EHDC. Cooling system for Data Center and server cabinets.

EHDC Cooling system for Data Center and server cabinets.

EHDC PEN LP EHDC L is a High Density Cooling module for an pen Loop configuration. It is ideally installed with Enoc Systems cold corridor containment system (KKD and KKT). EHDC L units are available up to 19,3 kw nominal cooling capacity. The EHDC L units are equipped with high efficient EU4 Zig-Zag filter. EHDC CLSED LP EHDC CL/CL2 is a High Density Cooling module for a configuration. It should be installed together with SSK server racks. configuration is suitable for self contained data centers and high density racks. Heat generated by servers remains inside the cabinet and is disposed without entering the room. EHDC CL units are available up to 36 kw nominal cooling capacity. Flexibility/Scalability The flexibility of an pen Loop installation makes EHDC the best solution both for big datacenters with a high number of racks and small server rooms. More air-conditioning units can be added without altering the existing structure. Reliability EHDC is operated through the C2020 smart controller for reliable operation. It is provided as standard with keypad to adjust set points, display operational data and alarms and to start up the unit. Installing an optional serial port, C2020 can be connected to a local PC or a BMS site, for tele-monitoring and remote control. Fan Hot Swap: through fan switches on the multiswitch bar, power supply of each single fan can be interrupted, so that it can be maintained while the others are still working. Dual Power supplied with auto-change over to an additional emergency line. Chilled water might be supplied either by an indoor or an outdoor chiller. In chilled water-plants provided with free cooling, external air cools water through a heat exchanger. Thus, working time of energy-intensive compressor-cooling is drastically reduced. EHDC units are particularly suitable for systems with free cooling, due to their high performance in heat-load disposal. Their very efficient coil allows cooling effect also at high entering water temperatures (up to 15 C). In this way, the use of free cooling is maximized. EHDC is possible to equip with EC fans (electronically commutated) as an option. An electronic controller adjusts the speed of fans powered by energy-saving motors. EC fans react continously to system changes, keeping maximum efficiency in every condition. The CW valve recieves a modulating signal from C2020-controller to vary water the flow through the heat exchanger in order to adjust the cooling capacity of the unit to actual heat load. CW valve is available in two versions: 3 ways valve for constant flow system, and 2 ways for variable flow system. The proportional control allows an optimal management of waterflow through the heat exchanger coil.

CLD CRRIDR CNTAINMENT Instead of cooling the entire datacenter with cool air, the cold corridor containment system from Enoc System directs the cold air directly to the active equipment. A contained cold corridor stops cold and hot air from mixing. With no possibility of hot and cold air mixing the cooling systems reliability, cooling capacity and energy efficiency increases. Enoc System s cold corridor system is ideal for both CRAC cooling through a raised floor and cooling through EHDC pen Loop system. Increased reliability Cold air is distributed over the full height of the cold corridor. This means that all active equipment is supplied with optimal cool air. Increased cooling capacity No hot air is recirculated to the servers. Therefore the cooling system can be operated at a higher temperature, resulting in increased cooling capacit, due to the lack of hot spots. Increased energy efficiency As a result of higher return air temperature to either the CRAC unit or the EHDC L unit the airconditioning unit is operated at a higher efficiency (higher T).

DATACENTRE CLING - overview C R A C Computer Room Air Conditioner Traditional Cold/Warm corridor alignment. Cold/Warm corridor alignment improved with cold corridor containment. Max ~6 kw/ rack Max ~10 kw/ rack Concept -Racks aligned in cold/warm corridors. -CRAC cooling units placed on the outer perimeter of the corridors. -Raised floor to deliver cool air to the cold corridor. -Ventilated floor tiles in front of each rack. Concept -Racks aligned in cold/warm corridors. -KKT roof panels and KKD door sections used to create a cold corridor containment. -CRAC cooling units placed on the outer perimeter of the corridors. -Raised floor to deliver cool air to the cold corridor. -Ventilated floor tiles in front of each rack. P E N L P pen Loop cooling with cold corridor containment. Medium Density. pen Loop cooling with cold corridor containment. High Density. Max ~20 kw/ rack Concept -Racks aligned in cold/warm corridors. -KKT roof panels and KKD door sections used to create a cold corridor containment. -EHDC L cooling units placed between racks. -Water connections from top or from bottom. -No raised floor is needed. C L S E D L P cooling. High Density. cooling. Ultra High Density. N+1 redundancy. Max ~36 kw/ rack Concept; -Racks aligned in rows. -EHDC CL/CL2 cooling units placed between racks. -Racks must be equiped with closed metal or glass doors. -Racks must be separated in a cold and warm compartment (using TPS and TPP). -Water connections from top or from bottom. -No raised floor is needed.

