Laserbearbeitung von dünnen Schichten auf Rolle-zu-Rolle-Anlagen

Transcription

1 Laserbearbeitung von dünnen Schichten auf Rolle-zu-Rolle-Anlagen Dr. Frank Allenstein 3D-Micromac AG

2 3D-Micromac At a Glance 141 employees in R&D, manufacturing and service Worldwide more than 300 industrial installations Since 1994 experience in laser technology Numerous worldwide patents Sales partner for Micromachining products Japan China Hikali KK Süss Microtech (Shanghai) Ltd. Micro Power Semiconductor Ltd. Sanwa Technologies Ltd. Korea Raytec Korea Ltd Taiwan Ascent Technologies Ltd. Superbin Ltd. USA 3D-Micromac America Corp. Sales partner ophthalmic, worldwide Laser 2000 GmbH Sales partner microsintering technology EOS GmbH

3 3D-Micromac microflex Center Move in: May 2012 Construction time: 7 months Office and production area: 2000 m 2 Total invested amount: 3.0 million

4 microflex Evolution 2003: start of R2R process development and web handling 2006: first machine prototype 2010: microflex V1.0 with basic modularity 2011: microflex Rollto-Roll system for the industrial production of RFID antennas 2012: microflex V2.0 with a complex modular setup 2012: microflex R&D line at 3DMM

5 microflex at 3DMM

6 Laser Processing Fixed Optics

7 Laser Processing Scanner

8 Applications Laser Thin-Film Ablation Organic Photovoltaics Laser Thin-Film Ablation OLEDs Summary

9 Laser Thin-Film Ablation Organic Photovoltaics

10 Organic Photovoltaics Ag P3HT : PCBM PEDOT : PSS ITO Substrate light Organic Solar Cell conventional stack layout

11 Experimental Setup laser source beam path 2D scanner f-theta lens 2D-scanner performance parameters Repeatability < 22µrad Tracking error: 0.18 ms Long term drift < 0.6 mrad vacuum exhaust

12 Experimental Setup Laser Sources Laser Wavelength in nm Pulse duration Repetition rate in khz Average power in W Machining speed in mm/s ns laser 1064 ~ 30 ns ps laser 1064/532/355 < 12 ps fs - laser 1024/512 < 500 fs

13 ITO on Glass

14 ns Laser Wavelength λ = 1064 nm ITO layer on glass substrate: Cracks in substrate ITO layer melted ITO layer on PET foil substrate: PET foil massively damaged Huge ITO bulges at the cutting edges microscope image microscope image

15 ps Laser Wavelength λ = 1064 nm Glass substrate DEKTAK image ITO substrate ITO bulge within range of RA ITO nm No heat affected zone No melting of ITO No cracks in substrate Good edge quality Large process window microscope image -120 substrate

16 ps Laser Wavelength λ = 532 nm Glass substrate DEKTAK image ITO substrate ITO bulge within range of RA ITO nm 0-60 Almost no heat affected zone No melting of ITO No cracks in substrate Good edge quality, comparable to 1064 nm microscope image -120 substrate

17 ps Laser Wavelength λ = 355 nm Glass substrate DEKTAK image ITO substrate ITO microscope image bulge between nm ITO nm 0-60 Small heat affected zone No melting of ITO No cracks in substrate Good edge quality -120 substrate microscope image

18 fs Laser Wavelength λ = 1024 nm Glass substrate No bulge Result comparable to ps microscope image SEM microscope

19 ITO on PET Film

20 ps Laser Wavelength λ = 1064 nm PET film substrate (thickness ~50 µm) DEKTAK image microscope image nm No heat affected zone ITO bulge less than 20 nm! 40 Good edge quality substrate ITO ITO 0 Small debris in proximity to the scribed area -40 Large process window microscope image Slight delamination of ITO at the substrate -80 REM microscope cutting edge

21 ps Laser Wavelength λ = 532 nm PET film substrate (thickness ~50 µm) DEKTAK image ITO bulge nm nm 40 Small heat affected zone Average edge quality heat affected zone substrate ITO ITO 0-40 Some debris in and around machining area microscope microscope image image -80 substrate

22 ps Laser Wavelength λ = 355 nm PET film substrate (thickness ~50 µm) Heat affected zone ITO substrate Damaged substrate due to high absorption Low edge quality due to chipping of ITO microscope image

