International Journal of Engineering Science Invention Research & Development; Vol. I Issue I July 2014

Similar documents
TRUE SINGLE PHASE CLOCKING BASED FLIP-FLOP DESIGN

Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications

True Single Phase Clocking Flip-Flop Design using Multi Threshold CMOS Technique

Chapter 10 Advanced CMOS Circuits

NEW adder cells are useful for designing larger circuits despite increase in transistor count by four per cell.

International Journal of Electronics and Computer Science Engineering 1482

Sequential 4-bit Adder Design Report

Design of Low Power One-Bit Hybrid-CMOS Full Adder Cells

Optimization and Comparison of 4-Stage Inverter, 2-i/p NAND Gate, 2-i/p NOR Gate Driving Standard Load By Using Logical Effort

A Novel Low Power, High Speed 14 Transistor CMOS Full Adder Cell with 50% Improvement in Threshold Loss Problem

CMOS Binary Full Adder

Module 4 : Propagation Delays in MOS Lecture 22 : Logical Effort Calculation of few Basic Logic Circuits

Design of Energy Efficient Low Power Full Adder using Supply Voltage Gating

ECE124 Digital Circuits and Systems Page 1

The MOSFET Transistor

Design and analysis of flip flops for low power clocking system

Gates, Circuits, and Boolean Algebra

LOW POWER DUAL EDGE - TRIGGERED STATIC D FLIP-FLOP

10 BIT s Current Mode Pipelined ADC

NTE2053 Integrated Circuit 8 Bit MPU Compatible A/D Converter

HIGH SPEED AREA EFFICIENT 1-BIT HYBRID FULL ADDER

ISSCC 2003 / SESSION 13 / 40Gb/s COMMUNICATION ICS / PAPER 13.7

ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path

1. True or False? A voltage level in the range 0 to 2 volts is interpreted as a binary 1.

CHAPTER 11: Flip Flops

Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology

CHARGE pumps are the circuits that used to generate dc

Analog & Digital Electronics Course No: PH-218

INSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad

CMOS Logic Integrated Circuits

CMOS Thyristor Based Low Frequency Ring Oscillator

Here we introduced (1) basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices.

Gates & Boolean Algebra. Boolean Operators. Combinational Logic. Introduction

LOW POWER MULTIPLEXER BASED FULL ADDER USING PASS TRANSISTOR LOGIC

ECE 410: VLSI Design Course Introduction

Digital to Analog Converter. Raghu Tumati

Title : Analog Circuit for Sound Localization Applications

CD4001BC/CD4011BC Quad 2-Input NOR Buffered B Series Gate Quad 2-Input NAND Buffered B Series Gate

Design of Four Input Buck-Boost DC-DC Converter for Renewable Energy Application

MM74HC4538 Dual Retriggerable Monostable Multivibrator

LAB 7 MOSFET CHARACTERISTICS AND APPLICATIONS

Analysis and Design of High gain Low Power Fully Differential Gain- Boosted Folded-Cascode Op-amp with Settling time optimization

Advanced VLSI Design CMOS Processing Technology

Design Verification and Test of Digital VLSI Circuits NPTEL Video Course. Module-VII Lecture-I Introduction to Digital VLSI Testing

Design of a Fully Differential Two-Stage CMOS Op-Amp for High Gain, High Bandwidth Applications

A high Speed 8 Transistor Full Adder Design using Novel 3 Transistor XOR Gates

The 74LVC1G11 provides a single 3-input AND gate.

CD4013BC Dual D-Type Flip-Flop

CHAPTER 3 Boolean Algebra and Digital Logic

Performance of Flip-Flop Using 22nm CMOS Technology

Field-Effect (FET) transistors

CD4027BC Dual J-K Master/Slave Flip-Flop with Set and Reset

A New Programmable RF System for System-on-Chip Applications

Lecture 5: Gate Logic Logic Optimization

4-bit binary full adder with fast carry CIN + (A1 + B1) + 2(A2 + B2) + 4(A3 + B3) + 8(A4 + B4) = = S1 + 2S2 + 4S3 + 8S4 + 16COUT

Automated Switching Mechanism for Multi-Standard RFID Transponder

Micro-Step Driving for Stepper Motors: A Case Study

Two-Phase Clocking Scheme for Low-Power and High- Speed VLSI

MADR TR. Single Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. V1. Functional Schematic. Features.

