Plasmalab System400. Magnetron sputtering process tool for physical vapour deposition (PVD) The Business of Science TM

Transcription

1 Plasmalab System400 Magnetron sputtering process tool for physical vapour deposition (PVD) The Business of Science TM

2 PlasmalabSystem400 Flexible multi-mode PVD tool dc magnetron sputtering for metals Pulsed dc for high rate rf magnetron for dielectrics Reactive sputtering adding O 2, N 2, H 2 Pulsed dc sputtering enhances ion density to offer higher sputtering rates without overheating targets and substrates. PlasmalabSystem400 tool images produced with the cooperation of the Optoelectronics Research Centre, University of Southampton, UK Deposit multiple materials in one chamber in a single process The PlasmalabSystem400 may be configured either with 4 x 200 mm or 6 x 100 mm magnetrons. The single process chamber is divided into 4 or 6 subchambers, isolating the sources from each other without the high cost of clustering several single process chambers Multi-layer processes are completely automated by process recipes in the PC2000 TM process tool software, with its intuitive graphical interface and flexible user options

3 Batch production and research capability Flexible volume throughput Loading capacity of: 8 wafers of 50, 75 or 100 mm (2, 3 or 4 inch), or 4 wafers of 150 or 200 mm (6 or 8 inch) Range of wafer handling options: Single-wafer loadlock Cassette loading Clustered cassette-to-cassette via robotic wafer transfer The PlasmalabSystem400 may be clustered with other Oxford Instruments process tools: Deposition processes PECVD, ICP-CVD PlasmalabSystem100 PlasmalabSystem133 Atomic layer deposition (ALD) FlexAL Ion beam deposition - IBD, IBSD, IASD Ionfab 300Plus Etch processes RIE or ICP PlasmalabSystem100 PlasmalabSystem133 Ion beam etch/milling - IBE, RIBE, CAIBE Ionfab 300Plus MESC-compatible interface allowing further addition of third-party modules PlasmalabSystem400 clustered with a FlexAL ALD system and cassette load and un-load modules, via a hexagonal robotic handler Clustering tools avoids oxidation and particle contamination as there is no exposure of the wafer to air between steps. It also improves yield and throughput as it reduces handling damage and transfer times.

4 Process performance Al deposited onto an etched SiO 2 on Si structure; the metal layer follows the contour of the etched substrate very well, even into a notched trench profile Full range of materials The PlasmalabSystem400 provides the ability to sputter metals, oxides, nitrides and silicides with film thicknesses from 20 nm up to several µm. Flexibility in processes and materials is enabled by the wide temperature range of the wafer table, with both watercooling and heating up to 300 C Etching of SiO 2 on Si using a 100 nm Al top mask layer sputtered in the PlasmalabSystem400 tool onto a PDMS polymer mask layer. The Al mask is RIE etched to give high-resolution patterning of the PDMS mask for the subsequent ICP etch. Courtesy of the Tyndall National Institute, Ireland rf bias allows plasma-assisted deposition for greater adhesion and control of film structure and stoichiometry Optimum process uniformity and stability Wafer table may be operated in either static or rotating mode Rotating shutter on magnetron sources allows source start-up and stabilisation before exposing wafer to sputtering vapour Cross-contamination shield sub-divides chamber, preventing wafer-to-wafer and target contamination Load-locked wafer entry minimises particle contamination Optional quartz crystal microbalance (QCM) for process set-up rf bias offers plasma pre-cleaning Optional plasma diagnostics by wavelength analysis Optional cryo pump or turbo pump/cryo panel for water vapoursensitive applications Typical uniformity ± 3% (100 mm) ± 4% (125 mm) ± 5% (150 mm) Uniformity masks can be fitted to further enhance uniformity, or removed for high-rate processes Fast, easy fitting and removal

5 Easy maintenance, proven hardware The hinged chamber lid allows quick and easy access to the removable liners for cleaning with minimum downtime With two sets of liners supplied as standard, the fast change-over enables regular cleaning routines and reduced particle contamination Cost of ownership Outstanding throughput and high yield through high uniformity mean increased productivity and reduced cost per wafer. Together with excellent reliability, these create low cost of ownership for Oxford Instruments process tools. Supported by Oxford Instruments preventative maintenance and service contract packages, the ultimate in system uptime can be assured. Process tool software Oxford Instruments PC2000 TM software is clear, easy to use, quick to learn and configured exactly for the customer s system. Its visual interface controls and monitors the process tool, and offers the ability to control a tool cluster from a single interface and PC. The PlasmalabSystem400 is based on the same hardware platform as Oxford Instruments PlasmalabSystem100 and PlasmalabSystem133 plasma etch and deposition tools, recognised for their reliability in hundreds of installed systems worldwide Process recipes are written, stored and recalled through the same software, building into a process library. In cassette-to-cassette and cluster systems, the users can associate individual recipes with each wafer to be processed, and run a complete set of process steps, loops and repeats. Passwordcontrolled user login allows different levels of user access and tasks, from one-button run operation to full system functions. Continuous process data logging ensures traceability of each wafer and process.

6 Plasma Etch & Deposition Atomic Layer Deposition Molecular Beam Epitaxy Ion Beam Etch & Deposition Nanoscale Growth Systems Oxford Instruments Plasma Technology UK North End, Yatton, Bristol, BS49 4AP Tel: +44 (0) Fax: +44 (0) Germany Wiesbaden Tel: +49 (0) Fax: +49 (0) Japan Tokyo Tel: Fax: oikkpt@oxinst.co.jp Worldwide Service and Support Oxford Instruments is committed to supporting our customers success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world. We can provide: Tailored service agreements to meet your needs Comprehensive range of structured training courses Immediate access to genuine spare parts and accessories System upgrades and refurbishments PR China Beijing Tel: /1/2 Fax: ptsales@oichina.cn Shanghai Tel: Fax: ptsales@oichina.cn Singapore Tel: Fax: oipt.sales@oxfordinstruments.com.sg click onto for more information Oxford Instruments, at Yatton, UK, operates Quality Management Systems approved to the requirements of BS EN ISO This publication is the copyright of Oxford Instruments Plasma Technology Limited and provides outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Oxford Instruments policy is one of continued improvement. The company reserves the right to alter, without notice, the specification, design or conditions of supply of any product or service. Oxford Instruments acknowledges all trade marks and registrations. Plasmalab, FlexAL and Ionfab are registered trademarks of Oxford Instruments Plasma Technology Ltd. Oxford Instruments Plasma Technology Ltd, All rights reserved. Ref: OIPT/400/2007/01 USA Concord, MA TOLLFREE Tel: Fax: info@ma.oxinst.com