Philips PCF5213EL1/044/3E Nexperia TM Multimedia Baseband Controller Functional Analysis
|
|
- Peregrine Stafford
- 7 years ago
- Views:
Transcription
1 May 2, 2005 Philips PCF5213EL1/044/3E Nexperia TM Functional Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks.
2 Functional Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 1.5 Process Summary 2 Package and Die Analysis 2.1 Package 2.2 OM (DSP Core) Die 2.3 OM (ARM Core) Die 3 Process Analysis 3.1 OM (DSP Core) Device Structure 3.2 OM (ARM Core) Device Structure 4 Functional Block Analysis 4.1 Major Functional Blocks 4.2 Functional Block Measurements 5 Memory Analysis 5.1 Annotated Die Photograph Memory 5.2 Memory Measurements 5.3 SEM Topographical Images 6 Analog Functional Block Analysis 6.1 Analog Functional Blocks 6.2 Analog Block Measurements 6.3 Optical Topographical Images of Analog Blocks 7 Logic Analysis 8 Report Evaluation
3 Overview 1.1 List of Figures Block Diagram of the Nexperia System Solution Package and Die Analysis Package Top Package Bottom Package X-Ray OM (DSP Core) Die Die Markings Die Corner Minimum Pitch Bond Pads OM (ARM Core) Die Die Markings Die Markings Die Corner Minimum Pitch Bond Pads 3 Process Analysis General Structure of OM Minimum Pitch Metal Minimum Gate Length NMOS Transistors General Structure of OM Minimum Pitch Metal Minimum Gate Length NMOS Transistors 4 Functional Block Analysis Major Functional Blocks OM Major Functional Blocks OM
4 Overview 5 Memory Analysis OM Annotated Metal 1 Die Photograph Memory OM Annotated Metal 1 Die Photograph Memory T SRAM 1 Cells Polysilcon T SRAM 2 Cells Polysilcon T SRAM 3 Cells Polysilicon ROM Cells - Polysilicon 6 Analog Functional Block Analysis Analog Functional Block Block Diagram form PCF5213 Product Application Brief RF Interface Metal Audio Interface Metal Bandgap Reference Metal 1 7 Logic Analysis OM NAND Cell Polysilicon 8 Report Evaluation 1.2 List of Tables Device Summary OM (DSP Core) Device Summary OM (ARM Core) Device Summary Summary of OM (DSP Core) Process Findings Summary of OM (ARM Core) Process Findings Observed Critical Dimensions OM Observed Critical Dimensions OM Functional Block Measurements Memory Measurements Analog Block Measurements 1-2
5 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
Micron MT9D111 2 Megapixel CMOS Image Sensor Functional Analysis
March 17, 2006 Micron MT9D111 2 Megapixel CMOS Image Sensor Functional Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationQualcomm QCA6174 802.11ac Wi-Fi 2x2 MIMO Combo SoC
Qualcomm QCA6174 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationInvenSense MPU-6515 6-Axis Accelerometer Gyroscope MEMS Motion Sensor
InvenSense MPU-6515 6-Axis Accelerometer Gyroscope MEMS Motion Sensor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report
More informationApple/AuthenTec TMDR92 iphone 5s, 6, and 6 Plus Fingerprint Sensor
Apple/AuthenTec TMDR92 iphone 5s, 6, and 6 Plus Fingerprint Sensor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613.829.0414 www.chipworks.com Some of the information in this report may
More informationIntel Q3GM ES 32 nm CPU (from Core i5 660)
Intel Q3GM ES Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call
More informationMicron MT29F2G08AAB 2 Gbit NAND Flash Memory Structural Analysis
August 17, 2006 Micron MT29F2G08AAB 2 Gbit NAND Flash Memory Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationAtmel. MXT224 Touch Screen Controller. Circuit Analysis of Charge Integrator, ADC, and I/O Blocks
Atmel MXT224 Touch Screen Controller Circuit Analysis of Charge Integrator, ADC, and I/O Blocks For questions, comments, or more information about this report, or for any additional technical needs concerning
More informationNXP PN548 (65V10) Near Field Communication Module
NXP PN548 (65V10) Module Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 chipworks.com Basic Functional Analysis 2 Some of the information in this
More informationSample Project List. Software Reverse Engineering
Sample Project List Software Reverse Engineering Automotive Computing Electronic power steering Embedded flash memory Inkjet printer software Laptop computers Laptop computers PC application software Software
More informationWinbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process
Winbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationAMD/ATI 215-0754009-00 RV840 Juniper GPU (from Radeon TM HD 5750 Graphics Card)
AMD/ATI 215-0754009-00 RV840 Juniper GPU (from Radeon TM HD 5750 Graphics Card) Circuit Analysis of GDDR5 I/O Drivers, Receivers, DLL, and PLL Table of Contents 3685 Richmond Road, Suite 500, Ottawa, ON
More informationAMD AXDA3000DKV4D Athlon TM XP Microprocessor Structural Analysis
