Dynamic & Proto Circuits Inc. Corporate Presentation

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1 Dynamic & Proto Circuits Inc. Corporate Presentation 1

2 DAPC Facility 54,000 Sq.ft./6,000 Sq.M 2

3 Multilayer Process 3

4 Solder Mask Options BLUE BLACK RED GREEN DRY FILM CLEAR 4

5 Investing in Technology New equipment to optimize our production and delivery capabilities 5

6 SES Line The spray system on the Strip-Etch-Strip line offers a high etching quality with high etching factor and the nozzle control system ensures uniform etching patterns without "puddle effects". The transport system is flexible to allow for all PCB thicknesses from 2 to 250 mils. Chemistry is automatically maintained at optimum performance levels. 6

7 AOI Automated Optical Inspection CAMTEK Inspectify mode of operation enables the inspection and verification of both sides of circuit panels at a single workstation; hence, the Orion becomes an independent inspection and verification cell that saves both footprint and handling time providing immediate feedback to the production line. 7

hence, the Orion becomes an independent inspection and verification cell that saves

8 High Speed / Small Hole N/C Drilling Equipment The Schmoll Drilling machines have 6 (six) stations per drilling machine and allow DAPC to be more efficient in drilling panels with a large volume of vias at a rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil. This greatly enhances the efficiency of high mix low volume production and mass production quantities of printed circuit boards. 8

rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil.

9 Mass VCP-5001 Via Plugging Machine This machine is designed to fill holes in printed circuit boards with conductive or non-conductive paste. The hole filling can be performed with through-hole vias and blind vias. The machine is equipped with a full vacuum chamber and heated heads to ensure reliable via filling for the most demanding aspect ratios and a glass cover for visual quality control on both panel sides. 9

The hole filling can be performed with through-hole vias and blind vias.

10 Soldermask Coater The DP-1500 applies all types of liquid photoimageable coatings, including soldermask, primary image, dielectric, and legend. This versatile machine incorporates more than eight years of experience of dual-sided coating with many new features designed to reduce cycle time, increase yields and improve process reliability. 10

This versatile machine incorporates more than eight years of experience of dual-sided

11 HASL Machine The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced. 11

available. Argus International has been designing, building and operating HASL systems for over a decade.

12 IST Tester PWB Interconnect Solutions Inc. is an advanced technology company which offers a revolutionary method for assessing the quality of printed circuit boards (PCB). Their patented interconnect stress test (IST) technology has the unique ability to identify the presence and severity of post separation of both the plated through hole (PTH) and vias within multilayer PCBs. IST technology offers significant advantages over traditional test methods while providing microsection analysis with precise fault locations. 12

Their patented interconnect stress test (IST) technology has the unique ability to identify the presence and severity of post

13 Schmid Deburr/Hole Cleaning The Schmid Deburr Line provides industry leading surface deburring and hole cleaning with up to 3000 psi water pressure for cleaning even the smallest holes. Boards are cleaned with high pressure air, scrubbing brushes, ultrasonics and rotating high pressure water to ensure surface and hole cleanliness prior to immersion copper. 13

14 Technology Roadmaps Materials and Manufacturing Capabilities 14

15 Technology Roadmap Attribute Standard Advanced 2012 Minimum Line Spacing, Internal Layer / / /0.003 Minimum Line/Spacing, External Layer / / /0.003 Minimum drilled hole size Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1 Land Size Internal (Diameter over Drill) Land size External (Diameter over Drill) No Connect (Diameter over Drill) Plated Hole Tolerance ±.003 ± ± Minimum Laser Via Hole N/A N/A.004 Laser Via Aspect Ratio N/A N/A 1.5:1 Laser Via Land Size (Diameter Over Drill) N/A N/A Minimum Dielectric Thickness Minimum core Thickness Maximum PCB Thickness Thickness Tolerance (%) Maximum Board Dimensions 16.5 x x x22.5 Bow And Twist (Through Hole) % Bow And Twist (SMT) % Minimum Conductor to Edge Layer-To-Layer Registration Tolerance Component Pitch Soldermask Clearance Soldermask Dams Impedance Tolerance (>50 Ohms) % ± 10 ± 5 ± 3 Maximum layers Maximum Copper Weight Internal (oz.) Maximum Copper Weight External (oz.)

