC C = Tip-to-Tip SO package orientation 0.40mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) C L = Clamshell, OT = Open Top, S = Seperator, FB = Floating Base IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 34.0 SOP CL/FB IC x 34.0 SOP CL/FB IC x 34.0 SOP CL/FB IC * x 16.0 TSOP I OT IC x 34.0 SOP CL/FB IC * x 18.0 TSOP I OT IC x 34.0 SOP CL/FB IC x 34.0 SOP CL/FB Note 0.50mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 40.0 TSOP I CL/FB IC x 38.0 SOP CL/FB IC *-* x 16.0 TSOP I OT IC x 33.5 TSOP I CL/FB IC x 44.0 TSOP I CL/FB IC x 39.0 TSOP I CL/FB IC x 38.0 SOP CL/FB IC * x 16.0 TSOP I OT IC *-* x 40.0 TSOP I OT IC x 44.0 TSOP I CL/FB IC x 44.0 TSOP I CL/FB IC * x 20.0 TSOP I OT IC * x 18.0 TSOP I OT IC * x 18.2 SOP OT IC *-* x 20.0 TSOP I OT IC x 44.0 TSOP I CL/FB IC x 38.0 SOP CL/FB IC x 44.0 TSOP I CL/FB IC x 34.0 SOP NO LID IC * x 20.0 TSOP I OT IC * x 40.0 TSOP I OT IC x 38.0 SOP CL/FB IC x 34.0 SOP NO LID Note 24 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

19 0.55 / 0.6 / 0.635mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 37.0 SOP CL/FB IC x 39.0 SOP CL/FB IC KS x 35.0 SOP CL/S IC x 35.0 SOP CL/S 0.65mm Pitch Applicable Dimensions SOP (Small Outline Packages, Gullwing Leads) Note SMT DEVICES - SOP (Gullwing) Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC A x 32.0 SOP CL/S IC x 32.0 SOP CL/S IC x 32.0 SOP CL/FB IC x 32.0 SOP CL/S IC KS x 32.0 SOP CL/S IC * x 22.5 SOP OT IC x 32.0 SOP CL/S IC x 32.0 SOP CL/FB IC KS x 32.0 SOP CL/S IC P x 21.5 SOP OT IC x 32.0 SOP CL/S IC x 32.0 SOP CL/FB IC KS x 32.0 SOP CL/S IC x 32.0 SOP CL/S IC x 24.0 SOP OT IC x 32.0 SOP CL/FB IC * x 22.5 SOP OT IC x 32.0 SOP CL/S IC x 32.0 SOP CL/S IC N x 22.5 SOP OT IC x 36.0 SOP CL/S Note 0.80mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 32.4 SOP CL/S IC x 31.5 SOP CL/S IC x 38.5 SOP CL/FB IC x 32.5 SOP CL/S IC x 38.5 SOP FB IC *-* x 25.4 SOP OT IC x 38.0 SOP FB IC x 42.5 SOP FB IC x 36.5 SOP CL/S IC * x 29.8 SOP OT IC * x 29.8 SOP OT IC x 48.5 SOP CL/S IC *-* x SOP OT IC *-* x SOP OT IC *-* x SOP OT IC * x 37.0 SOP OT IC x 42.0 SOP CL/S IC (50) x 36.5 SOP CL/S Note SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 25