23 fs Laser Wavelength λ = 1024 nm PET-foil substrate (thickness ~50 µm) Minimal damage to PET film Smooth cutting edge No delamination of ITO layer microscope image SEM microscope

24 Conclusions to Scribing of ITO Indium tin oxide λ = 1064 nm excellent scribing quality on both glass and film λ = 532 nm λ = 355 nm good scribes on glass but shows higher bulging on film good scribes on glass but damages foil due to high absorption λ = 1064 nm is to be preferred Best scribing quality on both glass and film High output powers available Relatively inexpensive laser source available ps laser for scribing on glass substrates fs laser for scribing on polymer substrates

25 Applications Laser Thin-Film Ablation Organic Photovoltaics Laser Thin-Film Ablation OLEDs Summary

26 Laser Thin-Film Ablation OLEDs

27 OLED Layout and Scribing P1 Scribe: Isolation cut in back electrode P2 Scribe: Selective ablation of organic stack P3 Scribe: Isolation cut in front contact

28 Experimental Setup laser source beam path 2D scanner f-theta lens 2D-scanner performance parameters Repeatability < 22µrad Tracking error: 0.18 ms Long term drift < 0.6 mrad vacuum exhaust

29 Experimental Setup Laser Source Ultra-short pulse picosecond laser Pulse repetition rate up to 1 MHz Pulse duration < 12 ps Average power up to 50 W (@1064 nm) Wavelengths 1064/532/355 nm

30 P1 Scribe: ps Laser Wavelength λ = 1064 nm Ablation of back contact metal layer not possible without ablation of passivation layer optical microscopy

31 P1 Scribe: ps Laser Wavelength λ = 532 nm surface profile Markspeed mm/s Bulge < 20 nm Selective ablation of metal back contact Almost no debris generated optical microscopy

32 P1 Scribe: ps Laser Wavelength λ = 355 nm Markspeed mm/s ITO Bulge < 50 nm Selective ablation of metal back substrate electrode Smooth cutting edge surface profile optical microscopy

33 P2 Scribe: ps Laser Wavelength λ = 1064 nm Markspeed mm/s No bulge observed Good edge quality Back electrode not fully uncovered surface profile optical microscopy

34 P2 Scribe: ps Laser Wavelength λ = 532 nm Markspeed mm/s Bulge < 10 nm Good edge quality Back electrode fully uncovered surface profile optical microscopy

35 P2 Scribe: ps Laser Wavelength λ = 355 nm Markspeed mm/s Bulge < 10 nm Back electrode fully uncovered Organic stack step wise ablated at surface profile cutting edge optical microscopy

36 P3 Scribe: ps Laser Wavelength λ = 1064 nm Markspeed mm/s Bulge < 20 nm Good edge quality Stepwise ablation of multiple layers surface profile OLED stack not fully ablated optical microscopy

37 P3 Scribe: ps Laser Wavelength λ = 532 nm Markspeed mm/s Bulge < 30 nm Good edge quality OLED stack fully ablated surface profile optical microscopy

38 P3 Scribe: ps Laser Wavelength λ = 355 nm Markspeed mm/s Delamination of brittle metal layer Markspeed mm/s Generation of large bulge (~100 nm) surface profile optical microscopy

39 Conclusions to Laser Scribing of OLEDs with ps-laser P1 Scribe: ps-laser with green wavelength is recommended Maximum achievable machining speed approximately mm/s. P2 Scribe: ps-laser with green wavelength is recommended Maximum achievable machining speed approximately mm/s. P3 Scribe: ps-laser with IR or green wavelength is recommended Maximum achievable machining speed approximately mm/s.

40 Applications Laser Thin-Film Ablation Organic Photovoltaics Laser Thin-Film Ablation OLEDs Summary

41 Summary This looks quite simple, doesn t it? Several things can be learned: 1. There is a difference between the ablation from foil and glass 2. The necessary power (fluence) is usually smaller on foil than on glass And it is getting even more complicated

42 Experiment 1 Three different stacks with identical top layer Experiment with single pulses with a 1064 nm ps-laser Layer to be ablated: always 120 nm thick Fluence

43 Experiment 2 Equal stack with different top layer thicknesses In comparison the layer thickness has only few impact on the other side 120nm 240nm Fluence

44 Vielen Dank für Ihre Aufmerksamkeit! 3D-Micromac AG Technologie-Campus Chemnitz Telefon: / Fax: / info@3d-micromac.com Internet: