Schottky Rectifier, 2 x 10 A

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VS-MR...CTPbF, VS-MR...CT-1PbF Series Schottky Rectifier, x Vishay High Power Products VS-MR...CTPbF ase common cathode 1 Common 3 node cathode node D PK PRODUCT SUMMRY I F(V) V R VS-MR...CT-1PbF ase common cathode 1 Common 3 node cathode node TO-6 x 8 V to V FETURES 15 C operation Low forward voltage drop High frequency operation Center tap D PK and TO-6 packages High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance Guard ring for enhanced ruggedness and long term reliability Meets MSL level 1, per J-STD-, LF maximum peak of 6 C Halogen-free according to IEC 6149--1 definition Compliant to RoHS directive /95/EC EC-Q1 qualified DESCRIPTION This center tap Schottky rectifier has been optimized for low reverse leakage at high temperature. The proprietary barrier technology allows for reliable operation up to 15 C junction temperature. Typical applications are in switching power supplies, converters, freewheeling diodes, and reverse battery protection. MJOR RTINGS ND CHRCTERISTICS SYMOL CHRCTERISTICS VLUES UNITS I F(V) Rectangular waveform (per device) I FRM T C = 133 C (per leg) V RRM 8 to V I FSM t p = 5 μs sine 85 V F pk, = 15 C.7 V Range - 65 to 15 C VOLTGE RTINGS PRMETER SYMOL VS-MR8CTPbF VS-MR8CT-1PbF VS-MR9CTPbF VS-MR9CT-1PbF VS-MRCTPbF VS-MRCT-1PbF UNITS Maximum DC reverse voltage V R 8 9 V Maximum working peak reverse voltage V RWM SOLUTE MXIMUM RTINGS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum average per leg I F(V) T C = 133 C, rated V R forward current per device Peak repetitive forward current per leg I FRM Rated V R, square wave, khz, T C = 133 C Non-repetitive peak surge current I FSM 5 μs sine or 3 μs rect. pulse Following any rated load ondition and with rated V RRM applied Surge applied at rated load conditions halfwave, single phase, 6 Hz 15 Peak repetitive reverse surge current I RRM. μs, 1. khz.5 Non-repetitive avalanche energy per leg E S = 5 C, I S =, L = 1 mh 4 mj 85 Document Number: 9436 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 16-Mar- 1

VS-MR...CTPbF, VS-MR...CT-1PbF Series Vishay High Power Products Schottky Rectifier, x ELECTRICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum forward voltage drop V (1) FM.8 = 5 C.95.7 = 15 C.85 V Maximum instantaneous = 5 C. I RM reverse current Rated DC voltage = 15 C 6 m Threshold voltage V F(TO).433 V = maximum Forward slope resistance r t 15.8 mω Maximum junction capacitance C T V R = 5 V DC (test signal range khz to 1 MHz), 5 C 4 pf Typical series inductance L S Measured from top of terminal to mounting plane 8. nh Maximum voltage rate of change dv/dt Rated V R V/μs Note (1) Pulse width < 3 μs, duty cycle < % THERML - MECHNICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum junction temperature range - 65 to 15 C Maximum storage temperature range T Stg - 65 to 175 Maximum thermal resistance, R thjc DC operation. junction to case per leg Typical thermal resistance, case to heatsink Maximum thermal resistance, junction to ambient pproximate weight Mounting torque Marking device R thcs Mounting surface, smooth and greased.5 R thj DC operation 5 C/W g.7 oz. minimum 6 (5) kgf cm Non-lubricated threads maximum 1 () (lbf in) Case style D PK Case style TO-6 MRCT MRCT-1 www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 9436 Revision: 16-Mar-

VS-MR...CTPbF, VS-MR...CT-1PbF Series Schottky Rectifier, x Vishay High Power Products I F - Instantaneous Forward Current () = 15 C = 15 C = 5 C I R - Reverse Current (m) 1.1.1.1 = 15 C = 15 C = C = 75 C = 5 C = 5 C 1..4.6.8 1. 1. 1.4 1.6 1.8 V FM - Forward Voltage Drop (V) Fig. 1 - Maximum Forward Voltage Drop Characteristics (Per Leg) Fig. - Typical Values of Reverse Current vs. Reverse Voltage (Per Leg).1 4 6 8 V R - Reverse Voltage (V) C T - Junction Capacitance (pf) = 5 C 4 6 8 V R - Reverse Voltage (V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg) Z thjc - Thermal Impedance ( C/W) 1.1 Single pulse (thermal resistance) D =.75 D =.5 D =.33 D =.5 D =..1.1.1.1.1.1 1 t 1 - Rectangular Pulse Duration (s) Fig. 4 - Maximum Thermal Impedance Z thjc Characteristics (Per Leg) P DM Notes: 1. Duty factor D = t 1 /t. Peak = P DM x Z thjc + T C t 1 t Document Number: 9436 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 16-Mar- 3