20 Applicable Dimensions SOP (Small Outline Packages, Gullwing Leads) Clamshell Type Sockets E B IC51 Series D Open Top Type Sockets D D D E E E IC235 Series IC189 Series IC191 Series SO package Type I C A C A Type II C B A A = Body width B = Lid size for IC C = Tip-to-Tip SO package orientation 1.00mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) C L = Clamshell, OT = Open Top, S = Seperator, FB = Floating Base IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 28.5 SOP CL/S IC x 32.0 SOP CL/S IC x 35.0 SOP CL/S Note 1.25mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC x 27.5 SOP CL/S Note 1.27mm Pitch Pin Count IC Body A IC Socket and Lid Size B (max.) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC * x 12.0 SOP OT IC x 32.5 SOP CL/FB IC x 30.0 SOP CL/S IC KS x 27.2 SOP CL/S IC x 32.5 SOP CL/FB IC KS x 27.2 SOP CL/S IC KS x 31.5 SOP CL/S IC *-* x 15.8 SOP OT IC *-* x 16.0 SOP OT IC x 32.5 SOP CL/FB IC x 27.2 SOP CL/S IC x 27.2 SOP CL/S IC x 35.0 SOP CL/S IC x 28.5 SOP CL/S IC x 28.5 SOP CL/S IC x 28.5 SOP CL/S IC x 28.5 SOP CL/S IC x 28.5 SOP CL/S IC x 30.5 SOP CL/S IC x 31.5 SOP CL/S IC x 28.5 SOP CL/S Note 26 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

21 1.27mm Pitch (CONT'D) Applicable Dimensions Pin Count IC Body A IC Socket and Lid Size B (max.) SOP (Small Outline Packages, Gullwing Leads) IC Tip-to-Tip C Socket Dimensions D x E Package Type IC KS x 31.5 SOP CL/S IC x 22.5 SOP OT IC x 32.5 SOP CL/FB IC x 36.5 SOP CL/S IC x 31.5 SOP CL/S IC x 32.0 SOP CL/FB IC x 26.0 SOP CL/S IC KS x 32.0 SOP CL/S IC x 29.0 SOP CL/S IC * x 22.5 SOP OT IC x 32.5 SOP CL/FB IC x 36.5 SOP CL/S IC x 31.5 SOP CL/S IC x 32.0 SOP CL/FB IC x 28.5 SOP CL/S IC x 32.5 SOP CL/S IC x 29.0 SOP CL/S IC x 32.5 SOP CL/FB IC x 35.5 SOP CL/FB IC *.KS x 32.5 SOP CL/S IC * x 22.5 SOP OT IC x 50.0 SOP CL/S IC x 32.5 SOP CL/S IC x 32.5 SOP CL/S IC x 32.5 SOP CL/S IC x 35.5 SOP CL/FB IC x 32.5 SOP CL/S IC x 32.5 SOP CL/S IC *-* x 26.5 SOP OT IC *-* x 27.5 SOP OT IC x 32.5 SOP CL/S IC x 33.0 SOP CL/S IC x 33.0 SOP CL/S IC x 31.5 SOP CL/S IC x 42.5 SOP CL/FB IC x 52.0 SOP CL/S IC x 34.5 SOP CL/S IC * x SOP OT IC x 55.0 SOP CL/S IC x 40.5 SOP CL/FB IC x 55.0 SOP CL/S Note SMT DEVICES - SOP (Gullwing) SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 27

22 SEries Overview *QFP (Quad Flat Packages, Gullwing Leads) Series IC51 (Clamshell - TH) mm to 1.27mm Qfp, PQfp, TQfp and MQuad *QFP variations e.g. BQFP... Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Materials and Finish Housing: Polysulphone (PSF), glass-filled Polyethersulphone (PES), glass-filled Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 1,000MΩ min. at 100V DC for 1 minute (socket depended) 30mΩ max. at 10mA/20mV max. 40 C to +150 C (for type PEI/PSF) 55 C to +170 C (for type PES) 55 C to +170 C (for type PEI) 10,000 insertions min. Series No. No. of Contact Pins Number of Sides with Contacts Design Number IC As specifications for this product differ by pitch and material-mix, please contact Yamaichi for detailed information. Series IC357 and IC402 (Open Top - TH) mm to 0.8mm Quad Flat Package (Qfp) with 2-Point ContaCT Type Specifications Insulation Resistance: 1,000MΩ min. at 500V DC, pitch 0.4 to 0.8 Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.5 to 0.8 Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C Mating Cycles: 10,000 insertions min. Contact Force: 20g to 45g per pin Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES) glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel IC * Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin Series IC234 (Open Top - TH) - 0.4mm to 0.8mm Quad Flat Package (Qfp) with shoulder ContaCT Type Specifications Insulation Resistance: 1,000MΩ min. at 100V DC pitch 0.4, 0.5 1,000MΩ min. at 500V DC pitch 0.65, 0.8 Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, V AC for 1 minute pitch V AC for 1 minute pitch 0.8 Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C Contact Force: 20g to 80g per pin Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES) glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel IC * Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin K = Protection Key** ** Protection Key: Prevents IC from releasing during transportation 28 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