September 22, 2004 AMD AXDA3000DKV4D Athlon TM XP Microprocessor Structural Analysis Table of Contents Introduction... Page 1 List of Figures... Page 2 Device Identification Major Microstructural Analysis
More informationWinbond W2E512/W27E257 EEPROM
Construction Analysis Winbond W2E512/W27E257 EEPROM Report Number: SCA 9703-533 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:
More information7a. System-on-chip design and prototyping platforms
7a. System-on-chip design and prototyping platforms Labros Bisdounis, Ph.D. Department of Computer and Communication Engineering 1 What is System-on-Chip (SoC)? System-on-chip is an integrated circuit
More informationClass 18: Memories-DRAMs
Topics: 1. Introduction 2. Advantages and Disadvantages of DRAMs 3. Evolution of DRAMs 4. Evolution of DRAMs 5. Basics of DRAMs 6. Basics of DRAMs 7. Write Operation 8. SA-Normal Operation 9. SA-Read Operation
More informationLayout and Cross-section of an inverter. Lecture 5. Layout Design. Electric Handles Objects. Layout & Fabrication. A V i
Layout and Cross-section of an inverter Lecture 5 A Layout Design Peter Cheung Department of Electrical & Electronic Engineering Imperial College London V DD Q p A V i V o URL: www.ee.ic.ac.uk/pcheung/
More informationRAM & ROM Based Digital Design. ECE 152A Winter 2012
RAM & ROM Based Digital Design ECE 152A Winter 212 Reading Assignment Brown and Vranesic 1 Digital System Design 1.1 Building Block Circuits 1.1.3 Static Random Access Memory (SRAM) 1.1.4 SRAM Blocks in
More informationDefining Platform-Based Design. System Definition. Platform Based Design What is it? Platform-Based Design Definitions: Three Perspectives
Based Design What is it? Question: How many definitions of Based Design are there? Defining -Based Design Answer: How many people to you ask? What does the confusion mean? It is a definition in transition
More informationFLASH TECHNOLOGY DRAM/EPROM. Flash. 1980 1982 1984 1986 1988 1990 1992 1994 1996 Year Source: Intel/ICE, "Memory 1996"
10 FLASH TECHNOLOGY Overview Flash memory technology is a mix of EPROM and EEPROM technologies. The term flash was chosen because a large chunk of memory could be erased at one time. The name, therefore,
More informationThe MOSFET Transistor
The MOSFET Transistor The basic active component on all silicon chips is the MOSFET Metal Oxide Semiconductor Field Effect Transistor Schematic symbol G Gate S Source D Drain The voltage on the gate controls
More informationNAND Flash FAQ. Eureka Technology. apn5_87. NAND Flash FAQ
What is NAND Flash? What is the major difference between NAND Flash and other Memory? Structural differences between NAND Flash and NOR Flash What does NAND Flash controller do? How to send command to
More informationECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path
ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path Project Summary This project involves the schematic and layout design of an 8-bit microprocessor data
More informationIntroduction to Digital System Design
Introduction to Digital System Design Chapter 1 1 Outline 1. Why Digital? 2. Device Technologies 3. System Representation 4. Abstraction 5. Development Tasks 6. Development Flow Chapter 1 2 1. Why Digital
More informationSemiconductor Memories
Semiconductor Memories Semiconductor memories array capable of storing large quantities of digital information are essential to all digital systems Maximum realizable data storage capacity of a single
More informationLM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit
Micropower Step-up DC/DC Converter with 550mA Peak Current Limit General Description The LM2704 is a micropower step-up DC/DC in a small 5-lead SOT-23 package. A current limited, fixed off-time control
More informationGates, Circuits, and Boolean Algebra
Gates, Circuits, and Boolean Algebra Computers and Electricity A gate is a device that performs a basic operation on electrical signals Gates are combined into circuits to perform more complicated tasks
More informationState-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop
Photos placed in horizontal position with even amount of white space between photos and header State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Michael Holmes Manager, Mixed Signal ASIC/SoC
More informationEmbedded STT-MRAM for Mobile Applications:
Embedded STT-MRAM for Mobile Applications: Enabling Advanced Chip Architectures Seung H. Kang Qualcomm Inc. Acknowledgments I appreciate valuable contributions and supports from Kangho Lee, Xiaochun Zhu,
More informationUSB2229/USB2230. 5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs PRODUCT FEATURES.