020 0.016 0.015 Plated Hole Tolerance ±.003 ± 0.002 ± 0.002 Minimum Laser Via Hole N/A N/A.004 Laser Via Aspect Ratio N/A N/A 1.5:1 Laser Via Land Size (Diameter Over Drill) N/A N/A 0.

16 Technology Roadmap continued Attribute Standard Advanced 2012 Materials FR4 High Tg FR4 (170C..) BT Epoxy Polyimide Teflon Duroid RoHS Compliant Materials Isola FR408 Nelco N Heatsink Manufacturing and Lamination Via Construction Through Hole Blind (Mechanical) Sequential Lamination Buried (Mechanical) Blind Laser No No Surface Finish ENIG OSP White Tin HASL Electrolytic Nickel/Gold Silver Quality System MIL-P MIL-PRF ISO-9001:2000 AS9100B Electrical Test Method Flying Probe 16

Via Construction Through Hole Blind (Mechanical) Sequential Lamination Buried (Mechanical) Blind Laser No No Surface Finish

17 Substrate Materials Standard Material Supplier/Material Type Tg (.C) Dielectric 1 MHZ Dissipation Factor CTE-Z Axis CTE-X & Y Axis FR-4 Nelco N PPM PPM Hi-Temp FR-4 Nelco N PPM PPM Modified FR-4 Isola FR Typ <55 PPM PPM Modified FR-4 Nelco N PPM PPM Hi-Temp FR4 Panasonic R-1755V PPM PPM Hi-Temp FR4 Isola IS PPM PPM High Temperature Materials Material Supplier/Material Type Tg (.C) Dielectric 1 MHZ Dissipation Factor CTE-Z Axis CTE-X & Y Axis BT-Epoxy Isola G PPM PPM Cyanate Ester Nelco N PPM 12 PPM Polyimide Nelco N7000-2V PPM 13 PPM 17

009 35 PPM 10-14 PPM Hi-Temp FR4 Panasonic R-1755V 180 4.4 0.015-0.022 45 PPM 10-14 PPM Hi-Temp FR4 Isola IS410 180 4.0 0.015-0.023 65 PPM 11-13 PPM High Temperature Materials Material Supplier/Material Type Tg (.

18 Substrate Materials High Frequency Materials (core material only) Material Supplier/Material Type Dielectric Constant Dissipation Factor CTE-Z Axis CTE-X & Y Axis HASL Finish? Immersion Gold/Tin Finish? TLC Taconic /- 10 GHz 10 GHz TLX Taconic /- 10 GHz 10 GHz RF-35 Taconic 1.9 GHz 1.9 GHz 64 19/24 RT/duroid 6002 Rogers /- 10 GHz 10 GHz 24 16/16 No RT/duroid 5880 Rogers / /48 No RO4003 Rogers /- 10 GHz 10 GHz 46 14/16 RO4350 Rogers /- GHz 10 GHz 50 14/16 RO3006 Rogers /- 10 GHz 10 GHz 24 17/17 Ultralam 2000 Rogers / GHz /9.5 AD Series Arlon 10 GHz 10 GHz 95 12/15 18

9 GHz 64 19/24 RT/duroid 6002 Rogers 2.94 +/- 0.04 @ 10 GHz 0.0012 @ 10 GHz 24 16/16 No RT/duroid 5880 Rogers 2.20 +/- 0.020 0.0009 237 31/48 No RO4003 Rogers 3.38 +/- 0.05 @ 10 GHz 0.

19 North American Top Tier Customers 19

20 Let the DAPC team get started on your project today! 20

Rogers 3003, 3006, 3010, 3035, 3203, 3206, 3210

Rogers 3003, 3006, 3010, 3035, 3203, 3206, 3210 Stocked Materials: RIGID STANDARD FR4 High Tg 170c Black FR4 Polyclad 370HR (Lead Free) HIGH RELIABILITY Polyimide (Arlon 85N, Isola P96) BT (G200) HIGH FREQUENCY: Park Nelco 4000-13, 4000-13si Getek Gore