Embedded Systems Design: A Unified Hardware/Software Introduction. Chapter 1: Introduction

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Transcription:

Hardware/Software Introduction Chapter 1: Introduction 1

Outline Embedded systems overview What are they? Design challenge optimizing design metrics Technologies Processor technologies IC technologies Design technologies 2

Embedded systems overview Computing systems are everywhere Most of us think of desktop computers PC s Laptops Mainframes Servers But there s another type of computing system Far more common... 3

Embedded systems overview Embedded computing systems Computing systems embedded within electronic devices Hard to define. Nearly any computing system other than a desktop computer Billions of units produced yearly, versus millions of desktop units Perhaps 50 per household and per automobile Computers are in here... and here... and even here... Lots more of these, though they cost a lot less each. 4

A short list of embedded systems Anti-lock brakes Auto-focus cameras Automatic teller machines Automatic toll systems Automatic transmission Avionic systems Battery chargers Camcorders Cell phones Cell-phone base stations Cordless phones Cruise control Curbside check-in systems Digital cameras Disk drives Electronic card readers Electronic instruments Electronic toys/games Factory control Fax machines Fingerprint identifiers Home security systems Life-support systems Medical testing systems Modems MPEG decoders Network cards Network switches/routers On-board navigation Pagers Photocopiers Point-of-sale systems Portable video games Printers Satellite phones Scanners Smart ovens/dishwashers Speech recognizers Stereo systems Teleconferencing systems Televisions Temperature controllers Theft tracking systems TV set-top boxes VCR s, DVD players Video game consoles Video phones Washers and dryers And the list goes on and on 5

Some common characteristics of embedded systems Single-functioned Executes a single program, repeatedly Tightly-constrained Low cost, low power, small, fast, etc. Reactive and real-time Continually reacts to changes in the system s environment Must compute certain results in real-time without delay 6

An embedded system example -- a digital camera CCD Digital camera chip A2D CCD preprocessor Pixel coprocessor D2A lens JPEG codec Microcontroller Multiplier/Accum DMA controller Display ctrl Memory controller ISA bus interface UART LCD ctrl Single-functioned -- always a digital camera Tightly-constrained -- Low cost, low power, small, fast Reactive and real-time -- only to a small extent 7

Design challenge optimizing design metrics Obvious design goal: Construct an implementation with desired functionality Key design challenge: Simultaneously optimize numerous design metrics Design metric A measurable feature of a system s implementation Optimizing design metrics is a key challenge 8

Design challenge optimizing design metrics Common metrics Unit cost: the monetary cost of manufacturing each copy of the system, excluding NRE cost NRE cost (Non-Recurring Engineering cost): The one-time monetary cost of designing the system Size: the physical space required by the system Performance: the execution time or throughput of the system Power: the amount of power consumed by the system Flexibility: the ability to change the functionality of the system without incurring heavy NRE cost 9

Design challenge optimizing design metrics Common metrics (continued) Time-to-prototype: the time needed to build a working version of the system Time-to-market: the time required to develop a system to the point that it can be released and sold to customers Maintainability: the ability to modify the system after its initial release Correctness, safety, many more 10

Design metric competition -- improving one may worsen others lens CCD Performance Digital camera chip A2D JPEG codec DMA controller CCD preprocessor Power NRE cost Microcontroller Pixel coprocessor Size D2A Multiplier/Accum Display ctrl Expertise with both software and hardware is needed to optimize design metrics Not just a hardware or software expert, as is common A designer must be comfortable with various technologies in order to choose the best for a given application and constraints Hardware Memory controller ISA bus interface UART LCD ctrl Software 11

Time-to-market: a demanding design metric Revenues ($) Time (months) Time required to develop a product to the point it can be sold to customers Market window Period during which the product would have highest sales Average time-to-market constraint is about 8 months Delays can be costly 12

Losses due to delayed market entry Peak revenue Simplified revenue model Product life = 2W, peak at W Revenues ($) Market rise On-time Peak revenue from delayed entry Market fall Time of market entry defines a triangle, representing market penetration Delayed Triangle area equals revenue Loss D On-time Delayed entry entry W Time 2W The difference between the ontime and delayed triangle areas 13

Losses due to delayed market entry (cont.) Area = 1/2 * base * height Peak revenue On-time = 1/2 * 2W * W Revenues ($) Market rise On-time Peak revenue from delayed entry Market fall Delayed = 1/2 * (W-D+W)*(W-D) Percentage revenue loss = (D(3W-D)/2W 2 )*100% Delayed Try some examples D On-time Delayed entry entry W Time 2W Lifetime 2W=52 wks, delay D=4 wks (4*(3*26 4)/2*26^2) = 22% Lifetime 2W=52 wks, delay D=10 wks (10*(3*26 10)/2*26^2) = 50% Delays are costly! 14