USB2229/USB2230 5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs PRODUCT FEATURES IrDA Controller IrDA v1.1 FIR and SIR Compliant Controller, with 9.6K, 19.2K,
More informationModule 7 : I/O PADs Lecture 33 : I/O PADs
Module 7 : I/O PADs Lecture 33 : I/O PADs Objectives In this lecture you will learn the following Introduction Electrostatic Discharge Output Buffer Tri-state Output Circuit Latch-Up Prevention of Latch-Up
More informationECE 410: VLSI Design Course Introduction
ECE 410: VLSI Design Course Introduction Professor Andrew Mason Michigan State University Spring 2008 ECE 410, Prof. A. Mason Lecture Notes Page i.1 Age of electronics microcontrollers, DSPs, and other
More informationSystems Analysis for IP Campaigns. William Betten Medical Technology Director UBM TechInsights December 5, 2012
Systems Analysis for IP Campaigns William Betten Medical Technology Director UBM TechInsights December 5, 2012 UBM TechInsights Overview Professional Services Full suite of IP Services, including Patent
More informationHow To Scale At 14 Nanomnemester
14 nm Process Technology: Opening New Horizons Mark Bohr Intel Senior Fellow Logic Technology Development SPCS010 Agenda Introduction 2 nd Generation Tri-gate Transistor Logic Area Scaling Cost per Transistor
More informationUnternehmerseminar WS 2009 / 2010
Unternehmerseminar WS 2009 / 2010 Fachbereich: Maschinenbau und Mechatronik Autor / Thema / Titel: Key Enabling Technology Business Planning Process: Product Roadmaps 1 Table of Contents About AIXTRON
More informationLM78XX Series Voltage Regulators
LM78XX Series Voltage Regulators General Description Connection Diagrams The LM78XX series of three terminal regulators is available with several fixed output voltages making them useful in a wide range
More informationDC to 30GHz Broadband MMIC Low-Power Amplifier
DC to 30GHz Broadband MMIC Low-Power Amplifier Features Integrated LFX technology: Simplified low-cost assembly Drain bias inductor not required Broadband 45GHz performance: Good gain (10 ± 1.25dB) 14.5dBm
More informationAttorney Advertising. Architects of ROI in IP
Attorney Advertising Architects of ROI in IP intellectual property monetization Intellectual property is one of the most underleveraged assets in investment portfolios. Knowing how to monetize these assets
More informationAlgorithms and Methods for Distributed Storage Networks 3. Solid State Disks Christian Schindelhauer
Algorithms and Methods for Distributed Storage Networks 3. Solid State Disks Institut für Informatik Wintersemester 2007/08 Solid State Disks Motivation 2 10 5 1980 1985 1990 1995 2000 2005 2010 PRODUCTION
More informationThe new 32-bit MSP432 MCU platform from Texas
Technology Trend MSP432 TM microcontrollers: Bringing high performance to low-power applications The new 32-bit MSP432 MCU platform from Texas Instruments leverages its more than 20 years of lowpower leadership
More informationArea 3: Analog and Digital Electronics. D.A. Johns
Area 3: Analog and Digital Electronics D.A. Johns 1 1970 2012 Tech Advancements Everything but Electronics: Roughly factor of 2 improvement Cars and airplanes: 70% more fuel efficient Materials: up to
More information1. True or False? A voltage level in the range 0 to 2 volts is interpreted as a binary 1.
File: chap04, Chapter 04 1. True or False? A voltage level in the range 0 to 2 volts is interpreted as a binary 1. 2. True or False? A gate is a device that accepts a single input signal and produces one
More informationWhat is a System on a Chip?
