Qualcomm QCA ac Wi-Fi 2x2 MIMO Combo SoC

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1 Qualcomm QCA6174 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel:

2 Basic Functional Analysis 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization's corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. FAR CYDS Revision 1.0 Published: September 12, 2014

3 Basic Functional Analysis 3 Table of Contents 1 Introduction 1.1 Device Naming Conventions Used in this Report 1.2 Device Samples Used for Analysis 1.3 Company Profile 1.4 Executive Summary 1.5 Observed Critical Dimensions of the QCA6174 Die 2 Device Identification 2.1 SM-G906S Downstream Product R7/2424R7 Package 2.3 QCA6174 Die 2.4 QCA6174 Die Features 3 Process Analysis 3.1 QCA6174 Die Cross-Sectional Analysis 4 Functional Layout Analysis 4.1 QCA6174 Die Functional Layout Analysis 4.2 QCA6174 Die Functional Block Summary 5 Cost Analysis 5.1 QCA6174 Manufacturing Cost Analysis 6 References 7 Statement of Measurement Uncertainty and Scope Variation About Chipworks

4 Basic Functional Analysis 4 List of Figures Figure Samsung SM-G906S Smartphone Figure Samsung SM-G906S Smartphone Main PCB Figure R7/2424R7 Package Photograph Top Figure R7/2424R7 Package Photograph Bottom Figure R7/2424R7 Package X-Ray Plan View Figure R7/2424R7 Package X-Ray Side View Figure QCA6174 Die Photograph Figure QCA6174 Die Markings Figure QCA6174 Die Photograph Delayered to Polysilicon Figure QCA6174 Die Corner Figure QCA6174 Minimum Pitch Bump Pads Figure QCA6174 General Structure Logic Figure QCA6174 General Structure Lower Metals Figure QCA6174 Minimum Metal 1 Pitch Figure QCA6174 Minimum Contacted Gate Pitch Figure QCA6174 Functional Blocks at the Polysilicon Layer List of Tables Table QCA6174 Component Summary Table QCA6174 Die Summary Table QCA6174 Observed Critical Dimensions Table QCA6174 Functional Block Summary Table QCA6174 Manufacturing Cost Characteristics Table QCA6174 Manufacturing Costs

5 Basic Functional Analysis About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com

InvenSense MPU-6515 6-Axis Accelerometer Gyroscope MEMS Motion Sensor

InvenSense MPU-6515 6-Axis Accelerometer Gyroscope MEMS Motion Sensor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report