NRE and unit cost metrics Costs: Unit cost: the monetary cost of manufacturing each copy of the system, excluding NRE cost NRE cost (Non-Recurring Engineering cost): The one-time monetary cost of designing the system total cost = NRE cost + unit cost * # of units per-product cost = total cost / # of units = (NRE cost / # of units) + unit cost Example NRE=$2000, unit=$100 For 10 units total cost = $2000 + 10*$100 = $3000 per-product cost = $2000/10 + $100 = $300 Amortizing NRE cost over the units results in an additional $200 per unit 15

NRE and unit cost metrics Compare technologies by costs -- best depends on quantity Technology A: NRE=$2,000, unit=$100 Technology B: NRE=$30,000, unit=$30 Technology C: NRE=$100,000, unit=$2 total c ost (x1000) $200,000 A B $160,000 C $120,000 $80,000 $40,000 per product cost $200 A B $160 C $120 $80 $40 $0 $0 0 800 1600 2400 0 800 1600 2400 Number of units (volume) But, must also consider time-to-market Number of units (volume) 16

The performance design metric Widely-used measure of system, widely-abused Clock frequency, instructions per second not good measures Digital camera example a user cares about how fast it processes images, not clock speed or instructions per second Latency (response time) Time between task start and end e.g., Camera s A and B process images in 0.25 seconds Throughput Tasks per second, e.g. Camera A processes 4 images per second Throughput can be more than latency seems to imply due to concurrency, e.g. Camera B may process 8 images per second (by capturing a new image while previous image is being stored). Speedup of B over S = B s performance / A s performance Throughput speedup = 8/4 = 2 17

Three key embedded system technologies Technology A manner of accomplishing a task, especially using technical processes, methods, or knowledge Three key technologies for embedded systems Processor technology IC technology Design technology 18

Processor technology The architecture of the computation engine used to implement a system s desired functionality Processor does not have to be programmable Processor not equal to general-purpose processor Controller Datapath Controller Datapath Controller Datapath Control logic and State register IR PC Register file General ALU Control logic and State register IR PC Registers Custom ALU Control logic State register index total + Data memory Data memory Program memory Assembly code for: Data memory Program memory Assembly code for: total = 0 for i =1 to General-purpose ( software ) total = 0 for i =1 to Application-specific Single-purpose ( hardware ) 19

Processor technology Processors vary in their customization for the problem at hand Desired functionality total = 0 for i = 1 to N loop total += M[i] end loop General-purpose processor Application-specific processor Single-purpose processor 20

General-purpose processors Programmable device used in a variety of applications Also known as microprocessor Features Program memory General datapath with large register file and general ALU User benefits Low time-to-market and NRE costs High flexibility Pentium the most well-known, but there are hundreds of others Controller Control logic and State register IR PC Program memory Assembly code for: total = 0 for i =1 to Datapath Register file General ALU Data memory 21

Single-purpose processors Digital circuit designed to execute exactly one program a.k.a. coprocessor, accelerator or peripheral Features Contains only the components needed to execute a single program No program memory Benefits Fast Low power Small size Controller Control logic State register Datapath index total + Data memory 22

Application-specific processors Programmable processor optimized for a particular class of applications having common characteristics Compromise between general-purpose and single-purpose processors Features Program memory Optimized datapath Special functional units Benefits Some flexibility, good performance, size and power Controller Control logic and State register IR PC Program memory Assembly code for: total = 0 for i =1 to Datapath Registers Custom ALU Data memory 23

IC technology The manner in which a digital (gate-level) implementation is mapped onto an IC IC: Integrated circuit, or chip IC technologies differ in their customization to a design IC s consist of numerous layers (perhaps 10 or more) IC technologies differ with respect to who builds each layer and when IC package IC source gate oxide channel drain Silicon substrate 24

IC technology Three types of IC technologies Full-custom/VLSI Semi-custom ASIC (gate array and standard cell) PLD (Programmable Logic Device) 25

Full-custom/VLSI All layers are optimized for an embedded system s particular digital implementation Placing transistors Sizing transistors Routing wires Benefits Excellent performance, small size, low power Drawbacks High NRE cost (e.g., $300k), long time-to-market 26

Semi-custom Lower layers are fully or partially built Designers are left with routing of wires and maybe placing some blocks Benefits Good performance, good size, less NRE cost than a fullcustom implementation (perhaps $10k to $100k) Drawbacks Still require weeks to months to develop 27

PLD (Programmable Logic Device) All layers already exist Designers can purchase an IC Connections on the IC are either created or destroyed to implement desired functionality Field-Programmable Gate Array (FPGA) very popular Benefits Low NRE costs, almost instant IC availability Drawbacks Bigger, expensive (perhaps $30 per unit), power hungry, slower 28

Moore s law The most important trend in embedded systems Predicted in 1965 by Intel co-founder Gordon Moore IC transistor capacity has doubled roughly every 18 months for the past several decades 10,000 1,000 Logic transistors per chip (in millions) Note: logarithmic scale 100 10 1 0.1 0.01 0.001 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005 2007 2009 29

Moore s law Wow This growth rate is hard to imagine, most people underestimate How many ancestors do you have from 20 generations ago i.e., roughly how many people alive in the 1500 s did it take to make you? 2 20 = more than 1 million people (This underestimation is the key to pyramid schemes!) 30

Graphical illustration of Moore s law 1981 1984 1987 1990 1993 1996 1999 2002 10,000 transistors 150,000,000 transistors Leading edge chip in 1981 Leading edge chip in 2002 Something that doubles frequently grows more quickly than most people realize! A 2002 chip can hold about 15,000 1981 chips inside itself 31

Design Technology The manner in which we convert our concept of desired system functionality into an implementation Compilation/ Synthesis Libraries/ IP Test/ Verification Compilation/Synthesis: Automates exploration and insertion of implementation details for lower level. System specification System synthesis Hw/Sw/ OS Model simulat./ checkers Libraries/IP: Incorporates predesigned implementation from lower abstraction level into higher level. Behavioral specification RT specification Behavior synthesis RT synthesis Cores RT components Hw-Sw cosimulators HDL simulators Test/Verification: Ensures correct functionality at each level, thus reducing costly iterations between levels. Logic specification Logic synthesis Gates/ Cells Gate simulators To final implementation 32

Design productivity exponential increase 100,000 10,000 1,000 100 10 1 Productivity (K) Trans./Staff Mo. 0.1 0.01 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005 2007 2009 Exponential increase over the past few decades 33

The co-design ladder In the past: Hardware and software design technologies were very different Recent maturation of synthesis enables a unified view of hardware and software Hardware/software codesign Compilers (1960's,1970's) Assembly instructions Assemblers, linkers (1950's, 1960's) Machine instructions Microprocessor plus program bits: software Sequential program code (e.g., C, VHDL) Implementation Behavioral synthesis (1990's) Register transfers RT synthesis (1980's, 1990's) Logic equations / FSM's Logic synthesis (1970's, 1980's) Logic gates VLSI, ASIC, or PLD implementation: hardware The choice of hardware versus software for a particular function is simply a tradeoff among various design metrics, like performance, power, size, NRE cost, and especially flexibility; there is no fundamental difference between what hardware or software can implement. 34

Independence of processor and IC technologies Basic tradeoff General vs. custom With respect to processor technology or IC technology The two technologies are independent General, providing improved: Generalpurpose processor ASIP Singlepurpose processor Customized, providing improved: Flexibility Maintainability NRE cost Time- to-prototype Time-to-market Cost (low volume) Power efficiency Performance Size Cost (high volume) PLD Semi-custom Full-custom 35

Design productivity gap While designer productivity has grown at an impressive rate over the past decades, the rate of improvement has not kept pace with chip capacity 10,000 100,000 1,000 10,000 Logic transistors per chip (in millions) 100 10 1 IC capacity Gap 1000 100 10 Productivity (K) Trans./Staff-Mo. 0.1 0.01 productivity 1 0.1 0.001 0.01 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005 2007 2009 36

Design productivity gap 1981 leading edge chip required 100 designer months 10,000 transistors / 100 transistors/month 2002 leading edge chip requires 30,000 designer months 150,000,000 / 5000 transistors/month Designer cost increase from $1M to $300M 10,000 100,000 1,000 10,000 Logic transistors per chip (in millions) 100 10 1 IC capacity Gap 1000 100 10 Productivity (K) Trans./Staff-Mo. 0.1 0.01 productivity 1 0.1 0.001 0.01 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005 2007 2009 37

The mythical man-month The situation is even worse than the productivity gap indicates In theory, adding designers to team reduces project completion time In reality, productivity per designer decreases due to complexities of team management and communication In the software community, known as the mythical man-month (Brooks 1975) At some point, can actually lengthen project completion time! ( Too many cooks ) 1M transistors, 1 designer=5000 trans/month Each additional designer reduces for 100 trans/month So 2 designers produce 4900 trans/month each 60000 50000 40000 30000 20000 10000 43 Team 16 15 16 19 18 24 23 Months until completion Individual 0 10 20 30 40 Number of designers 38

Summary Embedded systems are everywhere Key challenge: optimization of design metrics Design metrics compete with one another A unified view of hardware and software is necessary to improve productivity Three key technologies Processor: general-purpose, application-specific, single-purpose IC: Full-custom, semi-custom, PLD Design: Compilation/synthesis, libraries/ip, test/verification 39