FLEXIBLE CIRCUITS MANUFACTURING
|
|
- Julie Murphy
- 8 years ago
- Views:
Transcription
1 IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available knowledge at the time of development. The narration may be helpful for translation and technical reference. Copyright, IPC, Inc. Association Connecting Electronics Industries. All Rights Reserved. Cellular phones, lap top computers, cameras -- what these products have in common is they all use flexible circuits instead of rigid printed wiring boards for their interconnections. The main reason for using flexible circuits in these products is they can be bent and formed for ease of assembly. Think about a lap top computer. Imagine how a flexible circuit is threaded through the hinge connecting the processing unit to the display. Flexible circuits are light weight and can fit into very tight spaces, solving a wide range of interconnection problems. These circuits can change width several times, fold, twist and even flex into a rolled up configuration. The complexity of flexible circuits ranges from the single sided variety to the complex multilayer circuits found in today's advanced electronic equipment. This videotape will explain the typical manufacturing processes for single sided, double sided and multilayer flexible circuits. Let's begin with a single sided flexible circuit. There are two types of processing models -- sheets and rolls. We'll start with the sheet format, also called panels. The base materials are called copper clad flexible laminate. The laminate is typically made up of an unreinforced film that is coated with adhesive. There are also metalized films without adhesive. One of the outside surfaces of the laminate material is covered with a thin sheet of copper foil. This sandwich is bonded together under heat and pressure during a lamination process. Copper clad flexible laminate is usually ordered in large sheets. 24 by 36 inches is one standard size. It can also be ordered in specific panel sizes. The first step is to make sure that the laminate material is the correct size and thickness. It may also be checked for imperfections in the copper surface, such as pits and dents. Some companies prefer to rely on statistical data -- developed by the laminate manufacturer -- to ensure that all laminate material meets their procurement standards. 1
2 Flexible material handling techniques are crucial to the successful processing of the circuits. Techniques and equipment may need to be modified to support these thin laminates. After the size and quality of the laminate has been certified, the full size sheets need to be cut down to a usable panel size. This is typically done on a shearing machine. Many companies use a standard fabrication panel size - such as 18 by 24 inches -which fits optimally on all of their production machines. Before we process the laminate any further, we may want to prepare the panels by baking them in an oven. A controlled heating and slow cooling process will remove moisture and help balance any internal stresses evenly -- from panel to panel. At this point some single sided panels are drilled. Drilling will be discussed in detail during the double sided flexible circuit description. The panels are now prepared for the application of the conductive pattern or circuit image. This surface preparation can be performed chemically by dipping the panels in an acid bath, followed by an anti-tarnish agent, chemically cleaning, or micro-etch; or mechanically by scrubbing the panels to remove oxidation. This also provides a slightly roughened surface to improve the adhesion of the imaging resist. Now we're ready to create the conductive pattern on the copper side of the panel. The first step is to apply the image -- using either dry film, a liquid photoimagable resist, or a screen printing process. For our illustration we will explain the dry film method for conductor imaging. Later on we'll explain another imaging technique for solder mask application. The dry film laminator uses heated rollers to press a photoresist onto the slightly roughened surface of the copper. Now we're going to place a sheet of film that contains a negative image of the desired conductor pattern, or land pattern, onto the resist coated panel. If everything looks evenly centered, the sandwich is inserted into the exposure chamber, and a UV light source is activated. The UV light will pass through the clear areas of the phototools. Wherever the UV light hits the photoresist, a chemical reaction takes place. The photoresist will expose or harden in those specific areas. The areas where the UV light does not penetrate through the film and into the photoresist will remain relatively soft or unexposed. Next we remove this soft or unexposed resist in the developing process. This will reveal the unwanted copper in preparation for the etching process. The etching process will remove the unwanted copper from the panel's surface. This is done with a chemical solution. What remains on the panel is the copper circuitry that is underneath the photoresist. Next, this hardened photoresist is stripped away, leaving the remaining copper in 2
3 the desired circuit pattern. At this point, there is usually some type of inspection process -- either visual, with automatic optical inspection equipment, or by an electrical test process. Now we will mask off all the areas of the flexible circuit that will not be coated with solder. This is done with a coverlay or a solder mask. The coverlay is an adhesive film that is prepared by drilling holes or punching the desired solder mask pattern. There are different techniques for drilling the coverlay due to its plastic characterisitcs. The release sheet should be removed before the coverlay is laminated onto the flexible circuit. Controlling the dimensional changes in the base material is one of the most critical steps in the manufacturing of a flexible circuit. Care must be taken to select lamination parameters, release sheets and press pads that will evenly distribute heat and pressure. Tight controls on press time and