23 Series IC200 / IC201 / IC216 / IC217 / IC218 / IC248 (Open Top - TH) mm to 0.80mm Quad Flat Packages (Qfp) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Mating Cycles: The information above is typical for this Series for individual specifications please contact Yamaichi Materials and Finish Housing: Contacts: Plating: SEries Overview Polyetherimide (PEI), glass-filled Polyphenylenesulfide (PPS), glass-filled Beryllium Copper (BeCu) Gold over Nickel 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC 100/500/700V AC for 1 minute 30mΩ max. at 10mA/20mV max. 40 C to +170 C and 40 C to +150 C 20g to 80g per pin 10,000 insertions min. *QFP (Quad flat Packages, Gullwing Leads) Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin IC * - * Protection Key** K = With Protection Key Unmarked = Without Protectin Key ** Protection Key: Prevents IC from releasing during transportation SMT DEVICES - QFP (Gullwing) Series IC500 (Open Top - TH) mm to 0.80mm Quad Flat Package (Qfp) with 2-Point ContaCT Type Specifications Insulation Resistance: 1,000MΩ min. at 100V DC pitch 0.5 1,000MΩ min. at 500V DC pitch 0.65, 0.8 Dielectric Withstanding Voltage: 100V AC for 1 minute pitch V AC for 1 minute pitch V AC for 1 minute pitch 0.8 Contact Resistance: 30mΩ max. at 10mA/20mV max. Operating Temperature Range: 40 C to +150 C Contact Force: 20g to 80g per pin Mating Cycles: 10,000 insertions min. Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES) glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Series No. No. of Contact Pins Number of Sides with Contacts Design Number Positioning Pin: N = Without Positioning Pin P = With Positioning Pin K = Protection Key** IC * ** Protection Key: Prevents IC from releasing during transportation Contact Styles Series IC51 Series IC357 / IC402 Series IC234 Series IC (kelvin) Series IC2** Series IC500 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 29

24 Applicable Dimensions QFP (Quad Flat Packages, Gullwing Leads) Outline IC Package Dimensions Outline Open Top Socket Dimensions Outline Clamshell Socket Dimensions C A H H E B D G G E E F 0.40mm Pitch C L = Clamshell, OT = Open Top Pin Count IC Body A x B IC Tip-to-Tip C X D Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC x x x 32.0 CL IC x x x 30.0 OT IC x x x 32.0 OT IC * x x x 42.5 CL IC * x x x 34.0 OT IC x x x 42.5 CL IC x x x 42.5 CL IC * x x x 34.0 OT IC x x x 34.0 OT IC x x x 34.0 OT IC x x x 42.5 CL IC x x x 42.5 CL IC x x x 42.5 CL IC * ,0 x 16, x x 36.0 OT QFP11T x x x 42.5 CL IC P x x x 44.0 OT IC * ,0 x 20, x x 40.0 OT IC x x x 50.0 CL IC x x x 50.0 CL IC * x x x 44.0 OT IC * x x x 44.0 OT IC x x x 48.0 CL IC x x x 48.0 CL IC * x x x 48.0 OT IC * x x x 48.0 OT IC x x x 62.0 CL IC x x x 62.0 CL IC x x x 62.0 CL IC x x x 62.0 CL Type 0.50mm Pitch Pin Count IC Body A x B IC Tip-to-Tip C X D Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC x x x 31.0 CL IC * x x x 26.6 OT IC * x x x 26.6 OT IC * x x x 22.0 OT IC x x x 32.0 CL IC x x x 32.0 CL IC * x x x 36.0 OT IC * x x x 28.7 OT IC * x x x 29.6 OT IC * x x x 29.6 OT Type 30 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor

25 0.50mm Pitch (cont d) Pin Count Applicable Dimensions IC Body A x B IC Tip-to-Tip C X D QFP (Quad Flat Packages, Gullwing Leads) Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC x x x 26.2 OT IC x x x 29.6 OT IC x x x 35.0 CL IC AC x x x 35.0 CL IC *-* x x x 29.0 OT IC * x x x 29.0 OT IC * x x x 31.6 OT IC x x x 29.0 OT IC x x x 29.0 OT IC x x x 37.0 CL IC x x x 37.0 CL IC x x x 37.0 CL IC *-* x x x 31.0 OT IC * x x x 31.0 OT IC * x x x 33.6 OT IC x x x 31.9 OT IC x x x 31.9 OT IC x x x 31.9 OT IC * x x x 23.8 OT IC x x x 33.6 OT IC x x x 39.0 CL IC x x x 39.0 CL IC x x x 39.0 CL IC x x x 39.0 CL IC KS x x x 39.0 CL IC * x x x 35.6 OT IC x x x 43.0 CL IC KS x x x 36.7 OT IC *-* x x x 43.4 OT IC * x x x 37.0 OT IC x x x 39.6 OT IC x x x x 43.0 CL IC x x x x 43.0 CL IC x x x x 43.0 CL IC * x x x 37.0 OT IC * x x x 37.0 OT IC * x x OT IC * x x x 37.0 OT IC * x x x 30.0 OT IC P x x x 37.0 OT IC x x x 47.0 CL IC x x x 47.0 CL IC x x x 50.0 CL IC x x x 46.0 OT IC * x x x 46.0 OT IC * x x x 46.0 OT IC * x x x 46.0 OT IC x x x 41.0 OT IC x x x 36.0 OT IC x x x 41.0 OT IC x x x 41.0 OT IC x x x 50.0 CL IC x x x 50.0 CL IC x x x 50.0 CL IC *-* x x x 52.2 OT IC *-* x x x 50.6 OT IC *-* x x x 45.0 OT IC * x x x 45.6 OT IC x x x 45.0 OT Type SMT DEVICES - QFP (Gullwing) cont d next page SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - semiconductor 31

26 Applicable Dimensions QFP (Quad Flat Packages, Gullwing Leads) Outline IC Package Dimensions Outline Open Top Socket Dimensions Outline Clamshell Socket Dimensions C A H H E B D G G E E F 0.50mm Pitch (cont'd) Pin Count IC Body A x B IC Tip-to-Tip C X D Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC P x x x 45.6 OT IC * x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC x x x 58.0 CL IC * x x x 56.1 OT IC * x x x 51.6 OT IC x x x 62.0 CL IC *-* x x x 57.6 OT IC x x x 72.0 CL IC x x x 57.6 OT IC x x x 72.0 CL IC x x x 72.0 CL Type 0.635mm Pitch Pin Count IC Body A x B IC Tip-to-Tip C X D Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC x 22x x x 34.0 OT IC *-* x x x 47.4 OT IC x x x 40.0 OT IC x x x 83.0 OT Type 0.65mm Pitch Pin Count IC Body A x B IC Tip-to-Tip C X D Parallel Clamp E 1/2 IC Height F Socket Dim. G x H IC x x x 34.5 CL QFP11T A102221* x x x 37.0 CL IC * x x x 29.3 OT IC x x x 35.5 CL IC x x x 29.0 OT IC x x x 39.0 CL IC x x x 42.0 CL IC x x x x 41.0 CL IC *-* x x x 38.9 OT IC *-* x x x 32.2 OT Type 32 SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Contacting - SemiconduCtor