Layout of Analog CMOS Integrated Circuit

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F. Maloberti Layout of Analog CMOS Integrated Circuit Part 2 Transistors and Basic Cells Layout 1

Outline Introduction Process and Overview Topics Transistors and Basic Cells Layout Passive components: Resistors, Capacitors System level Mixed-signal Layout 2

Part II: Transistor and Basic Cell Layout Transistors and Matched Transistors Layout of a single transistor Use of multiple fingers Interdigitated devices Common Centroid Dummy devices on ends Matched interconnect (metal, vias, contacts) Surrounded by guard ring Design for Layout Stacked layout of analog cells Stick diagram of analog cells Example 1: two stages op-amp Example 2: folded cascode 3

Single Transistor Layout A CMOS transistor is the crossing of two rectangles, polysilicon and active area but, we need the drain and source connections and we need to bias the substrate or the well Polysilicon gate diffusion 4

Source and Drain Connections Ensure good connections Multiple contacts or one big contact? 5

Multiple or single contacts? Curvature in the metal layer can lead to micro-fractures Not important for large areas Reliability problems, possible electro-migration 6

Multiple contacts: Exercise Consider the following design rules: minimum contact 0.5 µ spacing contact-contact 0.4 µ minimum grid strep 0.1 µ spacing contact diffusion 0.6 µ Estimate the number of contacts and their spacing for W=50 µ W=52 µ W=60 µ 7

Matching single Transistors Regular (rectangular shape) the W and L matter!! Parallel elements silicon is unisotropic Possibly, the current flowing in the same direction 8

Asymmetry due to Fabrication An MOS transistor is not a symmetrical device. To avoid channeling of implanted ions the wafer is tilted by about 7. 7 Shadowed region Source and drain are not equivalent 9

Parasitics in Transistors Analog transistors often have a large W/L ratio W L D Capacitance diffusion substrate C SB = CDB = ( W + 2ldiff )( LD + 2ldiff ) Resistance of the poly gate R gate = LgateRsq, poly 10

Use of multiple fingers S D W ' ' C SB; C DB D S W/2 W/3 S D 2 ' C SB = C SB 3 D 1 C SB = CDB; CDB = 2 C ' DB S D 2 ' C DB = C DB 3 11

Parasitic in Transistors: Exercise Calculate the parasitic capacitance diffusionsubstrate for a 40 micron width transistor one finger 5 finger 8 finger Use the design rules available and minimum diffusion length 12

Interdigitated Devices Two matched transistors with one node in common spilt them in an equal part of fingers (for example 4) interdigitate the 8 elements: AABBAABB or ABBAABBA 1 2 2 A A B B A A B B A B B A A B B A 3 1 1 3 A B F. Maloberti - Layout of Analog CMOS 2IC 3 13

Axis of Symmetries Common axis of symmetry Axis of symmetry of device A Axis of symmetry of device B Common axis of symmetry A B B A A B A B A B A (A) (B) (C) 14

Interdigitiation Patterns A AA AAA AAAA AB* ABBA ABBAAB* ABABBABA ABC* ABCCBA ABCBACBCA* ABCABCCBACBA ABCD* ABCDDCBA ABCBCADBCDA* ABCDDCBAABCDDCBA ABA ABAABA ABAABAABA ABAABAABAABA ABABA ABABAABABA ABABAABABAABABA ABABAABABAABABAABABA AABA* AABAABAA AABAAABAAABA* AABAABAAAABAABAA AABAA AABAAAABAA AABAAAABAAAABAA AABAAAABAAAABAAAABAA Note: not all the patterns permit a stacked layout 15

Interdigitated Transistors: Exercises Sketch the layout of two interdigitated transistors having W 1 =3W 2 and split W 2 into 4 fingers. M 1 and M 2 have their source in common. Sketch the layout of three interdigitized transistors having the same width. Use the optimum number of fingers. The three transistors have the source in common. 16

Common Centroid DA DB DA DB DB DA DB DA Gradients in features are compensated for (at first approximation) metal and poly interconnections are more complex 17

Common Centroid Arrays A B A B B A B A B A A B Cross coupling Tiling (more sensitive to high-order gradients) 18

Common Centroid Patterns ABBA ABBAABBA ABBAABBA ABBAABBA BAAB BAABBAAB BAABBAAB BAABBAAB ABBAABBA BAABBAAB ABBAABBA ABA ABAABA ABAABA ABAABAABA BAB BABBAB BABBAB BABBABBAB ABAABA BABBABBAB ABAABAABA ABCCBA ABCCBAABC ABCCBAABC ABCCBAABC CBAABC CBAABCCBA CBAABCCBA CBAABCCBA ABCCBAABC CBAABCCBA ABCCBAABC AAB AABBAA AABBAA AABBAA BAA BAAAAB BAAAAB BAAAAB AABBAA BAAAAB AABBAA 19