temperature, heat ramp rates, and cooling are critical to consistent dimensional performance. When solder mask is used in place of coverlay, selection of the solder mask is critical for flexibility. A common technique for applying solder masks to flexible circuits is the liquid photoimagable solder mask. It can be applied in a number of different ways including screen printing, curtain coating or electrostatic spraying. Dry film solder mask may also be used for flexible circuits. Regardless of the solder mask application technique, the coated panel is exposed to a photographic image of the desired solder mask pattern. A developing process then removes the unexposed material -- leaving the solder mask image on the surface of the panel. A cure cycle is done following the developing operation. After the coverlay or solder mask has been applied, we may then coat the exposed copper with molten solder. This process is called hot air leveling. An alternative to hot air leveling is selective plating. Selective plating can be performed with metals such as nickel, gold and tin-lead. The other model for single sided flexible circuit fabrication is called roll processing, or reel-to-reel. Roll processing is usually done in high volume applications. Let's take a look at the differences. The laminate is made and used in continuous rolls. Roll widths vary from 9 to 24 inches. Notice that the rolls are not baked prior to processing and there are no panelizing steps prior to imaging. The rolls are imaged by either screen printing, or exposing and developing dry film photoresist which protects the conductors. Some tooling holes are punched before imaging. Usually optical targets are imaged and the tooling holes are formed after imaging. The final component holes can be formed by laser, or by mechanical punching. Let's stop for a moment to answer any questions you may have. 3
4 Now we'll go back and examine the differences in manufacturing double sided and multilayer flexible circuits. In double sided flexible circuits, both the outside surfaces of the laminate material are covered with thin sheets of copper foil. This means that components can be placed on both sides of the flexible circuit. It also allows much more trace circuit density and complexity. The process for a double sided flexible circuit is similar to a single sided panel. Let's review the sequence and look at the differences. First, the material is prepared. Prior to drilling, a predetermined quantity of flexible laminate is placed between phenolic fiberboard for support. Now we'll drill two or more tooling or registration holes along the edges of the panels. These holes will be used to line up all the different features on the panel, including the conductive patterns and the drilled holes. The tooling holes will also align the fabrication panels on all of the production machines during each step of the manufacturing process. Next we'll use the tooling holes to align each of the panels on a numerically controlled drilling machine. Each drill machine usually has several drilling heads with corresponding tooling pins. The computer that controls the drilling machine is programmed to move the table to the correct location in both the x and y directions. Then the drilling head will create the hole in the proper location. After all the holes of one size are drilled, the drill heads will automatically discard the used bit and pick up the next size drill. There may be hundreds or even thousands of holes in each panel... and several different hole sizes. Automatic punching may be used in place of drilling for high volume applications. In this manner, holes for the entire circuit can be punched all at once. The panel may now be inspected to make sure that all the holes are in their correct locations. Another concern during the drilling process is the formation of burrs, or small protrusions of copper, around the edges of the holes. Burrs are created when the drill bit pushes a small piece of copper away from the hole instead of cutting it off. The holes can be deburred mechanically by scrubbing the copper surface with brushes, or with some type of abrasive compound. Care should be taken during these deburring processes not to damage or distort the laminate. Also, machinery should be set up specially for thin laminates. At this point, a new processing step is introduced. A very thin film of electroless copper is chemically deposited over the entire surface of the panel -- and inside the holes. Once the hole walls are metallized like this, we have created an electrical connection from one side of the flexible circuit to the other. In place of electroless copper, there may be other techniques such as a conductive polymer coating, or direct metalization. The steps for imaging and developing are identical to the process for single sided boards. For imaging, we utilize the same tooling holes that we used earlier to drill the holes. This way everything should continue to line up properly. After developing, the hardened or exposed photoresist that covers the rest of the 4
5 panel will be used during the next step --to block or resist electroplating. During the electroplating process, we will be depositing additional copper and a thin coating of tin-lead on top of the exposed copper which will act as an etch resist. With flexible circuits, the copper's ability to withstand cracking is critical to maintain flex life. After electroplating, the remaining photoresist is removed in the stripping operation. The stripping chemistry will dissolve the hardened resist, exposing the bare copper beneath it. At this point the panel has the desired conductive pattern, overplated with tin-lead etch resist. The rest of the surface is still covered with copper. The etching process will now remove this unwanted copper. The tin-lead overplate on top of the conductors -- and inside the holes -- will protect the copper underneath it from the etching chemistry. After the etching process, the conductive pattern begins to resemble the finished product. An alternative to this type of processing