Description CRAC brings cold air under the raised floor. The cold air is delivered to the front of the cabinets through ventilated floor tiles. The heated air is drawn in from the top of the CRAC. Description CRAC brings cold air under the raised floor. The cold air is delivered to the contained cold corridor through ventilated floor tiles in front of the cabinets. The heated air is drawn in from the top of the CRAC. Remarks This cooling system has the following limitations: -Cables, etc under the raised floor can obstruct the airflow. -Ventilated floor tiles is obstructing high volume airflow. -Recirculation of heated air into the cold corridor leading to uneven vertical air-distribution. This results in unnecessarily cold air being distributed in order to get adequately cooled air to the top mounted servers. -Mixing of cold and hot air results in low return air-temperature to the CRAC. This results in that the CRAC will not function effectively. Remarks Benefits: -Containment is obstructing the mixing of cold/hot air. Vertically delivering even, cold air in front of the cabinets. It is possible to raise the inlet temperature. -Containment is also obstructing the cold air from reaching the CRAC. This means higher return air-temperature to the CRAC. The CRAC is running at higher efficiency. -It is possible to save up to 35% of cooling costs compared to a non contained installation. This cooling system has the following limitations: -Cables, etc under the raised floor can obstruct the airflow. -Ventilated floor tiles is obstructing high volume airflow. Description: EHDC L is placed between racks. EHDC L delivers cold air to the contained cold corridor in front of the cabinets. Servers use cold air from the cold corridor and exhausts heated air out the back. The heated air is drawn in from the back of the cabinets (close to the servers). Remarks Benefits: -Containment is obstructing the mixing of cold/hot air. Vertically delivering even, cold air in front of the cabinets. It is possible to have a high inlet temperature. -Containment is also obstructing the cold air from reaching the EHDC L. This means higher return air temperature to the EHDC L. The EHDC L is running at a higher efficiency. -Cooling is moved closer to the servers with no obstructions of airflow. -Raised floor is not necessary for air distribution. -N+1 Redundancy possible. -Scalable installation possible. -Multiple density zones possible within the same datacenter. Using EHDC L, EHDC CL/CL2 and CRAC cooling. Description: EHDC CL/CL2 is placed between racks. EHDC CL/CL2 delivers cold air to the front of the cabinets. Servers use cold air from EHDC CL/CL2 directly and exhausts heated air out the back of the cabinet. The heated air is drawn in from the back of the cabinet (close to the servers). Remarks Benefits: -EHDC CL/CL2 is supplied with hot air directly from the servers. This means higher return air temperature to the EHDC CL/CL2. The EHDC CL/CL2 is running at a higher efficiency. -Cooling is moved closer to the servers with no obstructions of airflow. -Raised floor is not necessary for air distribution. -N+1 Redundancy possible. -Scalable installation possible. -Multiple density zones possible within the same datacenter. Using EHDC L, EHDC CL/CL2 and CRAC cooling.

TECHNICAL SPECIFICATIN pen Loop A1 A7 B1 A6 B2 C4 Total cooling capacity* kw 12,5 16,2 19,3 21,6 29,5 36,0 Power supply V/ph/Hz 230/1/50 230/1/50 Air flow m3/h 2500 3600 3600 2600 4000 4000 Fan AC Fan version Number of fans 3 5 5 3 5 5 Fan motor max. (each) W 160 160 A 0,7 0,7 EC Fan version Number of fans 3 5 5 3 5 5 Fan motor max. (each) W 178 178 A 1,4 1,4 Air-to-water heat exchanger Face area m2 0,40 0,40 Air face velocity m/s 2,3 2,8 2,8 2,3 2,8 2,8 Water circuit Water flow l/h 2150 2790 3300 3700 5070 6200 Water pressure drop (total)** kpa 62 91 75 81 122 142 Water valve 3 way modulating valve 3 way modulating valve Water connection sizes Supply line diameter in 1" female 1" female Return line diameter in 1" female 1" female *Nominal conditions Closed loop: return air temperature 45C/RH 15% pen loop: return air temperature 30C/RH 30% Water temperature in =7C Water dt=5c (12C return temperature) Gross cooling capacity (including power dissapated by fans) Refrigerant: Water without additives **Total pressure losses through the water circuit inside the unit CLSED LP CNFIGURATINS ne EHDC CL unit for one rack. Up to 36 kw nominal cooling capacity per rack. ne EHDC CL2 unit for two racks. Up to 18 kw nominal cooling capacity per rack. Two EHDC CL units for one rack. N+1 redundancy. Up to 72 kw nominal cooling capacity or up to 36 kw cooling capacity with full redundancy per rack.

EC fans It is possible to equip all models with EC fans (option). EC fans operates more efficient than AC fans. EC fans has continuous modulation of speed and also low noise level at reduced speed. Condensing pump Necessary when piping arrangement is done from the top. WIB8000 It is possible to monitor the EHDC cooling units through Modbus. If monitoring through HTTP and SNMP internet protocols is required, then the WIB8000 is necessary (accessory). 35 EHDC pen loop: cooling capacity 30 Cooling capacity (kw) 25 20 15 10 5 0 L A1 L A7 L B1 26 30 35 40 45 Return air temperature( C) 40 EHDC Closed loop: cooling capacity 35 Cooling capacity (kw) 30 25 20 15 10 5 0 CL A6 CL B2 CL C4 26 30 35 40 45 Return air temperature( C)

pen Loop pen Loop Art.No. Version Type designation Art.No. Version Type Designation 53001-00 EHDC 31120 L-A1 53031-00 EHDC 31120 CL-A6 53011-00 EHDC 31120 L-A7 53041-00 EHDC 31120 CL-B2 53021-00 EHDC 31120 L-B1 53051-00 EHDC 31120 CL-C4 53061-00 EHDC 31120 CL2-A6 53071-00 EHDC 31120 CL2-B2 53081-00 EHDC 31120 CL2-C4 53003-00 EHDC 31220 L-A1 53033-00 EHDC 31220 CL-A6 53013-00 EHDC 31220 L-A7 53043-00 EHDC 31220 CL-B2 53023-00 EHDC 31220 L-B1 53053-00 EHDC 31220 CL-C4 53063-00 EHDC 31220 CL2-A6 53073-00 EHDC 31220 CL2-B2 53083-00 EHDC 31220 CL2-C4 Standard ption AC Fans EC Fans Piping from bottom Piping from top 3 way valve 2 way valve ACTDPMP Condensing pump (necessary when piping arrangement from top), shipped loose Combine the article-number with the number of the article version (see table below) to complete Your EHDC. Article Versions AC Fans EC Fans Piping from bottom Piping from top 3 way valve 2 way valve ACTDPMP Condensing pump -00-01 -02-03 -04-05 -06-07 www.enocsystem.com - info@enocsystem.com - order@enocsystem.com