What is a System on a Chip? Integration of a complete system, that until recently consisted of multiple ICs, onto a single IC. CPU PCI DSP SRAM ROM MPEG SoC DRAM System Chips Why? Characteristics: Complex
More informationHow To Make Money From Semiconductor Production
ASML 2011 Third Quarter Results Confirming expectation for record sales year Oct 12, 2011 / Slide 1 Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the
More informationLecture 5: Gate Logic Logic Optimization
Lecture 5: Gate Logic Logic Optimization MAH, AEN EE271 Lecture 5 1 Overview Reading McCluskey, Logic Design Principles- or any text in boolean algebra Introduction We could design at the level of irsim
More information8 Gbps CMOS interface for parallel fiber-optic interconnects
8 Gbps CMOS interface for parallel fiberoptic interconnects Barton Sano, Bindu Madhavan and A. F. J. Levi Department of Electrical Engineering University of Southern California Los Angeles, California
More information1.1 Silicon on Insulator a brief Introduction
Table of Contents Preface Acknowledgements Chapter 1: Overview 1.1 Silicon on Insulator a brief Introduction 1.2 Circuits and SOI 1.3 Technology and SOI Chapter 2: SOI Materials 2.1 Silicon on Heteroepitaxial
More informationINSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad - 500 043
INSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad - 500 043 ELECTRONICS AND COMMUNICATION ENGINEERING Course Title VLSI DESIGN Course Code 57035 Regulation R09 COURSE DESCRIPTION Course Structure
More informationPAC52XX Clock Control Firmware Design
APPLICATION NOTE PAC52XX Clock Control Firmware Design TM Marc Sousa Senior Manager, Systems and Firmware www.active-semi.com Copyright 2014 Active-Semi, Inc. TABLE OF CONTENTS APPLICATION NOTE... 1 Table
More informationSPI-8001TW. Switching Regulators. Dual 1.5 A, DC/DC Step-Down Converter. SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/
Data Sheet 27469.301.1 Designed to meet high-current requirements at high efficiency in industrial and consumer applications; embedded core, memory, or logic supplies; TVs, VCRs, and office equipment,
More informationJerry Haynes Law registered patent attorney
Jerry Haynes Law registered patent attorney 2 North Oakdale Avenue Medford, OR 97501 Phone: (541) 494-1433 Fax: (206) 222-1641 www.jerryhayneslaw.com Located in Medford, Oregon, Jerry Haynes Law assists
More informationSmart Card Security How Can We Be So Sure?
Smart Card Security How Can We Be So Sure? Ernst Bovelander TNO Centre for Evaluation of Instrumentation and Security Techniques PO Box 5013 2600 GA Delft, The Netherlands bovenlander@tpd.tno.nl 1. Introduction
More informationComputer Systems Structure Main Memory Organization
Computer Systems Structure Main Memory Organization Peripherals Computer Central Processing Unit Main Memory Computer Systems Interconnection Communication lines Input Output Ward 1 Ward 2 Storage/Memory
More informationUpon completion of unit 1.1, students will be able to
Upon completion of unit 1.1, students will be able to 1. Demonstrate safety of the individual, class, and overall environment of the classroom/laboratory, and understand that electricity, even at the nominal
More informationHomework # 2. Solutions. 4.1 What are the differences among sequential access, direct access, and random access?