is to electroplate the entire surface of the panel instead of selectively plating an imaged area. At this point, the dry film resist is laminated onto the panels, and the panels are then imaged and developed. The copper is then etched away between the circuit traces. After the panels are inspected, the tin-lead we previously electroplated must be stripped off to prepare the flexible circuit for the coverlay or solder mask operation. Coverlay or solder mask is done in a manner identical to the single sided board process. The processing to this point is completed by the hot air level operation. Let's stop once again to answer questions you may have. Now let's take a look at multilayer flexible circuits. Since several layers of circuitry are laminated within the flexible circuit, this type of processing offers more potential interconnections per unit of area for packaging electronic components than do double sided boards. Multilayer flexible circuits range in layer count from 3 to 30. The innerlayers of the multilayer flexible circuit are processed first. Again we start with a copper clad laminate. This material is cut to size in a manner similar to single or doubled sided panels. Laminated onto both sides of the copper foil is photoresist -- in this instance dry film. The photoresist will be used to create the circuit image or conductive pattern on the innerlayer. A negative photographic image of the desired conductive pattern is carefully registered onto both sides of the photoresist laminated panel. A UV light then shines through the clear or transparent areas of this phototool. The photoresist that is exposed by the UV light will harden. The areas of photoresist that are not exposed to the ultraviolet light will remain soft and ready to be dissolved away. 5
6 The developing process will now remove or strip away this soft or unexposed resist. This will reveal the unwanted copper in preparation for the etching process. The etching process will remove the unwanted copper from the innerlayer surface. This is done with a chemical solution. What remains on the panel is the copper circuitry that is underneath the photoresist. Next, this hardened photoresist will be stripped away, leaving the remaining copper in the desired circuit pattern. The panels are now inspected, usually using automatic optical inspection to make sure there are no open or short circuits. Faults, or defects that are marked during this inspection are then confirmed by the operator at a verification station. At this point there may be a coverlay or solder mask operation to mask off areas that won't be surface treated. Here's how the surface treatment is done. The panels that pass inspection are processed through a chemical bath. The chemistry grows oxide crystals on the surface of the copper to increase the surface area. This surface treatment enhances the strength of the bond during lamination, improving overall board reliability. Flexible circuits may require a specific formulation of oxide. When double treat copper is used, surface treatment is unnecessary. After the surface treatment process, the panels are normally oven dried at a low temperature to remove any moisture from the innerlayers. At this point the innerlayers are ready for the lamination operation. We'll be building up a sandwich of conductive layers -- which will be separated by insulating layers of resin coated fiberglass, called prepreg, or with adhesives. Once again we'll be using the tooling holes to align all of the layers. The tooling pins are pressed into the tooling fixture, then a steel separator plate is placed onto the pins. The separator plate protects the outer surfaces from indentations. Now a release sheet is added -- to keep any squeezed out resin from adhering to the metal plate. Heat lagging material may also be added. Next, we place one sheet of copper foil, or copper laminate onto the tooling pins. This will eventually become our outer conductive pattern, or layer one. A specific number of sheets of prepreg, or adhesive are now added. Then we're ready to add one of the fully processed double sided innerlayers onto the sandwich. This will become layers 2 and 3. Then we add the required number of sheets of prepreg, or adhesive -- followed by another innerlayer core -- which will be layers 4 and 5. This process continues until the specific number of layers are completed. The final layer will be made out of another sheet of copper foil, or copper laminate. A release sheet is then placed on top, followed by another steel separator plate to finish off the stack. Now we can repeat this exact lay-up several times to get as many multilayer flexible circuits into the lamination press as possible -- since the lamination process 6
7 can take over an hour to complete. The multilayer flexible circuits are now laminated together under heat and pressure. The heat of the lamination press causes the partially cured prepreg resin, or adhesive to melt and flow. Vacuum pressure is normally used to evacuate the air that's in between all of the materials. The prepreg, or adhesive then hardens or gels to bond all of the layers together. After the resin has hardened and cured, the flexible circuits are removed and cooled. The lamination fixtures are now disassembled. The next step is to check the thickness of the laminated panels. This thickness measurement will determine if anything has gone wrong during the lamination procedure. Once the desired thickness is verified, the panels may be baked once again -- to relieve any stresses created during the lamination process. At this point we're ready to begin processing the plated through hole layer to layer interconnections and the outerlayers. This occurs in the same manner as a double sided board. After drilling, multilayer flexible circuits require an etch back process to the innerlayer copper lands. The fabrication process continues. Now the individual flexible circuits are ready to be removed from the fabrication panel. This is true whether the panels are single sided, doubled sided or multilayer. There are several ways to do this. In many cases, the circuits are removed from the panel with a steel rule die. The die is placed on a press table and the circuit is cut out with a die blade. Sometimes the flexible circuits are cut almost all the way out -- except for a few notches -- to keep the circuits attached to the panel. This method keeps the individual circuits in panel format -- to simplify handling during further processing. A punch press can also be used to remove the flex circuits from the panels. For very small quantities - - a hand cutting template or pattern can be used to shape the circuits. Before or after the flexible circuits are removed from the panel, there may be additional finishing operations. Stiffeners may be added for support areas. Adding stiffeners is a critical and labor intensive process. There are many varieties of stiffeners that might be used depending on the application. The individual flexible circuits may then be electrically tested for opens or shorts. Electrical testing will insure that the circuits function properly -- before any of the electronic components are attached. The flexible circuits may also undergo a final cleaning and testing procedure to remove ionic or electrically conductive contaminantion from the surface. At this point there may also be a final visual inspection -- to make sure there aren't any unacceptable defects. Some reliability testing may be done following final inspection depending on the 7
8 circuit application. This may include life, stress and evironmental testing. The final step is the packaging and shipment to the customer -- or component assembler. Packaging materials, methods and storage time can all affect the integrity of the final product. Cellular phones, lap top computers, cameras and camcoders -- we rely on these and other electronic products every day. Every flexible circuit you build is used by someone -- to make their life more productive and enjoyable. Dependability of the finished product is everyone's responsibility. From the first fabrication step to the last. 8
How to Build a Printed Circuit Board. Advanced Circuits Inc 2004
How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production
More informationCHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using
More informationGood Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
More informationAuditing a Printed Circuit Board Fabrication Facility Greg Caswell
Auditing a Printed Circuit Board Fabrication Facility Greg Caswell Introduction DfR is often requested to audit the PCB fabrication process of a customer s supplier. Understanding the process variations
More informationKey Processes used to Build a Quality Printed Circuit Board
used to uild a Quality rinted ircuit oard 3-1 hototooling hototooling is an essential part of a number of processes including: nner layer printing, hardboard printing, soldermask, nomenclature, deep and
More informationFlex Circuit Design and Manufacture.
Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit
More informationHistorical production of rigid PCB s
Historical production of rigid PCB s The Printed Circuit Board (PCB) The PCB What is a Printed Circuit Board? Green plastic thing with holes!! (green plastic syndrome) Platform for components Image with
More informationWhite Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?
Recommendations for Installing Flash LEDs on Circuits By Shereen Lim White Paper Abstract For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex
More information1. Single sided PCB: conductors on only one surface of a dielectric base.
The Department of Electrical Engineering at IIT Kanpur has a variety of devices and machines to produce single layer, double layer plated through printed circuit boards (PCBs), multi layer (max 8 layers)
More informationFlexible Circuit Simple Design Guide
Flexible Circuit Simple Design Guide INDEX Flexible Circuit Board Types and Definitions Design Guides and Rules Process Flow Raw Material Single Side Flexible PCB Single Side Flexible PCB (Cover layer
More informationCOPPER FLEX PRODUCTS
COPPER FLEX PRODUCTS WHY FLEX? Molex ible Printed Circuit Technology is the answer to your most challenging interconnect applications. We are your total solution for ible Printed Circuitry because we design
More informationFlexible Printed Circuits Design Guide
www.tech-etch.com/flex Flexible Printed Circuits Design Guide Multilayer SMT Assembly Selective Plating of Gold & Tin-Lead Fine Line Microvias Cantilevered & Windowed Leads 1 MATERIALS CONDUCTOR Copper
More information3 Embedded Capacitor Material
3 Embedded Capacitor Material Design and Processing Guidelines for Printed Circuit Board Fabricators Effective date: March 2004 Contents Overview Material Handling Process Compatibility Standard vs. Sequential
More informationMiniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
More informationThis presentation is courtesy of PCB3D.COM
Printed Circuit Board Design, Development and Fabrication Process This presentation is courtesy of PCB3D.COM Steve Rose Printed Circuit Board Design Engineer Slide 1 Introduction PCB 101 This presentation
More informationIntroduction to Photolithography Concepts via printed circuit board (PCB) manufacturing. PCB Background Information (courtesy of Wikipedia)
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing Introduction As you saw on the video (http://www.youtube.com/watch?v=9x3lh1zfggm), photolithography is a way to nanomanufacture
More informationChapter 14. Printed Circuit Board
Chapter 14 Printed Circuit Board A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper
More informationPrinted Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production
More informationBalancing the Electrical and Mechanical Requirements of Flexible Circuits. Mark Finstad, Applications Engineering Manager, Minco
Balancing the Electrical and Mechanical Requirements of Flexible Circuits Mark Finstad, Applications Engineering Manager, Minco Table of Contents Abstract...............................................................................................
