AOZ8131. Ultra Low Capacitance One-Line Bi-directional TVS Diode. Features. General Description. Applications

Transcription

1 Ultra Low Capacitance One-Line Bi-directional TVS Diode General Description The OZ8131 is an ultra low capacitance one-line bi-directional transient voltage suppressor diode designed to protect high speed data lines and voltage sensitive electronics from high transient conditions and SD. This device incorporates one TVS diode in an ultra-small DFN 1006 package. It may be used to meet the SD immunity requirements of IC , Level 4 (±15kV air, ±8kV contact discharge). The OZ8131 comes in an RoHS compliant DFN 1006 package and is rated over a -40 C to +85 C ambient temperature range. The ultra-small 1.0 x 0.6 x 0.5mm DFN package makes it ideal for applications where PCB space is a premium. The small size and high SD protection makes it ideal for protecting voltage sensitive electronics from high transient conditions and SD. Features SD protection for high-speed data lines: xceeds: IC (SD) ±24kV (air), ±24kV (contact) IC (FT) ±40 (5/50nS) IC (Lightning) ±4 Human Body Model (HBM) ±30kV Small package saves board space Ultra low capacitance: 1.25pF Low clamping voltage Low operating voltage: 5.0V Pb-free device pplications Portable handheld devices Keypads, data lines, buttons Notebook computers Digital Cameras Portable GPS MP3 players Typical pplication Pin Configuration Signal Line 1 2 Bidirection Protection of Single Line Rev. 3.0 June Page 1 of 6

2 Ordering Information Part Number mbient Temperature Range Package nvironmental OZ8131DI-05L -40 C to +85 C DFN 1006 RoHS Compliant Green Product OS Green Products use reduced levels of Halogens, and are also RoHS compliant. Please visit for additional information. bsolute Maximum Ratings xceeding the bsolute Maximum ratings may damage the device. Parameter Peak Pulse Current (I PP ), t P = 8/20µs Storage Temperature (T S ) SD Rating per IC , Contact (1) SD Rating per IC , ir (1) SD Rating per Human Body Model (2) Rating 4-65 C to +150 C ±24kV ±24kV ±30kV Notes: 1. IC discharge with C Discharge = 150pF, R Discharge = 330Ω. 2. Human Body Discharge per MIL-STD-883, Method 3015 C Discharge = 100pF, R Discharge = 1.5kΩ. Maximum Operating Ratings Junction Temperature (T J ) Parameter -40 C to +125 C Rating lectrical Characteristics T = 25 C unless otherwise specified. Symbol Parameter Symbol Parameter I PP Maximum Reverse Peak Pulse Current I T Test Current V CL Clamping I PP (IC /20µs pulse) P pk Peak Power Dissipation V RWM Working Peak Reverse Voltage (IC /20µs pulse) I R Maximum Reverse Leakage Current C J V R = 0 and f = 1MHz V BR Breakdown Voltage lectrical Characteristics T = 25 C unless otherwise noted. Device Device Marking V RWM (V) V BR (V) Min. I T = 1m I R (µ) V CL C J (pf) I PP = 2 I PP = 4 Ppk (W) Typ. OZ8131DI-05L B Rev. 3.0 June Page 2 of 6

3 Typical Performance Characteristics 24 Clamping Voltage vs. Peak Pulse Current (tperiod = 100ns, tr = 1ns) 20 Clamping Voltage vs. Peak Pulse Current (IC /20µs pulse current) Clamping Voltage, V CL (V) Peak Voltage (V) Peak Pulse Current, I PP () Peak Pulse Current () Rev. 3.0 June Page 3 of 6

4 Package Dimensions, DFN 1.0 x 0.6 2x aaa C 5 Index rea (/4xD) 3 e aaa C 2x D 2x b CB Pin#1 ID 0.125x45 B L2 CB TOP VIW BOTTOM VIW 6 2x ccc C SID VIW 7 1 C Seating Plane RCOMMNDD LND PTTRN x UNIT: mm Dimensions in millimeters Symbols 1 b D e L aaa ccc Min Nom BSC 1.00 BSC 0.65 BSC Dimensions in inches Symbols 1 b D e L aaa ccc Min Nom Notes: 1. Dimensions and tolerancing conform to SM Y ll dimensions are in milliteters. 3. e represents the terminal grid pitch. 4. N isthe total number of terminals. 5. visual index feature must be located within the hatched area. Typical index feature (chamfer) must be located on the edge of the Pin#1 feature. 6. This dimension includes stand-off height 1 and packaged body thickness, but does not include attached feature e.g. external heatsink or chip capacitors, an internal heatslug is not considered as attached feature. 7. Dimension 1 is primarily terminal plating, and does not include small metal protrusions. Rev. 3.0 June Page 4 of 6

5 Tape and Reel Dimensions, DFN 1.0 x 0.6 Carrier Tape T D1 P1 P2 1 2 B0 K0 UNIT: mm 0 D0 P0 Option Package DFN 1.0x0.6/ DFN 1.0x0.6 (8 mm) B K D D / P0 P P2 T 0.23 ±0.02 B DFN 1.0x0.6/ DFN 1.0x0.6 (8 mm) 0.65 ± ± ± / Reel W1 G S V M N K R H UNIT: mm W Tape Size 8mm Reel Size ø178 M ø178 ±0.5 N ø55 ±1 W /-0 W H ø13.0 ±0.5 K 10.1 S 2.0 ±0.5 G N/ R N/ V N/ Leader / Trailer & Orientation TVS Unit Per Reel: 10000pcs Trailer Tape 300mm Min. Components Tape Orientation in Pocket Leader Tape 500mm Min. Rev. 3.0 June Page 5 of 6

6 Part Marking B Product Number Code Date Code LGL DISCLIMR lpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or completeness of the information provided herein and takes no liabilities for the consequences of use of such information or any product described herein. lpha and Omega Semiconductor reserves the right to make changes to such information at any time without further notice. This document does not constitute the grant of any intellectual property rights or representation of non-infringement of any third party s intellectual property rights. LIF SUPPORT POLICY LPH ND OMG SMICONDUCTOR PRODUCTS R NOT UTHORIZD FOR US S CRITICL COMPONNTS IN LIF SUPPORT DVICS OR SYSTMS. s used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 3.0 June Page 6 of 6