ECE337 / CS341, Fall 2005 Introduction to Computer Architecture and Organization Instructor: Victor Manuel Murray Herrera Date assigned: 09/19/05, 05:00 PM Due back: 09/30/05, 8:00 AM Homework # 2 Solutions
More informationThe State-of-the-Art in IC Reverse Engineering
The State-of-the-Art in IC Reverse Engineering Randy Torrance and Dick James Chipworks Inc. 3685 Richmond Road, Ottawa, Ontario, Canada K2H 5B7 rtorrance@chipworks.com, djames@chipworks.com Abstract. This
More informationProgrammable Logic IP Cores in SoC Design: Opportunities and Challenges
Programmable Logic IP Cores in SoC Design: Opportunities and Challenges Steven J.E. Wilton and Resve Saleh Department of Electrical and Computer Engineering University of British Columbia Vancouver, B.C.,
More informationLesson 7: SYSTEM-ON. SoC) AND USE OF VLSI CIRCUIT DESIGN TECHNOLOGY. Chapter-1L07: "Embedded Systems - ", Raj Kamal, Publs.: McGraw-Hill Education
Lesson 7: SYSTEM-ON ON-CHIP (SoC( SoC) AND USE OF VLSI CIRCUIT DESIGN TECHNOLOGY 1 VLSI chip Integration of high-level components Possess gate-level sophistication in circuits above that of the counter,
More informationQsys and IP Core Integration
Qsys and IP Core Integration Prof. David Lariviere Columbia University Spring 2014 Overview What are IP Cores? Altera Design Tools for using and integrating IP Cores Overview of various IP Core Interconnect
More informationCHAPTER 16 MEMORY CIRCUITS
CHPTER 6 MEMORY CIRCUITS Chapter Outline 6. atches and Flip-Flops 6. Semiconductor Memories: Types and rchitectures 6.3 Random-ccess Memory RM Cells 6.4 Sense-mplifier and ddress Decoders 6.5 Read-Only
More informationINTELLECTUAL PROPERTY CREDENTIALS. Services Summary Brooks Consulting s intellectual property offerings fall into three main categories:
INTELLECTUAL PROPERTY CREDENTIALS Brooks Consulting LLC provides litigation and management consulting services to small businesses, international conglomerates and law firms of every size. Not just consultants
More informationC8051F020 Utilization in an Embedded Digital Design Project Course. Daren R. Wilcox Southern Polytechnic State University Marietta, Georgia
C8051F020 Utilization in an Embedded Digital Design Project Course Daren R. Wilcox Southern Polytechnic State University Marietta, Georgia Abstract In this paper, the utilization of the C8051F020 in an
More informationSuperIOr Controller. Digital Dynamics, Inc., 2014 All Rights Reserved. Patent Pending. Rev: 5-16-14 1
SuperIOr Controller The SuperIOr Controller is a game changer in the world of high speed embedded control. The system combines incredible speed of both control and communication with revolutionary configurable
More informationConfidentio. Integrated security processing unit. Including key management module, encryption engine and random number generator
Confidentio Integrated security processing unit Including key management module, encryption engine and random number generator Secure your digital life Confidentio : An integrated security processing unit
More informationEPC C-1 G-2 / ISO 18000-6C RFID IC
EM MICROELECTRONIC - MARIN SA EPC C-1 G-2 / ISO 18000-6C RFID IC Description is a certified EPC TM Class-1 Generation-2 (Gen2) IC and compliant with ISO/IEC 18000-6:2010 Type C. Each chip is manufactured
More informationNanotechnologies for the Integrated Circuits
Nanotechnologies for the Integrated Circuits September 23, 2015 Dr. Bertrand Cambou Professor of Practice NAU, Cybersecurity School of Informatics, Computing, and Cyber-Systems Agenda The Market Silicon
More informationRF Test Gage R&R Improvement
Percentage Contribution RF Test Gage R&R Improvement James Oerth and Mike Downs Skyworks Solutions, Inc 20 Sylvan Road, Woburn, MA, 01801, USA Tel: (781) 376-3076, Email: jim.oerth@skyworksinc.com Keywords:
More informationdesign Synopsys and LANcity
Synopsys and LANcity LANcity Adopts Design Reuse with DesignWare to Bring Low-Cost, High-Speed Cable TV Modem to Consumer Market What does it take to redesign a commercial product for a highly-competitive
More informationRiding silicon trends into our future
Riding silicon trends into our future VLSI Design and Embedded Systems Conference, Bangalore, Jan 05 2015 Sunit Rikhi Vice President, Technology & Manufacturing Group General Manager, Intel Custom Foundry
More informationDollars For Genes: Revenue Generation by the California Institute for Regenerative Medicine
Dollars For Genes: Revenue Generation by the California Institute for Regenerative Medicine Richard Gilbert University of California at Berkeley Conference on California s Stem Cell Initiative March 2-4,
More informationMemory Basics. SRAM/DRAM Basics
Memory Basics RAM: Random Access Memory historically defined as memory array with individual bit access refers to memory with both Read and Write capabilities ROM: Read Only Memory no capabilities for