More informationThe Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007
The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 Successful designs are soon forgotten but failures are remembered for years. Steering clear of these twelve
More informationBASIC PRINTED CIRCUIT BOARD MANUFACTURE
BASIC PRINTED CIRCUIT BOARD MANUFACTURE Bob Willis Electronic Presentation Services 2 Fourth Avenue Chelmsford Essex CM1 4HA England Tel: (44) 01245 351502 Fax: (44) 01245 496123 Email: bob@bobwillis.co.uk
More informationthe runnerless types of molds are explained post molding operations are described the basic methods of applied decoration methods are examined
Training Objectives After watching the video and reviewing this printed material, the viewer will gain knowledge and understanding of the various plastic finishing processes used in industry and their
More informationRedefining the Cost/Performance Curve for Rigid Flex Circuits
Presented at IPC Expo 99 Redefining the Cost/Performance Curve for Flex Circuits James Keating, Robert Larmouth and Greg Bartlett Teledyne Electronic Technologies 110 Lowell Road Hudson, NH 03051 Phone:
More informationBest Practices for Improving the PCB Supply Chain: Performing the Process Audit
Best Practices for Improving the PCB Supply Chain: Performing the Process Audit Cheryl Tulkoff, Greg Caswell, Dr. Craig Hillman DfR Solutions Beltsville, MD USA ctulkoff@dfrsolutions.com, gcaswell@dfrsolutions.com,
More informationSan Francisco Circuits, Inc.
Your Doorway to Innovation San Francisco Circuits, Inc. Bridging Concepts with Reality Flex PCB Introduction to Flex Circuits What is Flex Circuits? From Wikipedia - a technology for assembling electronic
More informationPRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES
PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES By Al Wright, PCB Field Applications Engineer Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry
More informationDesmear and Plating Through Hole Considerations and Experiences for Green PCB Production
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Gerd Linka, (Neil Patton) Atotech Deutschland GmbH Berlin, Germany Abstract With the latest legislations from RoHS
More informationSCREEN PRINTING INSTRUCTIONS
SCREEN PRINTING INSTRUCTIONS For Photo-Imageable Solder Masks and Idents Type 5600 Two Part Solder Masks and Idents Mega Electronics Ltd., Mega House, Grip Industrial Estate, Linton, Cambridge, ENGLAND
More informationUse of Carbon Nanoparticles for the Flexible Circuits Industry
Use of Carbon Nanoparticles for the Flexible Circuits Industry Ying (Judy) Ding, Rich Retallick MacDermid, Inc. Waterbury, Connecticut Abstract FPC (Flexible Printed Circuit) has been growing tremendously
More informationMulti-Flex Circuits Aust.
Contents: Base Materials Laminate Prepreg Panel Size (Utilization) Multilayer Layup N.C. Drilling Pattern design Impedance control Solder mask type Legend PCB Finishing Gold Plating Profiling Final testing
More informationTable of Contents. Flex Single-Side Circuit Construction. Rigid Flex Examples. Flex Double-Side Circuit Construction.
Table of Contents Flex Single-Side Circuit Construction Flex Double-Side Circuit Construction Multilayer Flex Circuit Construction Rigid Flex Examples IPC Information Glossary Rigid-Flex Construction Base
More informationECP Embedded Component Packaging Technology
ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous
More informationDFX - DFM for Flexible PCBs Jeremy Rygate
DFX - DFM for Flexible PCBs Jeremy Rygate 1 Jeremy Rygate 30 years experience with Front End in the Electronics industry and PCB manufacturing. Experience in advanced PCBs, particularly Flex, Flex-rigid
More informationPreface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental
More informationRapid Prototyping and Development of Microfluidic and BioMEMS Devices
Rapid Prototyping and Development of Microfluidic and BioMEMS Devices J. Sasserath and D. Fries Intelligent Micro Patterning System Solutions, LLC St. Petersburg, Florida (T) 727-522-0334 (F) 727-522-3896
More informationDynamic & Proto Circuits Inc. Corporate Presentation
Dynamic & Proto Circuits Inc. Corporate Presentation 1 DAPC Facility 54,000 Sq.ft./6,000 Sq.M 2 Multilayer Process 3 Solder Mask Options BLUE BLACK RED GREEN DRY FILM CLEAR 4 Investing in Technology New
More informationModule No. # 06 Lecture No. # 31 Conventional Vs HDI Technologies Flexible Circuits Tutorial Session
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering Indian Institute of Science, Bangalore Module No. # 06 Lecture No. # 31 Conventional Vs
More informationHow compact discs are made
How compact discs are made Explained by a layman for the laymen By Kevin McCormick For Science project at the Mountain View Los Altos High School Abstract As the major media for music distribution for
More informationNew Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical. Productronica Munich Nov 2009. Quality - Service - Innovation
New Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical Productronica Munich Nov 2009 Quality - Service - Innovation 1 New Material for Flex- and Rigid/Flex Circuitry Content: Our Vision Common
More informationDRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!
4/3/2013 S THROUGH YOUR PCB FABRICATOR S EYES! Brett McCoy Eagle Electronics Schaumburg IL. New England Design and Manufacturing Tech Conference Brett McCoy: Vice President / Director of Sales Circuit
More informationImpregnating Machine
Impregnating Machine Dasan Engineering manufactured Resin Coating & Laminating Machine for composite material and insulating material in addition to Impregnating & drying machine by means of high efficiency
More informationQuality assurance of flex circuits in the SCT barrel hybrid production
Quality assurance of flex circuits in the SCT barrel hybrid production ATLAS Project Document No. Institute Document No. Created: dd/mm/yy Modified: dd/mm/yy Page: 1 of 11 DRAFT Quality assurance of flex
More informationPrinted Circuit Design Tutorial
Printed Circuit Design Tutorial By Gold Phoenix Technology Tech Center, sales@goldphoenixpcb.biz Gold Phoenix has been sale PCB board in North America since 2003, during these years we received a lot of
More informationMicrowave Multi-layer Printed Circuit Boards
Microwave Multi-layer Printed Circuit Boards MicroAPS at IEEE MTT-S IMS in Fort Worth, TX Ed Sandor, Manager of Application Engineering, Taconic Advanced Dielectric Division June 9, 2004 Abstract Over
More informationFabrication of Embedded Capacitance Printed Circuit Boards
Presented at IPC Printed Circuits EXPO 2001 www.ipcprintedcircuitexpo.org Fabrication of Embedded Capacitance Printed Circuit Boards Joel S. Peiffer 3M St. Paul, MN Abstract Embedding capacitor materials
More informationMake up Epoxy adhesive
Epoflex Base Materials series of MSC Polymer AG offers flexible base materials from simple single side flexible boards, flex-rigid applications up to highly complex multilayer boards. The dielectric is
More informationFlexible Circuit Design Guide
Flexible Circuit Design Guide Benefits of Flexible Circuitry A solution to a packaging problem Placement around edges and folds Ability to be used in 3 axes connections Reduce assembly costs Very little
More informationConductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.
CMOS Processing Technology Silicon: a semiconductor with resistance between that of conductor and an insulator. Conductivity of silicon can be changed several orders of magnitude by introducing impurity
More information1 Guidelines for Flex Boards
1 Guidelines for Flex Boards The following information about flex and rigid/flex should be included in order to complete manufacturing task: 1. class of product 2. materials to be used for construction
More informationLamination Production. by: John Roberts / Sko Die, Inc
Lamination Production by: John Roberts / Sko Die, Inc Presentation Mission Understand the construction for magnetic cores Chose the best methods for producing Magnetic cores are constructed From soft magnetic
More informationT H A N K S F O R A T T E N D I N G OUR. FLEX-RIGID PCBs. Presented by: Nechan Naicker
T H A N K S F O R A T T E N D I N G OUR TECHNICAL WEBINAR SERIES FLEX-RIGID PCBs Presented by: Nechan Naicker We don t just sell PCBs. We sell sleep. Cirtech EDA is the exclusive SA representative of the
More informationTAIYO PSR-4000 AUS703
TAIYO PSR-4000 AUS703 LIQUID PHOTOIMAGEABLE SOLDER MASK Designed for Flip Chip Packaging Applications Halogen-Free (300ppm) Excellent Thermal and Crack Resistance Low Water Absorption RoHS Compliant Excellent
More informationRogers 3003, 3006, 3010, 3035, 3203, 3206, 3210
Stocked Materials: RIGID STANDARD FR4 High Tg 170c Black FR4 Polyclad 370HR (Lead Free) HIGH RELIABILITY Polyimide (Arlon 85N, Isola P96) BT (G200) HIGH FREQUENCY: Park Nelco 4000-13, 4000-13si Getek Gore
More informationRigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007
Rigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007 In the past, flex and rigid-flex technology was typically used in applications that could tolerate long design
More informationMILITARY SPECIFICATION PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR
The document and process conversion Measures necessary to comply with This revision shall be completed by 30 September 2001. INCH-POUND MIL-P-50884D 28 December 2000 SUPERSEDING MIL-P-50884C 4 May 1984
More informationFlexible Solutions. Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June 2013. www.ats.net
Flexible Solutions Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June 2013 www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) 3842
More informationWIRE, TERMINAL AND CONNECTOR REPAIR CONDUCTORS
CONDUCTORS Conductors are needed to complete the path for electrical current to flow from the power source to the working devices and back to the power source. Special wiring is needed for battery cables
More informationitaltec PRINTED CIRCUITS EQUIPMENT PRINTED CIRCUITS EQUIPMENT Insulator machines Echting machines Special equipment and machines
PRINTED CIRCUITS EQUIPMENT PRINTED CIRCUITS EQUIPMENT Insulator machines Echting machines Special equipment and machines On customer request it is possible to supply: Benches for PCB Oven for PCB Chemicals
More informationDigital Inkjet Printing for Etching Circuits
Digital Inkjet Printing for Etching Circuits MacDermid Electronics Solutions, Waterbury, CT USA 06702 by: John Ganjei, David Sawoska, Andrew Krol Abstract Using digital inkjet printing technology to directly
More informationAcceptability of Printed Circuit Board Assemblies
Section No.: 12I.2.3, Sheet 1 of 9 Rev Level: 16 Additional Distribution: PCB Assembly Subcontractors 1.0 Purpose 2.0 Scope Acceptability of Printed Circuit Board Assemblies 1.1 The purpose of this standard
More informationPCB Board Design. PCB boards. What is a PCB board
PCB Board Design Babak Kia Adjunct Professor Boston University College of Engineering Email: bkia -at- bu.edu ENG SC757 - Advanced Microprocessor Design PCB boards What is a PCB board Printed Circuit Boards
