uclamp0511p 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp Description Features Mechanical Characteristics Applications

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1 - MicroClamp Description The uclamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace multilayer varistors (MLVs) in portable applications. They feature large crosssectional area junctions for conducting high transient currents and offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µclamp 511P is in a 2-pin, SLP16P2 package. It measures 1. x.6 x.5mm. The leads are spaced at a pitch of.65mm and are fi nished with lead-free NiPdAu. Each device will protect one bidirectional line operating at ±5 volts. It gives the designer the fl exibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC , Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. Package Dimensions Features uclamp511p µclamp 1-Line ESD protection u Transient protection for data lines to IEC (ESD) ±15kV (air), ±8kV (contact) IEC (EFT) 4A (tp = 5/5ns) Cable Discharge Event (CDE) u Ultra-small package (1. x.6 x.5mm) u Protects one I/O or power line u Low clamping voltage u Working voltage: 5V u Low leakage current u Solid-state silicon-avalanche technology Mechanical Characteristics u SLP16P2 package u Molding compound fl ammability rating: UL 94V- u Packaging : Tape and Reel u Lead Finish: NiPdAu u Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications u Cellular Handsets & Accessories u Cordless Phones u Smart Phones u Notebooks & Handhelds u Portable Instrumentation u Digital Cameras u MP3 Players u Automotive Applications Schematic & Pin Configuration SLP16P2 (Bottom View) 4/3/214 1

2 Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/2µs) P pk 17 Watts Peak Pulse Current (tp = 8/2µs) I PP 12 A ESD per IEC (Air) ESD per IEC (Contact) V ESD +/- 15 +/- 8 kv Operating Temperature T J -4 to +125 C Storage Temperature T STG -55 to +15 C Electrical Characteristics (T=25 O C unless otherwise specified) Parameter Symbol Conditions Min. Typical Maximum Units Reverse Stand-Off Voltage V RWM 5 V Reverse Breakdown Voltage V BR I t = 1mA T=-4 O C to +125 O C Reverse Leakage Current I R V RWM = 5V, Clamping Voltage V C I PP = 1A, t p = 8/2µs Clamping Voltage V C I PP = 12A, t p = 8/2µs Junction Capacitance C j V R = V, f = 1MHz V.25 1 µa 11 V 14 V 75 pf 214 Semtech Corporation 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 1 12 Peak Pulse Power - P PP (kw) 1.1 % of Rated Power or I PP Pulse Duration - tp (µs) DR Ambient Temperature - T A ( O C) DR4512:25:125:15 Clamping Voltage -V C (V) Clamping Voltage vs. Peak Pulse Current Waveform Parameters: tr = 8us; td = 2us Peak Pulse Current - I PP (A) 511PQ 5412_1R1 VCvIPP_8_2 Junction Capacitance - C J (pf) Capacitance vs. Reverse Voltage Reverse Voltage - V R (V) f = 1Mhz 511PQ 5412_1R1 CJvT Clamping Voltage - V C (V) ESD Clamping (8kV Contact per IEC ) Waveform 1ns/6ns; V ESD = +8kV Measured with and corrected for 5Ω, 4dB attenuator; 5Ω Scope Input Impedance. TLP Current (A) TLP Clamping Voltage vs. Current TLP Parameters: tp = 1ns; tr = 2ps Sampled 7% to 9% tp 1 point smoothing applied 511PQ 5412_1R1 ESD_P8K Time (ns) DUT Clamp Voltage - V C (V) 214 Semtech Corporation 3

4 Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above abd below ground. Equivalent Circuit Diagram Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 214 Semtech Corporation 4

5 Outline Drawing - SLP16P2 LNIS-66YP35 R3 Land Pattern - SLP16P2 LNIS-66YP35 R3 214 Semtech Corporation 5

6 Marking Ordering Information Part Number Qty per Reel Reel Size uclamp511p.tct 3, 7 Inch uclamp511p.tnt 1, 7 Inch Notes: 1) Device is electrically symmetrical Note: Lead fi nish is lead-free NiPdAu. MicroClamp, uclamp and µclamp are marks of Semtech Corporation. Tape and Reel Specification (4mm Pitch, 3, Piece Reel)!"#$!&!! ' (!) % 214 Semtech Corporation 6

7 Tape and Reel Specification (2mm Pitch, 1, Piece Reel) Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 9312 Phone: (85) FAX (85) Semtech Corporation 7

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