Introduction to CMOS VLSI Design

Module 7 : I/O PADs Lecture 33 : I/O PADs

Sequential Logic: Clocks, Registers, etc.

VENDING MACHINE. ECE261 Project Proposal Presentaion. Members: ZHANG,Yulin CHEN, Zhe ZHANG,Yanni ZHANG,Yayuan

Class 11: Transmission Gates, Latches

A Practical Guide to Free Energy Devices

HCF4028B BCD TO DECIMAL DECODER

McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures

RF Energy Harvesting Circuits

5V Tolerance Techniques for CoolRunner-II Devices

MADR TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. 4. Functional Schematic. Features.

Verification & Design Techniques Used in a Graduate Level VHDL Course

CD4027BMS. CMOS Dual J-K Master-Slave Flip-Flop. Pinout. Features. Functional Diagram. Applications. Description. December 1992

Quad 2-input NAND Schmitt trigger

Op-Amp Simulation EE/CS 5720/6720. Read Chapter 5 in Johns & Martin before you begin this assignment.

Thermal Antenna for Passive THz Security Screening System and Current- Mode Active-Feedback Readout Circuit for Thermal Sensor

HEF4011B. 1. General description. 2. Features and benefits. 3. Ordering information. 4. Functional diagram. Quad 2-input NAND gate

A New Low Power Dynamic Full Adder Cell Based on Majority Function

+5 V Powered RS-232/RS-422 Transceiver AD7306

AN IMPROVED DESIGN OF REVERSIBLE BINARY TO BINARY CODED DECIMAL CONVERTER FOR BINARY CODED DECIMAL MULTIPLICATION

CMOS Power Consumption and C pd Calculation

HCF4001B QUAD 2-INPUT NOR GATE

. HIGH SPEED .LOW POWER DISSIPATION .COMPATIBLE WITH TTL OUTPUTS M54HCT27 M74HCT27 TRIPLE 3-INPUT NOR GATE. tpd = 9 ns (TYP.

Fault Modeling. Why model faults? Some real defects in VLSI and PCB Common fault models Stuck-at faults. Transistor faults Summary

VLSI Design Verification and Testing

Product Datasheet P MHz RF Powerharvester Receiver

Triple single-pole double-throw analog switch

Low-power configurable multiple function gate

LTC Channel Analog Multiplexer with Serial Interface U DESCRIPTIO

MADR TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators. Functional Schematic. Features. Description. Pin Configuration 2

HCC/HCF4027B DUAL-J-K MASTER-SLAVE FLIP-FLOP

8-channel analog multiplexer/demultiplexer

HIGH SPEED-10 MBit/s LOGIC GATE OPTOCOUPLERS

CD4001BC/CD4011BC Quad 2-Input NOR Buffered B Series Gate Quad 2-Input NAND Buffered B Series Gate

CD4027BM CD4027BC Dual J-K Master Slave Flip-Flop with Set and Reset

HCF4056B BCD TO 7 SEGMENT DECODER /DRIVER WITH STROBED LATCH FUNCTION

CD40174BC CD40175BC Hex D-Type Flip-Flop Quad D-Type Flip-Flop

AC-DC Converter Application Guidelines

Introduction to Digital System Design

e.g. τ = 12 ps in 180nm, 40 ps in 0.6 µm Delay has two components where, f = Effort Delay (stage effort)= gh p =Parasitic Delay

Transcription:

Design Analysis of XOR Gates Using CMOS & Pass Transistor Logic Pooja Singh 1, Rajesh Mehra 2 2 Research Scholar, 1 Professor, ECE Dept. NITTTR,Chandigarh Abstract-This paper compares two different logic styles based on 45 nm technology for implementing logic gates of upto two inputs in terms of their layout area, delay and power dissipation. The XOR gate has been implemented & designed using CMOS & Pass Transistor logic on 45 nm technology.the schematic of proposed gate has been designed & simulated by using DSCH3& its equivalent layout has been developed &analysed using micro wind software. The result of computation shows that pass transistor logic can provide very high speed but in terms of area CMOS technology is superior to pass transistor based design. Keywords- XOR logic gate, 45nm technology, CMOS & pass transistor logic. I. INTRODUCTION Active power and passive power are two major parameters for performance analysis of a device, active power is 2 proportional to V dd and leakage power is proportional to V dd, therefore ultra-low power logic circuits can be achieved by simply reducing power supply voltage (V). A lot of work has been done in order to accommodate t logic circuits operating at low supply voltage(v dd ) V dd scaling is, However, obstructed by the minimum operating voltage (V ddmin ) of CMOS logic gates. [1]. V dd(min) is the minimum supply voltage that a logic circuit can tolerate without any damage & with increase in logic gates and CMOS technology down scaling becomes possible, this can achieved by varying channel length of transistors in such a way that for achieving ultra-low power (< 0.4 V) logic circuits V dd(min) is reducedwith transistor channel length ranging from 25 nm to 40 nm in size (25 to 40 billionth of a meter), i.e, 45 nm technology which is truly a nanotechnology. For more details table 2 of [2] can be referred, that shows reduction in supply voltages with appropriate changes in channel length. So many famous technologies like 90 nm, 65 nm, 45 nm etc. are currently in working state. In this paper, performance of CMOS-XOR and PTL XOR based on 45 nm technology is compared. In VLSI (Very large scale integration) implementation, major problems are heat dissipation and power consumption. To solve these problems it is required to reduce power supply voltage, switching frequency and capacitance of transistor [3].Area, delay and power dissipation have emerged as the major concerns of designers. The gate delay depends on the capacitive load of the gate. The dominant term in power dissipation of CMOS circuits is the power required to charge or discharges the capacitance in the circuit. Thus, by reducing capacitance we can decrease the circuit delay and power dissipation. Capacitance is in turn a function of logic cells being used in the design. [4].In this paper, comparison of CMOS technology & Pass transistor logic based on 45 nm technology is done by analysing these different techniques with the help of XOR gate. Section I represents a brief introduction about the trends in the field of chip designing and various terminologies used in the paper. II. LOGIC TYPES The latest technology used for constructing integrated circuits is Complementary metal oxide semiconductor (CMOS). The technology is being used in various digital and analogy logic circuits such as image sensors (CMOS sensor), data converters, and highly integrated transceivers for many types of applications. Logical representation of CMOS is shown in figure 1. Fig. 1. Logic diagram of CMOS. It is also known as complementary-symmetry metal oxide semiconductor (COSMOS) because it uses complementary and symmetrical pairs of both p& n type semiconductor field effect transistor.two important characteristics of CMOS devices are highnoise immunity and low static power consumption. Since one transistor of the pair is always off, the series combination draws significant power for short duration of time only while switching between on and off states. Also, CMOS devices produce lesser heat in comparison to other forms of logic, e.g., PMOS or NMOS logic. The main reason which made CMOS the most used technology to be implemented in VLSI chips is that, it allows large number of logic functions on a chip. Pooja Singh and Rajesh Mehra ijesird, Vol. I(I) July 2014/ 21

Another technology used by logic device manufacturers for designing integrated circuit with even lesser number of transistors than CMOS is Pass transistor logic (PTL).In PTL input is given to both gate and source /drain terminals.these circuits act as switches and uses pair of NMOS and PMOS transistor called Transmission gate & the width of PMOS is taken equal to NMOS so that both transistors can pass the signal simultaneously. Figure 2 shows symbol of pass transistor logic.when g = 0,gb=1 Switch is open &when g=1, gb=0 Switch is closed. So when g=1 : if input is 0 then output will be weak 0 and if input is 1 then output will be strong 1. g a b gb Fig. 2 Pass transistor logic III. XOR SCHEMATIC &DESIGN A 2 input XOR gate is designed by using CMOS on MICROWIND/ DSCH3. Figure 3.shows schematic of XOR using CMOS. Fig. 3 Schematic of XOR using CMOS logic Timing diagram of proposed 2 input CMOS XOR is shown in Fig. 5 It logically verifies the different states of the circuit. Timing simulation is performed at schematic design. Table 1. Function of XOR A B XOR 0 0 0 0 1 1 1 0 1 1 1 0 Fig 4 Timing diagram of XOR using CMOS logic Pooja Singh and Rajesh Mehra ijesird, Vol. I(I) July 2014/ 22