More informationENIG with Ductile Electroless Nickel for Flex Circuit Applications
ENIG with Ductile Electroless Nickel for Flex Circuit Applications Yukinori Oda, Tsuyoshi Maeda, Chika Kawai, Masayuki Kiso, Shigeo Hashimoto C.Uyemura & Co., Ltd. George Milad and Donald Gudeczauskas
More informationPROPERTIES OF MATERIALS
1 PROPERTIES OF MATERIALS 1.1 PROPERTIES OF MATERIALS Different materials possess different properties in varying degree and therefore behave in different ways under given conditions. These properties
More informationBasic Designs Of Flex-Rigid Printed Circuit Boards
PCBFABRICATION Basic Designs Of Flex-Rigid Printed Circuit Boards Flex-rigid boards allow integrated interconnection between several rigid boards. This technology helps to reduce the number of soldered
More informationUsing Flex in High-Speed Applications
feature Figure 1: An automotive flex circuit designed to fit into a tight form factor. Using Flex in High-Speed Applications by Glenn Oliver DuPont Electronics and Communications Copper clad circuits in
More informationDVD-15C Soldering Iron Tip Care
DVD-15C Soldering Iron Tip Care Below is a copy of the narration for DVD-15C. The contents for this script were developed by a review group of industry experts and were based on the best available knowledge
More informationTTM Operations and Technology Updates. A to Z. 2013TTM Technologies: PCB Manufacturing From A-Z
TTM Operations and Technology Updates 2013TTM Technologies: PCB Manufacturing From A-Z Q2-2013 Global Leader in PCB Manufacturing Leading global PCB manufacturer - $1.3 billion in revenue* 15 specialized
More informationFlexible Circuits and Interconnection Solutions
Flexible Circuits and Interconnection Solutions Introduction Our "Mission" is "to demonstrate through our unrivalled capability and service that Teknoflex sets the standard in the design, manufacture and
More informationIntroduction to Manufacturing Process
Introduction to Manufacturing Process What is Manufacturing? The English word manufacture is several centuries old. The term manufacture comes from two Latin words, manus (hand) and factus (make). As per
More informationWork Instruction SUPPLIER PRINTED CIRCUIT BOARD REQUIREMENTS
Summary of Change Revision Date 05/05/11 Sections 3.3.6 was added, 3.4.1 and 3.4.8 have changed dimensional formats, and 3.6.4-3.6.8 were removed 02/23/11 Changed panel to lot section 3.3.3 02/15/11 Formal
More informationPrinted Circuit Boards
Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the
More informationThermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies
Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road
More informationElectronic Board Assembly
Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -
More informationCORROSION ENGINEERING RESIN-BASED POLYMER CONCRETES AND GROUTS
AN ERGONARMOR COMPANY TECHNICAL INFORMATION SPECIFICATION FOR INSTALLATION 07/11 SUPERSEDES 04/00 PAGE 1 OF 6 CORROSION ENGINEERING RESIN-BASED POLYMER CONCRETES AND GROUTS 1. SCOPE 1.1 This specification
More information1. Initial Precautions 2. Technical Precautions and Suggestions 3. General Information and Cure Stages 4. Understanding and Controlling Cure Time
How to apply Arctic Alumina Premium Ceramic Thermal Adhesive 1. Initial Precautions 2. Technical Precautions and Suggestions 3. General Information and Cure Stages 4. Understanding and Controlling Cure
More informationOverview of Rigid Flex Technology. Joseph Fjelstad
Overview of Rigid Flex Technology Joseph Fjelstad Background Flexible circuits have seen explosive growth in recent times owing to their numerous advantages as an interconnection medium. Presently nearly
More information07 21 19 Guide Specification STAYFLEX CORROSION CONTROL AND THERMAL INSULATION SYSTEM
07 21 19 STAYFLEX CORROSION CONTROL AND THERMAL INSULATION SYSTEM 7819 Broadview Road Cleveland, OH 44131 800-522-4522 February, 2011 SPEC NOTE: This guide specification is intended for use when specifying
More informationIntroduction to VLSI Fabrication Technologies. Emanuele Baravelli
Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation
More informationTSM-30. General Processing Guidelines
TSM-30 General Processing Guidelines Petersburgh, NY Tel: 800-833-1805 Fax: 518-658-3988 Europe Tel: +353-44-9395600 Fax: +353-44-9344369 Asia Tel: +82-31-704-1858 Fax: +82-31-704-1857 www.taconic-add.com
More informationSolutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region
Solutions without Boundaries PCB Surface Finishes Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region 1 Notice Notification of Proprietary Information: This document contains proprietary
More informationAuditing Contract Manufacturing Processes
Auditing Contract Manufacturing Processes Greg Caswell and Cheryl Tulkoff Introduction DfR has investigated multiple situations where an OEM is experiencing quality issues. In some cases, the problem occurs
More informationSafety Certification for Lead Free Flexible and Rigid-Flex PCBs
Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Crystal Vanderpan Underwriters Laboratories Inc. March 27, 2007 Crystal Vanderpan Principal Engineer for Printed Circuit Technologies Joined
More informationPrinted Circuit Board Design & Fabrication
The Further Education and Training Awards Council (FETAC) was set up as a statutory body on 11 June 2001 by the Minister for Education and Science. Under the Qualifications (Education & Training) Act,
More informationDVD-PTH-E Through-Hole Solder Joint Workmanship Standards
DVD-PTH-E Through-Hole Solder Joint Workmanship Standards Below is a copy of the narration for the DVD-PTH-E video presentation. The contents for this script were developed by a review group of industry
More information2. The mold is closed up and held under hydraulic pressure while the rubber material or compound cures.