More informationSN54165, SN54LS165A, SN74165, SN74LS165A PARALLEL-LOAD 8-BIT SHIFT REGISTERS
The SN54165 and SN74165 devices SN54165, SN54LS165A, SN74165, SN74LS165A PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments
More informationImation s Technology Pillars
Imation s Technology Pillars Subodh Kulkarni VP R&D and Manufacturing November 14, 2006 1 Imation Technology Capabilities Magnetic Tape State-of-art TeraAngstrom Pilot Plant Servo & Systems Technology
More informationDM74LS00 Quad 2-Input NAND Gate
DM74LS00 Quad 2-Input NAND Gate General Description This device contains four independent gates each of which performs the logic NAND function. Ordering Code: August 1986 Revised March 2000 Order Number
More informationCISC, RISC, and DSP Microprocessors
CISC, RISC, and DSP Microprocessors Douglas L. Jones ECE 497 Spring 2000 4/6/00 CISC, RISC, and DSP D.L. Jones 1 Outline Microprocessors circa 1984 RISC vs. CISC Microprocessors circa 1999 Perspective:
More informationChip Card & Security ICs Mifare NRG SLE 66R35
Chip Card & Security ICs Mifare NRG Intelligent 1 Kbyte Memory Chip with Interface for Contactless Transmission according to the Mifare -System Short Product Information April 2007 Short Product Information
More informationMPSoC Virtual Platforms
CASTNESS 2007 Workshop MPSoC Virtual Platforms Rainer Leupers Software for Systems on Silicon (SSS) RWTH Aachen University Institute for Integrated Signal Processing Systems Why focus on virtual platforms?
More informationFabrication and Manufacturing (Basics) Batch processes
Fabrication and Manufacturing (Basics) Batch processes Fabrication time independent of design complexity Standard process Customization by masks Each mask defines geometry on one layer Lower-level masks
More informationIntroduction to VLSI Programming. TU/e course 2IN30. Prof.dr.ir. Kees van Berkel Dr. Johan Lukkien [Dr.ir. Ad Peeters, Philips Nat.
Introduction to VLSI Programming TU/e course 2IN30 Prof.dr.ir. Kees van Berkel Dr. Johan Lukkien [Dr.ir. Ad Peeters, Philips Nat.Lab] Introduction to VLSI Programming Goals Create silicon (CMOS) awareness
More informationLocal Heating Attacks on Flash Memory Devices. Dr Sergei Skorobogatov
Local Heating Attacks on Flash Memory Devices Dr Sergei Skorobogatov http://www.cl.cam.ac.uk/~sps32 email: sps32@cam.ac.uk Introduction Semi-invasive attacks were introduced in 2002 ( Optical fault induction
More informationiw1697 Product Brief Low-Power Off-Line Digital Green-Mode PWM Controller Description Applications
.0 Features Primary-side feedback eliminates opto-isolators and simplifi es design No-load power consumption < 0 mw at 0 V with ac typical application circuit ( star rating) Active start-up scheme enables
More informationDigital Systems and Microelectronics Emphasis Area
Digital Systems and Microelectronics Emphasis Area Professor Classes Research Interests Dr. Sherif Abdelwahed Dr. J. W. Bruce Computer Architecture Model-based computing Embedded Systems VLSI Autonomic
More informationHere we introduced (1) basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices.
Outline Here we introduced () basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices. Circuit Logic Gate A logic gate is an elemantary building block
More informationAN1819 APPLICATION NOTE Bad Block Management in Single Level Cell NAND Flash Memories
APPLICATION NOTE Bad Block Management in Single Level Cell NAND Flash Memories This Application Note explains how to recognize factory generated Bad Blocks, and to manage Bad Blocks that develop during
More informationCD4001BC/CD4011BC Quad 2-Input NOR Buffered B Series Gate Quad 2-Input NAND Buffered B Series Gate
CD4001BC/CD4011BC Quad 2-Input NOR Buffered B Series Gate Quad 2-Input NAND Buffered B Series Gate General Description The CD4001BC and CD4011BC quad gates are monolithic complementary MOS (CMOS) integrated
More informationS-PARAMETER MEASUREMENTS OF MEMS SWITCHES
Radant MEMS employs adaptations of the JMicroTechnology test fixture depicted in Figure 1 to measure MEMS switch s-parameters. RF probeable JMicroTechnology microstrip-to-coplanar waveguide adapter substrates
More informationModule 2. Embedded Processors and Memory. Version 2 EE IIT, Kharagpur 1
Module 2 Embedded Processors and Memory Version 2 EE IIT, Kharagpur 1 Lesson 5 Memory-I Version 2 EE IIT, Kharagpur 2 Instructional Objectives After going through this lesson the student would Pre-Requisite
More informationSolid State Drive Technology
Technical white paper Solid State Drive Technology Differences between SLC, MLC and TLC NAND Table of contents Executive summary... 2 SLC vs MLC vs TLC... 2 NAND cell technology... 2 Write amplification...
