Lasers for Use in Medical Device Manufacturing and Microelectronics Device Manufacturing

Lasers for Use in Medical Device Manufacturing and Microelectronics Device Manufacturing Mark Keirstead Market Development Manager Coherent, Inc Santa Clara Headquarters

Coherent - The Photonics Company Provider of Photonics Solutions Primarily Lasers for Commercial and Scientific Research Applications Founded in 1966 HQ in Santa Clara, CA. Factories and Service Centers worldwide Public Company: Nasdaq: COHR ~ $800M / year revenue ~ 2,500 employees worldwide Sales 23% U.S. and 77% International Approximately 429 Patents, 156 Pending Note: Photonics is the Merger of Lasers, Optics and Electronics Source: Company management as of 10/1/11 Superior Reliability & Performance Jan 17th, 2013 P. 2

Coherent ~ Full Spectrum of Laser Technologies Direct Diode DPSS & OPSL Solid State CO 2 (nm) 200 300 800 900 1000 10 m THz Diode-pumped Solid State Excimer CO 2 Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 3

Extensive Pulse Width & Peak Power Portfolio Peak Power Pulsed ~500 femtosec(100khz 600kHz) : kw Cold Ablative process:- Very high h precision i Pulsed ~10picosec (100kHz 600kHz) : Rapid, Talisker Cold Ablative process:- Silicon Dicing, Glass Scribing, OLED repair, >20 kw Pulsed 1-20nsec (100kHz 1MHz) : Daytona, Helios Mostly Ablative process, Low-k and Silicon Dicing, Glass Scribing, Thin Film Ablation Pulsed 30-80nsec (100kHz - 300kHz) : DPSS (Avia, Matrix), Excimer, Wide variety. Thermal/Ablative processes, Scribing, Thin Film Ablation, Via Drilling and UV Flex Cutting, LTPS & Semi Annealing, Marking, Drilling and Scribing Continuous (CW or QCW): OPS, Direct Diode, Verdi and Paladin Thermal processes:- Cutting, Frit Welding, Soldering, Laser Doping, Annealing, Resist Exposure / LDI. Precision Throughput Time Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 4

Motivation for Shorter Wavelengths Infrared Green UV Typically at Shorter wavelengths : Stronger absorption in many materials Shallower penetration depth Less heat affected zone HAZ Reduced damage to surrounding materials, or structures Smaller focal spot possible Longer depth of focus Localized removal with less power Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 5

Burst Mode Technology Platform for Ultra-Fast Lasers Oscillator 50MHz Switch Transient Amplifier 2MHz Transient-amplifier architecture: large average power (100W) modular design high repetition rate (up to 2MHz) Oscillator open switch longer 50MHz Switch Transient ta Amplifier 2MHz Bursts of pulses with 20ns separation significant increase in ablation rate can lead to better surface quality Superior Reliability & Performance P. 6

Burst Machining of Silicon Max. ablation rat te [mm³/mi in] 20 18 16 14 12 10 8 6 4 2 0 6 pulses/burst 4 pulses/burst 2 pulses/burst 1 pulse/burst Si 200 400 600 800 1000 Pulse Repetition Frequency [khz] 200µ m 50µm high rep. rate + burst: 14x removal rate constant average power of 50W effective ablation rate: > 15 mm 3 /min Superior Reliability & Performance P. 7

Lasers in Medical Device Manufacturing Superior Reliability & Performance P. 8 12/14/2010

Wire Stripping of wires, cables & coils Exposing the underlying metal surface of a coated wire for further joining steps Creating electrodes used for sensing or precise vascular or lesion ablation Where used: Cardiac rhythm management devices e.g. pacemakers Electrophysiology ablation devices e.g. atrial fibrillation Embolic protection and guide catheters Neuromodulation devices stimulating the spinal cord or brain RF ablation probes used in arthroscopy and spine procedures Materials: Platinum, silver coated copper, alloys, Nitinol Wire coating materials (5µm-1mm thick): Fluoropolymers ETFE, PTFE, PFA Polyimide PET Silicone Superior Reliability & Performance 12/14/2010 P. 9

Wire Stripping Self Bonding wire Stripped with Matrix UV @ 500mm/s and 2 passes Wire stripping with Diamond C-30 CO2 laser Courtesy of: Control Microsystems Superior Reliability & Performance P. 10

Surface Structuring Colchea - Implants Hip & Knee Implants Functional surfaces on medical implants improve acceptance in the bone or prevent tissue growth, depending if the implant remains in the body or is removed later. Creation of spikes makes only neuronal cells grow on hearing implants. Micro-scale surface texturing may be effective in improving osseointegration. Patterns include micro-grooves, dimple patterns, moguls, sinusoidal patterns, and similar 3D surfaces Superior Reliability & Performance 6/10/2014 P. 11

Surface Structuring Coronary stents creating drug reservoirs Balloons texturing helps improve traction between the balloon and arterial wall Catheters may help increase balloon adhesion to catheter shaft Minimally invasive surgery may improve the growth of connective tissue with polymer implants Spinal fusion fine laser texturing of metal components may be advantageous versus less controllable bead blasting or additive coatings Balloon Surface Screw Surface Superior Reliability & Performance P. 12 12/14/2010

Glass marking with Helios green Traditional methods: etching, deep engraving & inside marking NEW: diffractive marking for medical industry without micro cracing. Superior Reliability & Performance 6/10/2014 P. 13

Ophthalmology Blade Atomic Edge TM Pre-shape blade with ps-pulses Edge quality comparison Metal Diamond Atomic Edge TM Silicon blade has sharpness of diamond d at cost more similar il to metal. Superior Reliability & Performance P. 14

Point of care diagnostics Kiss Cutting of medical spacers with additional laser perforations for easy part separation Laser cut and kiss-cut pressure sensitive test strips Laser cut microfluidic channels prior to lamination. Laser kiss-cutting and perforating were added d to create the final parts. A biosensor sample and laser processed component layers Superior Reliability & Performance P. 15

Drilling of medical components Holes as small as 5µm in drug eluting balloons Drug delivery in arteries as alternative to stents. Advantage in areas with high fatigue stress i.e. below the knee. Large rectangular opening in tubing for e.g. glucose monitor sensors Superior Reliability & Performance P. 16 12/14/2010

Blood Sugar Sensor Structures 40mm x 10mm 300 Hz 60m/min 150 pieces per sec Superior Reliability & Performance P. 17

Laser Direct Patterning 100nm Au on Polymer Reel-to-Reel (continuous feed) production system Single laser shot ablation High Productivity Feature size: 15µm Superior Reliability & Performance P. 18

Lasers in Microelectronics Manufacturing Superior Reliability & Performance P. 19 12/14/2010

Why Use Lasers?? Material Selective Wavelength can be absorbed selectively Localized thermal effects controlled (low) thermal budget Non-contact processes less expensive consumables Light can be focused within or through transparent materials at interfaces between materials to mark, ablate, lift-off or weaken (used in thin film solar, stealth dicing, glass cutting, flap cutting, laser lift off etc) High Precision UV Laser light can be tightly focused to create very small feature sizes with resolution down to micrometers or less Ultra short pulses with high peak intensities can be used to ablate material/features that cannot be cut with any blade/drill Feature depth control on nanometer scale Light scattering can be used to detect nm features or defects Scalability / Productivity / Lower Costs High throughput laser processes reduce costs Large substrates e.g. G8 glass Fewer process steps Eco-Friendly No Wet Chemistry Laser drilled/machined d/ d Ink Jet nozzle with ih tiny flow channel Courtesy: LEXMARK Stealth Diced Sapphire Wafer pseclaser pulses are focusedinside crystal Superior Reliability & Performance April 24, 2012 P. 20

Smartphone Submodules and Technologies Integrated Circuit Manufacturing 28 / 22 nm Lithography @ 193nm Annealing / Activation Laser Dicing Logic Memory Advanced Packaging MEMS Multi-layer pcb Camera Via drilling Singulation Laser Direct Imaging 3D Integration TSV, TGV MEMS, MOEMS Battery Structuring Welding Bonding Engraving Multi-Layer PCB RF, GPS Back Cover Battery. Back LightGuidePlate with HB-LED Glass substrate with p-si TFT Matrix Light Diffusor RGB Color Filter Polarizer Cover Glass Polarizer Liquid Crystal Reflector Cell Module Prism Sheet LED Backlight Unit Bonded PCB - display driver Active Matrix LCD Display Touch-Screen Front LCD. Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 21

Smartphone Submodules and Technologies Laser Crystallization at poly-silicon, LTPS Glass (FRIT) Welding Film Cutting Laser Direct Patterning Thin Film Ablation Glass cutting Thin, curved Strengthened glass Laser-Lift-Off Laser Induced Thermal Imaging Marking Serialization Design, Decoration Repair Backplane, Array, Cell, CF, OLED OLED Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 22

Packaging Trends Die estacking Package stacking package on package Through Mold Via TMV Wafer-on-wafer Through silicon vias Glass and silicon interposers Embedded devices / components Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 23

Device Singulation Low-k patterned wafer scribing =355nm, 25µJ, 200kHz Sub 28nm node wafers Thin wafer dicing For 3D stacked memory etc Sapphire scribing High brightness LEDs Talisker-355nm picosecond pulses result in lower HAZ for thin silicon dicing. Avia 33W UV Q-Switched DPSS Laser Deployed in 24/7 Manufacturing Conventional diamond wheel saw Laser saw Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 24

Laser Via Drilling HDI Multi-layer Rigid PCBs Flex PCBs IC Substrates Dielectric Buried Laser Via Blind Laser Via Plated Through Via Mech. Drilled Copper Planes PCB Core Staggered Laser Via Buried Mech. Via Stacked Laser Via (filled) Multi-Layer Printed Circuit Board showing Via Structures 1000s of Coherent CO2 and UV lasers installed in high volume manufacturing worldwide Coherent Avia UV DPSS Laser Designed Specifically for Via Drilling Coherent Diamond E-400 Series Laser Designed Specifically for Via Drilling Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 25

Glass and Silicon Interposers Superior Reliability & Performance Jan April 17th, 24, 2012 2013 P. 26

Picosecond Micromachining Holes in glass Glass drilling 200µm 355nm 10µJ High quality edges Depth >200µm Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 27

Drilling Glass Wafers with UV-Bursts Entrance side: 26 µm diameter 500 µm thick 30 10 µm diam. percussion 20 holes/second Exit side: ~ 10 µm Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 28

Many Laser Applications in Display Manufacturing Cutting, Scribing Glass, sapphire, substrates, metal Film cutting, polarizer Laser Crystallization ti for LTPS Glass Welding and Frit Sealing Thin Film Patterning Selective Ablation of SiNx, SiO 2, Moly, ITO, TCO`s, metals Touch Sensor Patterning Laser Induced Thermal Transfer RGB OLED Patterning Laser Lift-Off of Flexible Displays Laser Repair LCD, OLED, Color Filter Selective ablation on array- (open) / deposition (close) / removal / blackening of sub-pixel on CF Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 29

Display Technology - Thinner Stronger Glass Thinner Glass Image quality Lightweight Stronger- Durable [mm] 0.5 2 1 PDP LCD Strengthened glass GORILLA, DRAGONTAIL.. 0.1 mobile Cover Glass One-Glass Solution Touchsensor Bezel free o Laser cutting is advantageous for thin glass Stylish Design o o o Debris Free and Minimal Cracks Maintains glass strength Can follow curves and contours Rounded corner o Advanced laser processes enable the cutting Notches, holes of fully strengthened glass Curved glass o New processes minimize i i post processing Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 30

Filament Cutting Brute Force Cutting ps-laser based filaments Debris Stress Field Microcracks perforate material Superior Reliability & Performance April 24, 2012 P. 31

Filament Cutting Early experiments in the Kaiserslautern apps lab in 2008 led to experimental demonstration of filaments in glass Peter Herman, University of Toronto improves technique to show cutting Abbas Hosseini refines technique to cut strengthened glass in 2010 Papers in the Sowiet Union demonstrated glass cutting with filaments in 1994 Superior Reliability & Performance April 24, 2012 P. 32

Laser Cutting of Display Glass Full body cut with CO2 crack propagation Scribe and Break with DPSS nsec or ps-laser Full ablative cutting - ps-laser, green, UV Filament Cutting - Single pass with psec laser Filaments extend through glass After breaking glass has laser-ground surface No MICROCRACKS surface mark or debris Excellent bend strength High speed achievable Contoured or curved cuts possible CO2 Heat then quench crack propagation Technique single pass Gorilla XG, 700 µm, cut at 500 mm/sec filament defect curtain Filament Cutting Technique using Green psec Laser Superior Reliability & Performance Jan 17th, 2013 P. 33

Cutting Home Position Button Holes Down to 5mm diameter Glass pops out Superior Reliability & Performance April 24, 2012 P. 34

Excimer Laser Annealing for Advanced Displays Laser-based crystallization is the only industrially proven method to form highly-uniform LTPS films for displays 20+ years commercial experience in LTPS All TOP manufacturers of LTPS Displays use ELA! More than 200 LTPS systems installed by Coherent A Billion of Brillant Displays each Year! Galaxy S5 5 FHD 443ppi, AMOLED LG G3 55 QHD 5.5 LCD 534ppi, IPS LCD iphone 5 4.0 Retina 326ppi IPS LCD Superior Reliability & Performance April 24, 2012 P. 35

Mobile Displays Low Temp Poly Silicon High resolution o displays with brilliant color, o lower power consumption o and integrated touch-panel are enabled by LTPS AM-LCD AM-OLED Flexible Display Active Matrix comprises of Thin Film Transistors (TFT) Low Temperature Poly-Silicon (LTPS) provides high electron mobility enabling small TFT leaving a large aperture pixel stable TFT driving current of emissive AMOLED CMOS driver integration to provide highest ppi To provide Brilliant highest resolution displays Low power consumption Sleek form factor a-si p-si Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 36

Transforming a-si into poly-si Excimer Laser Anneal High Power Excimer Laser VYPER (1.2 kw, 2 Joule/pulse 600Hz 308nm) UV Optical System highly uniform thin line beam Top hat, <1% uniformity, rms (e.g. 750mm length x 0.4mm width) Excimer Laser Annealing (ELA) Highly uniform p-si grains a-si is re-crystallized to poly-si by a highly uniform line beam of pulsed UV Excimer laser irradiation Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 37

Expansion of ELA into Large Scale LTPS Production Expanding large scale production 20,000,000 sqm by Y2015 Large glass, G5.5 G8 High power Productivity it Line beam system Excimer laser Annealing Chamber System Layout G5.5 VYPER Laser with Line Beam 750mm Gen5.5 substrate 5 substratewith 7 displayssource: Samsung Smartphones: AMLCD, AMOLED, Flex OLED Superior Reliability & Performance April Jan 24, 17th, 2012 2013 P. 38

Power and Stability Roadmap 3000 2500 Laser Power and Stability 15 1.5 1.25 laser pow wer / Watt 2000 1500 1000 1 0.75 0.5 s energy sta ability / rm 500 0.25 0 2004 2006 2008 2010 2012 2014 0 power energy stability Poly. (power) Poly. (energy stability) UV Laser Power up to 2.4 kw shipped; up to 3.6 kw demonstrated Excellent energy stability of is a key advantage of our excimer Superior Reliability & Performance April 24, 2012 P. 39

Laser Lift-Off Process with Temporary Glass Carrier Flexible Display prototype: YOUM by Samsung AMOLED + Electrophoretic LLO of flexible AMOLED, 85µm Source: Philips laser lift-offff freestanding flexible display ser La Facilitates transition from rigid to flexible mass production Same processing equipment as for glass based display production Superior Reliability & Performance April 24, 2012 P. 40

Ablation process control Excimer ablation allows us to control many things Side-wall Angle Control (WPR5100): Higher fluence: Steeper wall-angle angle Lower fluence: Shallow wall-angle Wall angles to < 85º Depth Control - by No. of Pulses: Each pulse removes a certain amount of material Etch-rate = material removed/pulse With a known etch-rate the number of pulses to reach a desired depth can be predicted and controlled ~65º ~81º Selective Excimer Stop Layers: Metal pads >1µm thick are a Stop Layer 4 Superior Reliability & Performance April 24, 2012 P. 41

Seed metal removal - excimer A means to laser remove or pattern metal seed layers < 600nm thick over organic materials. Dry etch approach Quickly pattern or blanket remove Selective material removal Precise and very accurate patterning to ~4µm Extremely fast patterning single pulse ablation (1/300 second) Precious metal can be reclaimed 4 2µm L/S Ablated 50nm Au on PET Ablated 30nm Palladium on PET Superior Reliability & Performance P. 42

Video courtesy SUSS Microtec Superior Reliability & Performance P. 43 12/14/2010

Polymer ablation - excimer Ablation of thousands of 9µm vias and high rates of speed. (Repeated matrix of vias over a GEN 3.5 substrate) A means ablate precise patterns in polymers Direct etch versus more costly, multi-step approaches (photo/wet) Throughput not feature complexity dependent Etch uniform 3D structures Ablate up to a 50 x 50mm field areas Precise/Accurate patterning mask based Ablate with minimal i HAZ Selective material removal Precisely stop on specific layers (eg: > 1µm thick Cu, Al, etc ) Vias as small as ~1-2µm Nozzles, medical aerosol, flex circuits What is required for Excimer ablation? Material must absorb in the UV range (248nm or 308nm) 1µm vias in 25µm thick PI 4 5µm Via in ~5µm thick 15µm thick WPR5100 dielectric Via inside RDL structure Superior Reliability & Performance P. 44

ELP300 Excimer Stepper Technical Characteristics SUSS MicroTec s ELP300 Gen2 Laser System is based on a platform first introduced in 1987 and is the latest t HVM system for 200 / 300 mm wafer processing. System is focused on applications for both WLCSP, FOWLP & 3D IC. Standard system spec s are as shown. 4 Superior Reliability & Performance P. 45

ELP600* Excimer Stepper Technical Characteristics *Next Generation ELP600 planned for 2015. Prior generation systems shown in pictures to the right 4 Superior Reliability & Performance April 24, 2012 P. 46

Coherent Applications Center a world of expertise Macro to Micro Demonstrate Feasibility Help customers converge quickly on the best laser choice Services that can save our customers $thousands in resources Above: CFRP cleaning with UV lasers Left: Cladding demonstrations Superior Reliability & Performance April 24, 2012 P. 47

Coherent Applications Center a world of expertise 8 Laboratory Locations Worldwide Germany - Excimer Santa Clara Most Coherent Products including CO2, Solid State, kw-class Fiber Lasers, 8000W direct diode, Ultra-Fast (ps/fs) 20 Engineers on staff with a broad range of expertise Flexible Workstations, Marking Tools, Cutting Tools, Vision Systems Multi-axis i linear motion Robotic beam delivery (cladding, hardening) High Speed Galvo Scanners (IR to UV) Optical examination Flexible beam delivery for optimized processing Superior Reliability & Performance April 24, 2012 6/10/2014P. 48

What Next? Market Drivers PROCESS SPEED.... Scaling power / Pulse Energy PROCESS COST.... Reduction in CapEx and OpEx Laser Enablers ENVIRONMENT.... Continue challenging chemical based processes BROADEN APPLICATION SPACE... Example laser annealing/recrystallization Superior Reliability & Performance April 24, 2012 P. 49

Thank you Dr. Gupta and distinguished audience Superior Reliability & Performance 6/10/2014 P. 50