VS-MR...CTPbF, VS-MR...CT-1PbF Series Vishay High Power Products Schottky Rectifier, x llowable Case Temperature ( C) 15 14 13 1 1 Square wave (D =.5) Rated V R applied See note (1) DC 4 6 8 1 14 16 I F(V) - verage Forward Current () Fig. 5 - Maximum llowable Case Temperature vs. verage Forward Current (Per Leg) verage Power Loss (W) 8 6 4 D =. D =.5 D =.33 D =.5 D =.75 DC RMS limit 4 6 8 1 14 16 I F(V) - verage Forward Current () Fig. 6 - Forward Power Loss Characteristics (Per Leg) I FSM - Non-Repetitive Surge Current () t any rated load condition and with rated V RRM applied following surge t p - Square Wave Pulse Duration (µs) Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg) Note (1) Formula used: T C = - (Pd + Pd REV ) x R thjc ; Pd = Forward power loss = I F(V) x V FM at (I F(V) /D) (see fig. 6); Pd REV = Inverse power loss = V R1 x I R (1 - D); I R at V R1 = Rated V R www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 9436 4 Revision: 16-Mar-

VS-MR...CTPbF, VS-MR...CT-1PbF Series Schottky Rectifier, x Vishay High Power Products ORDERING INFORMTION TLE Device code VS- MR CT -1 TRL P 1 3 4 5 6 7 8 9 1 - HPP product suffix - Essential part number 3 - = D PK 7 None None = TO-6 7 = -1 4 - Current rating ( = ) 8 = 8 V 5 - Voltage ratings 9 = 9 V = V 6 - CT = Essential part number 7 - None = D PK 3 = -1 = TO-6 3 None 8 - None = Tube (5 pieces) TRL = Tape and reel (left oriented - for D PK only) 9 - TRR = Tape and reel (right oriented - for D PK only) PbF = Lead (Pb)-free (for TO-6 and D PK tube) P = Lead (Pb)-free (for D PK TRR and TRL) LINKS TO RELTED DOCUMENTS Dimensions Part marking information Packaging information www.vishay.com/doc?9514 www.vishay.com/doc?958 www.vishay.com/doc?953 Document Number: 9436 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 16-Mar- 5

Outline Dimensions Vishay High Power Products D PK, TO-6 DIMENSIONS FOR D PK in millimeters and inches Conforms to JEDEC outline D PK (SMD-) (3) L1 ()(3) E 4 c (E) (D1) (3) Pad layout 11. MIN. (.43) 9.65 MIN. (.38) D L x e 1 3 H () x b x b C Detail. M M c ±.4 M E1 View - H (3) 17.9 (.7) 15. (.65).3 MIN. (.8) Plating.64 (.3).41 (.96) (4) b1, b3 3.81 MIN. (.15) ase Metal Gauge plane Lead assignments Diodes 1. - node (two die)/open (one die)., 4. - Cathode 3. - node Lead tip to 8 L3 L L4 Detail Rotated 9 CW Scale: 8:1 1 Seating plane (c) (b, b) Section - and C - C Scale: None c1 (4) SYMOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES 4.6 4.83.16.19 D1 6.86 8..7.315 3 1..54.. E 9.65.67.38.4, 3 b.51.99..39 E1 7.9 8.8.311.346 3 b1.51.89..35 4 e.54 SC. SC b 1.14 1.78.45.7 H 14.61 15.88.575.65 b3 1.14 1.73.45.68 4 L 1.78.79.7.1 c.38.74.15.9 L1-1.65 -.66 3 c1.38.58.15.3 4 L 1.7 1.78.5.7 c 1.14 1.65.45.65 L3.5 SC. SC D 8.51 9.65.335.38 L4 4.78 5.8.188.8 Notes (1) Dimensioning and tolerancing per SME Y14.5 M-1994 () Dimension D and E do not include mold flash. Mold flash shall not exceed.17 mm (.5") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L1, D1 and E1 (4) Dimension b1 and c1 apply to base metal only (5) Datum and to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-63 Document Number: 9514 For technical questions concerning discrete products, contact: diodes-tech@vishay.com www.vishay.com Revision: 31-Mar-9 For technical questions concerning module products, contact: ind-modules@vishay.com 1

Outline Dimensions Vishay High Power Products D PK, TO-6 DIMENSIONS FOR TO-6 in millimeters and inches Modified JEDEC outline TO-6 (Datum ) () (3) E (3) L1 c E D Seating plane D1(3) L 1 C 3 C L () x e. M M Lead tip 3 x b 3 x b c Lead assignments 1 Diodes 1. - node (two die)/open (one die)., 4. - Cathode 3. - node Plating c E1 Section - (4) ase b1, b3 metal (b, b) (3) c1 (4) Section - and C - C Scale: None SYMOL MILLIMETERS INCHES MIN. MX. MIN. MX. NOTES 4.6 4.83.16.19 1.3 3..8.119 b.51.99..39 b1.51.89..35 4 b 1.14 1.78.45.7 b3 1.14 1.73.45.68 4 c.38.74.15.9 c1.38.58.15.3 4 c 1.14 1.65.45.65 D 8.51 9.65.335.38 D1 6.86 8..7.315 3 E 9.65.67.38.4, 3 E1 7.9 8.8.311.346 3 e.54 SC. SC L 13.46 14..53.555 L1-1.65 -.65 3 L 3.56 3.71.14.146 Notes (1) Dimensioning and tolerancing as per SME Y14.5M-1994 () Dimension D and E do not include mold flash. Mold flash shall not exceed.17 mm (.5") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L1, D1 and E1 (4) Dimension b1 and c1 apply to base metal only (5) Controlling dimension: inches (6) Outline conform to JEDEC TO-6 except 1 (maximum), b (minimum) and D1 (minimum) where dimensions derived the actual package outline www.vishay.com For technical questions concerning discrete products, contact: diodes-tech@vishay.com Document Number: 9514 For technical questions concerning module products, contact: ind-modules@vishay.com Revision: 31-Mar-9

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