Lecture 1: Circuits & Layout

Lecture 1: Circuits & Layout

Outline A Brief History CMOS Gate esign Pass Transistors CMOS Latches & Flip-Flops Standard Cell Layouts Stick iagrams 2

A Brief History 1958: First integrated circuit Flip-flop using two transistors Built by Jack Kilby at Texas Instruments 21 Intel Core i7 μprocessor 2.3 billion transistors 64 Gb Flash memory > 16 billion transistors Courtesy Texas Instruments [Trinh9] 29 IEEE. 3

Growth Rate 53% compound annual growth rate over 5 years No other technology has grown so fast so long riven by miniaturization of transistors Smaller is cheaper, faster, lower in power! Revolutionary effects on society [Moore65] Electronics Magazine 4

Annual Sales >1 19 transistors manufactured in 28 1 billion for every human on the planet 5

Invention of the Transistor Vacuum tubes ruled in first half of 2 th century Large, expensive, power-hungry, unreliable 1947: first point contact transistor John Bardeen and Walter Brattain at Bell Labs See Crystal Fire by Riordan, Hoddeson AT&T Archives. Reprinted with permission. 6

Transistor Types Bipolar transistors npn or pnp silicon structure Small current into very thin base layer controls large currents between emitter and collector Base currents limit integration density Metal Oxide Semiconductor Field Effect Transistors nmos and pmos MOSFETS Voltage applied to insulated gate controls current between source and drain Low power allows very high integration 7

MOS Integrated Circuits 197 s processes usually had only nmos transistors Inexpensive, but consume power while idle [Vadasz69] 1969 IEEE. Intel 111 256-bit SRAM Intel 44 4-bit μproc 198s-present: CMOS processes for low idle power Intel Museum. Reprinted with permission. 8

Moore s Law: Then 1965: Gordon Moore plotted transistor on each chip Fit straight line on semilog scale Transistor counts have doubled every 26 months Integration Levels SSI: 1 gates MSI: 1 gates LSI: 1, gates [Moore65] Electronics Magazine VLSI: > 1k gates 9

And Now 1

Feature Size Minimum feature size shrinking 3% every 2-3 years 11

Corollaries Many other factors grow exponentially Ex: clock frequency, processor performance 12

CMOS Gate esign Activity: Sketch a 4-input CMOS NOR gate A B C 13

Complementary CMOS Complementary CMOS logic gates nmos pull-down network pmos pull-up network a.k.a. static CMOS inputs pmos pull-up network output Pull-down OFF Pull-up OFF Z (float) Pull-up ON 1 nmos pull-down network Pull-down ON X (crowbar) 14

Series and Parallel nmos: 1 = ON pmos: = ON g1 g2 a b a b a 1 b a 1 b a 1 1 b Series: both must be ON Parallel: either can be ON (a) g1 g2 a b OFF OFF OFF ON a a a a 1 1 1 1 b b b b (b) ON OFF OFF OFF a a a a a g1 g2 1 1 1 1 b b b b b (c) OFF ON ON ON a a a a a g1 g2 1 1 1 1 b b b b b (d) ON ON ON OFF 15

Conduction Complement Complementary CMOS gates always produce or 1 Ex: NAN gate Series nmos: = when both inputs are 1 Thus =1 when either input is Requires parallel pmos Rule of Conduction Complements A B Pull-up network is complement of pull-down Parallel -> series, series -> parallel 16

Compound Gates Compound gates can do any inverting function Ex: = AiB+ Ci (AN-AN-OR-INVERT, AOI22) A C A C B B (a) (b) (c) A B C (d) C A B C A A B B C A B C (f) (e) 17

= ( A+ B+ C) i Example: O3AI A A B C B C 18

Signal Strength Strength of signal How close it approximates ideal voltage source V and GN rails are strongest 1 and nmos pass strong But degraded or weak 1 pmos pass strong 1 But degraded or weak Thus nmos are best for pull-down network 19

Pass Transistors Transistors can be used as switches 2

Transmission Gates Pass transistors produce degraded outputs Transmission gates pass both and 1 well a g gb b g =, gb = 1 a b g = 1, gb = a b Input Output g = 1, gb = strong g = 1, gb = 1 strong 1 a g b a g b a g b gb gb gb 21