Dummy Devices on Ends Ending elements have different boundary conditions than the inner elements -> use dummy b d Dummies are shorted transistors Remember their parasitic contribution! s 20

Matched interconnections Specific resistance of metal lines Specific resistance of poly Resistance of metal-contact Resistance of via ΔV = Z int I Minimize the interconnection impedance Achieve the same impedance in differential paths Keep short the width of fingers for high speed applications 21

Matched Metal Connection 22

Waffle Transistor S Minimum capacitance drain-substrate and source-substrate D W not accurate L not well defined To be used in wide transistors whose aspect ratio is not relevant 23

Part II: Transistor and Basic Cell Layout Transistors and Matched Transistors Layout of a single transistor Use of multiple fingers Interdigitated devices Common Centroid Dummy devices on ends Matched interconnect (metal, vias, contacts) Surrounded by guard ring Design for Layout Stacked layout of analog cells Stick diagram of analog cells Example 1: two stages op-amp Example 2: folded cascode 24

Stacked Layout Systematic use of stack or transistors (multi-finger arrangement) Same width of the fingers in the same stack, possibly different length Design procedure Examine the size of transistors in the cell Split transistors size in a number of layout oriented fingers Identify the transistors that can be placed on the same stack Possibly change the size of non-critical transistors Use (almost) the same number of finger per stack place stacks and interconnect 25

Stick Representation (one transistor) s EVEN ODD d d s d s d s d s d Ending drain S/D ending s d s d s d s d s 26 Ending source D/S ending

Multi-transistor Stick Diagram M1 1 2 M2 3 M3 4 1 2 3 Same width 1 2 1 2 3 2 3 4 3 4 4 2 1 2 3 4 M1 double 2 3 M1 M2 M3 1 4 3 4 3 2 1 2 3 4 3 3 4 3 2 1 2 1 2 3 4 3 M3 M2 M1 M2 M3 27 M3 M2 M1 M2 M3

Example 1 (2 stages OTA) Assume to layout a two stages OTA 30 M3 M4 30 M1 M2 60 60 M5 40 108 M6 72 M7 Width only are shown; Compensation network and bias are missing (!) 28

Layout Oriented Design 30 M3 M4 30 108 M6 M1 M2 60 60 72 M5 40 M7 M3, M4, M6 M1, M2 M5, M7 Only width matters Possible stacks: 1 p-channel, 2 n-channel change the size of M6 and M7 to 80 and 120 respectively Width of each finger? We want the same number of fingers per stack (k). W p1 = 180/k W n1 =120/k W n2 =120/k for M3 and M4 use 2 fingers 29

Stack Design and Interconnections M1 M6 M3 D3 M4 O1 M6 M2 2 M3 M4 D3 M1 M2 6 CS 6 M5 4 2 O1 M6 8 VDD OUT 8 M7 GND M7 M5 M7 First attempt of interconnections (not completed) 30

Use of one Metal Layer VDD VDD M3 M4 O1 M3 D3 M1 CS M4 M2 O1 M6 OUT CS M1 M2 OUT M5 M7 GND M5 M5 GND Use metal for carrying current! Poly connections are not a problem (usually) 31

Stick Layout: Exercise Draw the stick diagram of the two stages OTA in the following three cases: fingers of M6 and M7 all together M6 =90 M7=60 M1 and M2 in a common centroid arrangement 32

From Stick to Layout Input-Output Well and its bias Substrate bias Compensation Bias voltage Bias current VDD Rectangular shape System oriented cell layout Related cells with same height Vdd and GND crossing the cell In and Out properly placed GND 33

Example 2 (Folded Cascode) MP 20 30 30 M4 Only Ws are shown M3 M5 60 60 M6 M1 M2 80 80 38 M7 38 M8 MN 16 M11 16 M9 25 25 M10 34

Split of Transistors 20 30 30 MP 2 M3 3 3 M4 M5 M6 MN 16 2 M1 M2 80 80 M11 16 2 6 6 60 60 5 5 40 40 M7 M8 38 3 3 M9 M10 25 24 24 35

Stack Design MP 2 MN 2 M4 3 3 M3 10x2 M1 M2 M11 2 M6 M5 6 6 5 5 M8 M7 M9 M10 3 3 555555344PP334666666 11221122112211221122 22112211221122112211 777779xxoo99nno88888 X=11; o=10 36

Interconnection: Exercise Sketch the source-drain interconnections of the folded-cascode 37

Basic Cell Design: check-list Draw a well readable transistor diagram Identify critical elements and nodes Absolute and relative accuracy Minimum parasitic capacitance Minimum interference Mark transistors that must match Mark symmetry axes Analyze transistor sizing (W s) Possibly, change transistor size for a layout oriented strategy Group transistors in stacks Define the expected height (or width) of the cell Sketch the stick diagram transistors of the same type in the same region Foresee room for substrate and well biasing substrate bias around the cell well-bias surrounding the well Define the connection layer for input-output (horizontal, vertical connections) Begin the layout now!! 38