Designing with Rubber Molding Processes Compression Molding Compression molding is the process of placing a pre-load of a rubber material or compound directly in the mold cavity and compressed to the shape
More informationWATERPROOFING OF REINFORCED CONCRETE FLAT ROOF 12
WATERPROOFING OF REINFORCED CONCRETE FLAT ROOF 12 87 88 GOOD INDUSTRY PRACTICES 12 WATERPROOFING OF REINFORCED CONCRETE FLAT ROOF 12.1 BACKGROUND Most roofs in Singapore are constructed using reinforced
More informationIPC-SM-840C. Qualification and Performance of Permanent Solder Mask IPC-SM-840C. The Institute for. Interconnecting. and Packaging Electronic Circuits
The Institute for Interconnecting and Packaging Electronic Circuits Qualification and Performance of Permanent Solder Mask January 1996 A standard developed by the Institute for Interconnecting and Packaging
More informationIntroduction: Consumables - Part of the Identification System
Consumables - The Basics A presentation from: Introduction: Consumables - Part of the Identification System You have spent many hours researching, selecting, and getting approval for your new data collection
More informationComputer Lane Monitor HOW TO MAKE A TAPE AND HOW TO READ A TAPE
Computer Lane Monitor T M HOW TO MAKE A TAPE AND HOW TO READ A TAPE April, 2003 SP03-8 General Description The Brunswick Lane Monitor System is designed to permanently record and read the amount of dressing
More informationSurface Decoration. Design techniques used to put on the surface of the pottery. Slip Oxides Glaze Embossed Incised Wax on wet Altered from the wheel
Surface Decoration Design techniques used to put on the surface of the pottery. Slip Oxides Glaze Embossed Incised Wax on wet Altered from the wheel Slip How to apply slip Colored slip is intended to add
More informationLecture 9. Surface Treatment, Coating, Cleaning
1 Lecture 9. Surface Treatment, Coating, Cleaning These processes are sometimes referred to as post-processing. They play a very important role in the appearance, function and life of the product. Broadly,
More informationFlip Chip Package Qualification of RF-IC Packages
Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages
More informationElectroplating with Photoresist Masks
Electroplating with Photoresist Masks Revised: 2014-01-17 Source: www.microchemicals.com/downloads/application_notes.html Electroplating - Basic Requirements on the Photoresist Electroplating with photoresist
More informationNEW ELECTRICAL SUBSTATION Building 300 SECTION 07 53 23 ETHYLENE-PROPYLENE-DIENE-MONOMER ROOFING WORK
ETHYLENE-PROPYLENE-DIENE-MONOMER ROOFING WORK PART 1 GENERAL 1.1 REFERENCES The publications listed below form a part of this specification to the extent referenced. The publications are referred to within
More informationDesign for Manufacturing
2 Design for Manufacturing This chapter will address the fabrication process of the PCB and the requirements of the manufacturer. Manufacturers are separated by their limitations or constraints into categories
More informationT A B L E T 1 T E S T S A N D I N S P E C T I O N C A B L E P C U T A N D P C U T - A
T A B L E T 1 1 of 7 Tests & Inspection Cable PCUT & PCUT-A (Table T1) T E S T S A N D I N S P E C T I O N C A B L E P C U T A N D P C U T - A No. Test Scale MOC Requirements G 20:10:001:01 Defined Test
More informationBending, Forming and Flexing Printed Circuits
Bending, Forming and Flexing Printed Circuits John Coonrod Rogers Corporation Introduction: In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed
More information