Tristates Tristate buffer produces Z when not enabled EN A EN Z A 1 Z 1 1 1 1 A EN EN 22

Nonrestoring Tristate Transmission gate acts as tristate buffer Only two transistors But nonrestoring Noise on A is passed on to EN A EN 23

Tristate Inverter Tristate inverter produces restored output Violates conduction complement rule Because we want a Z output A A A EN EN EN = = 'Z' EN = 1 = A 24

Multiplexers 2:1 multiplexer chooses between two inputs S 1 S 1 X X 1 X 1 1 1 1 1 X 1 25

Gate-Level Mux esign = S + S 1 (too many transistors) How many transistors are needed? 2 1 S 1 S 2 4 4 2 2 4 2 26

Transmission Gate Mux Nonrestoring mux uses two transmission gates Only 4 transistors S S 1 S 27

Inverting Mux Inverting multiplexer Use compound AOI22 Or pair of tristate inverters Essentially the same thing Noninverting multiplexer adds an inverter S S S 1 S S S 1 S S 1 1 S 28

4:1 Multiplexer 4:1 mux chooses one of 4 inputs using two selects Two levels of 2:1 muxes Or four tristates S1S S1S S1S S1S S S1 1 2 1 1 1 2 3 1 3 29

Latch When CLK = 1, latch is transparent flows through to Q like a buffer When CLK =, the latch is opaque Q holds its old value independent of a.k.a. transparent latch or level-sensitive latch CLK CLK Latch Q Q 3

Latch esign Multiplexer chooses or old Q CLK 1 Q Q CLK CLK CLK Q Q CLK 31

Latch Operation Q Q Q Q CLK = 1 CLK = CLK Q 32

Flip-flop When CLK rises, is copied to Q At all other times, Q holds its value a.k.a. positive edge-triggered flip-flop, master-slave flip-flop CLK CLK Flop Q Q 33

Flip-flop esign Built from master and slave latches CLK CLK QM CLK Q CLK CLK CLK CLK CLK Latch QM Latch Q CLK CLK 34

Flip-flop Operation QM Q CLK = QM Q CLK = 1 CLK Q 35

Race Condition Back-to-back flops can malfunction from clock skew Second flip-flop fires late Sees first flip-flop change and captures its result Called hold-time failure or race condition CLK1 CLK1 CLK2 CLK2 Flop Q1 Flop Q2 Q1 Q2 36

Nonoverlapping Clocks Nonoverlapping clocks can prevent races As long as nonoverlap exceeds clock skew We will use them in this class for safe design Industry manages skew more carefully instead φ 2 φ 1 QM Q φ 2 φ 2 φ 1 φ 1 φ 2 φ 1 φ 1 φ 2 37

Gate Layout Layout can be very time consuming esign gates to fit together nicely Build a library of standard cells Standard cell design methodology V and GN should abut (standard height) Adjacent gates should satisfy design rules nmos at bottom and pmos at top All gates include well and substrate contacts 38

Example: Inverter 39

Example: NAN3 Horizontal N-diffusion and p-diffusion strips Vertical polysilicon gates Metal1 V rail at top Metal1 GN rail at bottom 32 λ by 4 λ 4

Stick iagrams Stick diagrams help plan layout quickly Need not be to scale raw with color pencils or dry-erase markers V A V A B C metal1 c poly ndiff pdiff contact GN INV GN NAN3 41

Wiring Tracks A wiring track is the space required for a wire 4 λ width, 4 λ spacing from neighbor = 8 λ pitch Transistors also consume one wiring track 42

Well spacing Wells must surround transistors by 6 λ Implies 12 λ between opposite transistor flavors Leaves room for one wire track 43

Area Estimation Estimate area by counting wiring tracks Multiply by 8 to express in λ 4 32 44

Example: O3AI Sketch a stick diagram for O3AI and estimate area = ( A+ B+ C) i V A B C 6 tracks = 48 λ GN 5 tracks = 4 λ 45