More informationDigital Integrated Circuit (IC) Layout and Design
Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST
More informationIntroduction to CMOS VLSI Design
Introduction to CMOS VLSI esign Slides adapted from: N. Weste,. Harris, CMOS VLSI esign, Addison-Wesley, 3/e, 24 Introduction Integrated Circuits: many transistors on one chip Very Large Scale Integration
More informationGates & Boolean Algebra. Boolean Operators. Combinational Logic. Introduction
Introduction Gates & Boolean lgebra Boolean algebra: named after mathematician George Boole (85 864). 2-valued algebra. digital circuit can have one of 2 values. Signal between and volt =, between 4 and
More informationARM Microprocessor and ARM-Based Microcontrollers
ARM Microprocessor and ARM-Based Microcontrollers Nguatem William 24th May 2006 A Microcontroller-Based Embedded System Roadmap 1 Introduction ARM ARM Basics 2 ARM Extensions Thumb Jazelle NEON & DSP Enhancement
More informationN-channel enhancement mode TrenchMOS transistor
FEATURES SYMBOL QUICK REFERENCE DATA Trench technology d V DSS = V Low on-state resistance Fast switching I D = A High thermal cycling performance Low thermal resistance R DS(ON) mω (V GS = V) g s R DS(ON)
More informationStatistical Models for Hot Electron Degradation in Nano-Scaled MOSFET Devices
2006, 대한 산업공학회 추계학술대회 Session C3 : Statistical models Statistical Models for Hot Electron Degradation in Nano-Scaled MOSFET Devices Seong-joon Kim, Suk Joo Bae Dept. of Industrial Engineering, Hanyang
More informationSerial port interface for microcontroller embedded into integrated power meter
Serial port interface for microcontroller embedded into integrated power meter Mr. Borisav Jovanović, Prof. dr. Predrag Petković, Prof. dr. Milunka Damnjanović, Faculty of Electronic Engineering Nis, Serbia
More informationLecture 030 DSM CMOS Technology (3/24/10) Page 030-1
Lecture 030 DSM CMOS Technology (3/24/10) Page 030-1 LECTURE 030 - DEEP SUBMICRON (DSM) CMOS TECHNOLOGY LECTURE ORGANIZATION Outline Characteristics of a deep submicron CMOS technology Typical deep submicron
More informationOpen Architecture Design for GPS Applications Yves Théroux, BAE Systems Canada
Open Architecture Design for GPS Applications Yves Théroux, BAE Systems Canada BIOGRAPHY Yves Théroux, a Project Engineer with BAE Systems Canada (BSC) has eight years of experience in the design, qualification,
More informationAdvanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
More informationParameter Min. Typ. Max. Units. Frequency Range 30 50 GHz. Minimum Insertion Loss 1.9 4.7 db. Dynamic Range @ 38 GHz 26 db
EWA51ZZ 3-5 GHz GaAs MMIC September 29 Rev 4 Bare Die Features Broadband Performance: 3 to 5 GHz Dynamic Range: 26 db, typical Input IP3: +13 dbm, typical (any attenuation) Dual Voltage Control: -1.5 to
More informationElectronic Circuit Construction:
Electronic Circuit Construction: Various methods are used for building electronic circuits. The method that you choose depends on a number of factors, including the resources available to you and whether
More informationSupertex inc. HV256. 32-Channel High Voltage Amplifier Array HV256. Features. General Description. Applications. Typical Application Circuit
32-Channel High Voltage Amplifier Array Features 32 independent high voltage amplifiers 3V operating voltage 295V output voltage 2.2V/µs typical output slew rate Adjustable output current source limit
More information