Similarly, schematic of a 2 input XOR gate designed by using Pass transistor on MICROWIND/ DSCH3 is shown in Figure 5. supply voltage. Layout design of proposed XOR gates using two different technologies is shown in following figures (7 & 8). Regular layout style is used in order to simplify the overall geometry and the signal routing. Layout occupies the area of 18.8µm 2 for CMOS based XOR & 29µm 2 for Pass transistor based XOR at 45 nm technology shown in Figure 7 & Figure 8 respectively, which shows layout for the proposed design of logic function & simulation results of proposed designs are shown in Figure 9& figure 10. Fig. 5. Schematic of XOR using pass transistor. Timing diagram of proposed 2 input Pass transistor XOR is shown in Figure 6. It also logically verifies the different states of the circuit. Timing simulation is performed at DSCH3 Fig.7 Layout of 45 nm based CMOS XOR gate Fig. 6 Timing diagram of XOR using pass transistor Both the schematics of XOR will work according to the given description in section I & will provide output that is a function of logic XOR. IV. LAYOUT & SIMULATION: In this section, the performance ofxor logic gate based on CMOS & Pass transistor is evaluated by comparing theirdifferent parameters. All the simulations have been done using Micro wind 3.1 CAD tool[5]. All the Layouts are designed using 45-nm technology with a 0.4 to1.8v Pooja Singh and Rajesh Mehra ijesird, Vol. I(I) July 2014/ 23

Fig.8 Layout of Pass transistor XOR gate. Time domain representation of Layout simulations is shown in figure 9 & figure 10. Logic 0 corresponds to a zero voltage and logic 1 corresponds to 0.4 V. Fig 10 Layout Simulation of Pass transistor logic XOR gate. V. RESULTS & COMPARISON: XOR logic gate based on CMOS & Pass transistor logic is designed on 45 nm technology and compared with each other in terms of various parameters. Simulated results are shown in table 2. Table 2. Comparison of simulation results S.no. Parameters CMOS Pass Transistor 1. Width of layout 6.1 µm 6.5µm 2. Height of layout 3.1 µm 4.6 µm 3. Surface area of 18.8µm 2 29.7µm 2 layout 4. Propagation delay 75 ps 19 ps 5. Power dissipation.002 mw.003 mw 6. No. of transistors 12 14 required Fig. 9 Layout Simulation of CMOS XOR gate. VI. CONCLUSION: Both pass transistor logic devices and CMOS technology based devices have their own benefits. The result of Pooja Singh and Rajesh Mehra ijesird, Vol. I(I) July 2014/ 24

computational comparison shows that pass transistor logic can provide 74.6 % improvement in speed and 57.4% increment in area, therefore acquire more space. Thus, applications where high speed is required PTL based devices are used but applications where size of the chip is priority, CMOS based designs may be preferred. REFERENCES [1] Tadashi Yasufuku1, Satoshi Iida1, Hiroshi Fuketa1, Koji Hirairi2, Masahiro Nomura2, Makoto Takamiya1, and Takayasu Sakurai1, Investigation of Determinant Factors of Minimum Operating Voltage of Logic Gates in 65-nm CMOS, IEEE, pp 21-26,November, 2011. [2] Etienne Siard, Syed Mahfuzzel Aziz, Introducing 45 nm technology in microwind3, pp. 1, 2011. [3] Richa Singh and Rajesh Mehra, power efficient design of multiplexer using adiabatic logic, International Journal of Advances in Engineering & Technology, pp 247-254,March. 2013. [4] RakeshMehrotra, MassoudPedramXunwei Wu, Comparison between nmos Pass Transistor logic style vs. CMOS Complementary Cells, IEEE,pp130-135, October 15, 1997. [5] Hsiao-EnChang, Juinn-Dar Huang, Chia-I Chen, Input Selection encoding for Low Power Multiplexer Tree, IEEE Conference on VLSI Design Automation and Test, pp. 1-4, 25-27 April 2007. Pooja Singh and Rajesh Mehra ijesird, Vol. I(I) July 2014/ 25