PATTERNED MEDIA TECHNOLOGY. An Equipment Perspective

Transcription

1 Think Lean. Create Value. PATTERNED MEDIA TECHNOLOGY An Equipment Perspective Ren Xu September 17-18, 28

2 Outline 28 Status BPM/DTR Pilot/MFG Line Processes Approach Equipment Technology Key Drivers of Current Equipment Trend Throughput Platform Module Media Process Development Intevac Strategy 2L Gen II Platform Modular Approach to Key Process Capabilities HW Modular Demo s Platform Test Bed Customer Site Installations Process Development/Validation Ramping Summary and Outlook Intevac DiskConUSA28 Jan 28_Needham_Slide 2

3 Current Status Initial Discrete-Track Recording (DTR) and/or Bit-Patterned Media (BPM) 2. Disk Development Nano Imprint Lithography Resist Pattern IBE/RIE/Wet-Etch/ Ion Implantation of Substrate/SUL/Magnetic Layers Magnetic Layer Patterning Test Via Two Routes: Physical patterning of Mag layer/sul/substrate (etch) Chemical patterning of Mag layer by doping (implantation) Fully Functional DTR/BPM Disks From Manufacturing-Capable Equipment Line is Essential to DTR/BPM Drive Product Development Key Missing Link: Manufacturable Process at High DPH, High Reliability Equipment Line-Up Enabling Development/ Production of Fully Finished, Flyable, Guzik Testable Disks Intevac DiskConUSA28 Jan 28_Needham_Slide 3

4 Pilot/Manufacturing Line Outlook Continuous Media Proc/ Nano Imprint Lithography Bit Patterned Media Clean Substrate Cont. Media (2L Gen II) SeedL UL IL Multiple MagL COC Nano Imprint Lithography Lean DTR/BPM (Patterning) De-Scum/Trim Hard Mask Etch Resist Strip Mag Stack Etch Planarization COC Vapor Lube (AccuLuber) Bonding (UV, Thermal) Burnish Glide Test (Burnishing Pass, GlideHeight Test) Certification Test QA (LithoPrime) Shipment Intevac DiskConUSA28 Jan 28_Needham_Slide 4

5 Key Equipment Trend Drivers Process Development for Advanced Continuous Media Patterning Approaches (Cap, NIL, Etching Strategy, Planarization, HDI) Winning DTR/BPM Process Approach: Manufacturable, Effective, and Scalable Equipment Platform, Module, Throughput, All Encompassing, Universal Enabler for Industry-Wide Process Development and Technology Evolution Intevac DiskConUSA28 Jan 28_Needham_Slide

6 DTR/BPM Challenges: Product Throughput Identified as the Main Per-Disk Driver Impact of Equipment Diminishes at Sufficiently High Throughput Model Basis: M/QTR Capacity at 1.M Disks/Line DTR/BPM DTR/BPM Assumptions Assumptions Per Per Disk Disk Base Base and and Adder Adder New New Capital Capital / / Base Base No. No. Tool Tool Substrate Substrate New New Total Total DPH DPH (M) (M) DPH DPH Per Per Line Line (M) (M) BOM BOM Labor Labor Facilities Facilities H/L H/L L/L L/L H/M H/M L/M L/M H/H H/H L/H L/H DTR DTR and and BPM BPM Category Category Intevac DiskConUSA28 Jan 28_Needham_Slide 6

7 Process Approach & Equipment Technology Process Continuous Media, Full Stack Mag-Layer NIL Resist Pattern Finished DTR/BPM Disk, Full Stack and Flyable/Testable Key New Processes: De-Scum/Trim/Resist Strip Sputtered Carbon/Metal Hard Mask Etch Mag-Stack Etch Carbon/Metal or Oxide Dep/Etch/Dep/Etch...Planarization Process Modules ICP Source: De-Scum/Trim/Strip Magnetic Layer Hard Etch: IBE/RIE and Others Planarization: Carbon: Sputter Carbon + Reactive Etch Back Oxide/Metal: RF/DC Sputter + Etch Back System 2 Lean Gen II Platform Incorporating New Sources Progressive, Approach/Match Current 2 LEAN Gen II Throughput Intevac DiskConUSA28 Jan 28_Needham_Slide 7

8 2 Lean - BPM Process and Tool Configuration Media Process Drives Tool Configuration Drives Module/Equipment Technology Development Intevac DiskConUSA28 Jan 28_Needham_Slide 8

9 and Patterned Media Process Steps Texture Polis Clean Polish h Sputter 2 Lean SeedL UL IL Multiple MagL COC (not needed with ) Clean Plate Clean Substrate Nano Imprint Lithography LithoPrime Blank Patterning DTR/BPM 2 Lean Gen II De-Scum/Trim C-Hard Mask Resist Strip Etch Planarization Shipment QA Certify Glide (TB) Tape Burnish UV Bonding Vapor Lubrication AccuLuber Intevac DiskConUSA28 Jan 28_Needham_Slide Slide 9

10 Intevac Commitment to the HDD Industry Ramp and DTR/BPM Transition Committed to Making 2 Lean Extendible to All, HAMR and Patterned Media Technology Generations Focused on Continuous Technology Advancement and Effectiveness Enabling New Media Technology Intevac DiskConUSA28 Jan 28_Needham_Slide 1