Features and enefits Low-noise output Fast power-on time Ratiometric rail-to-rail output 4.5 to 6.0 V operation Solid-state reliability Factory-programmed at end-of-line for optimum performance Robust S performance Packages: 3 pin SOT23W (suffix LH), and 3 pin SIP (suffix U) Not to scale escription The 30 and are continuous-time, ratiometric, linear Hall-effect sensor Is. They are optimized to accurately provide a voltage output that is proportional to an applied magnetic field. These devices have a quiescent output voltage that is 50% of the supply voltage. Two output sensitivity options are provided: 2.5 mv/g typical for the 30, and.3 mv/g typical for the. The Hall-effect integrated circuit included in each device includes a Hall circuit, a linear amplifier, and a MOS lass output structure. Integrating the Hall circuit and the amplifier on a single chip minimizes many of the problems normally associated with low voltage level analog signals. High precision in output levels is obtained by internal gain and offset trim adjustments made at end-of-line during the manufacturing process. These features make the 30 and ideal for use in position sensing systems, for both linear target motion and rotational target motion. They are well-suited for industrial applications over extended temperature ranges, from 40 to 25. Two device package types are available: LH, a 3-pin SOT23W type for surface mount, and U, a 3-pin ultramini SIP for through-hole mount. They are lead (Pb) free (suffix, T) with 00% matte tin plated leadframes. Functional lock iagram V+ V To all subcircuits mp Filter Out VOUT Gain Offset YPSS Trim ontrol GN 30-S, Rev. 7
Selection Guide Part Number Packing* Package mbient, T Sensitivity (Typical) 30U-T ulk, 500 pieces/bag SIP 40º to 85º 30KLHLT-T 7-in. tape and reel, 3000 pieces/reel Surface Mount 2.5 mv/g 40º to 25º 30KU-T ulk, 500 pieces/bag SIP LHLT-T 7-in. tape and reel, 3000 pieces/reel Surface Mount 40º to 85º KLHLT-T 7-in. tape and reel, 3000 pieces/reel Surface Mount.3 mv/g 40º to 25º KU-T ulk, 500 pieces/bag SIP *ontact llegro for additional packing options. bsolute Maximum Ratings haracteristic Symbol Notes Rating Units Supply Voltage V 8 V Output Voltage V OUT 8 V Reverse Supply Voltage V R 0. V Reverse Output Voltage V ROUT 0. V Output Sink urrent I OUT 0 m Range 40 to 85 º Operating mbient Temperature T Range K 40 to 25 º Maximum Junction Temperature T J (max) 65 º Storage Temperature T stg 65 to 70 º 2
Pin-out rawings Package LH Package U 3 2 2 3 Terminal List Symbol Number Package LH Package U escription V onnects power supply to chip VOUT 2 3 Output from circuit GN 3 2 Ground 3
VI HRTRISTIS over operating temperature range, T, and V = 5 V, unless otherwise noted haracteristic Symbol Test onditions Min. Typ. Max. Units lectrical haracteristics Supply Voltage V Running, T J < 65 4.5 6 V Supply urrent I Output open m Output Voltage V OUT(High) I SOUR = m, Sens = nominal 4.65 4.7 V V OUT(Low) I SINK = m, Sens = nominal 0.2 0.25 V Output andwidth W 20 khz V Power-On Time t (min) to 0.95 V OUT; = ±400 G; PO Slew rate = 4.5 V/μs to 4.5 V/00 ns 3 5 μs Output Resistance R OUT I SINK m, I SOUR m 2 5 Ω xternal output low pass filter 0 khz; Wide and Output Noise, rms V OUTN Sens = nominal 50 μv Ratiometry Quiescent Output Voltage rror with respect to V ΔV OUTQ(V) T = 25 ±3.0 % Magnetic Sensitivity rror with respect to V 2 ΔSens (V) T = 25 ±3.0 % Output Linearity Lin T = 25 ±2.5 % Symmetry Sym T = 25 ±3.0 % Magnetic haracteristics Quiescent Output Voltage V OUTQ = 0 G; T = 25 2.4 2.5 2.6 V Quiescent Output Voltage over Operating Temperature Range V OUTQ( T ) = 0 G 2.2 2.8 V Magnetic Sensitivity Sens 30; T = 25 2.0 2.5 3.0 mv/g ; T = 25.0.3.6 mv/g Magnetic Sensitivity over Operating Temperature Range Sens ( T ) Refer to equation (4) in Ratiometric section on page 4. 2 Refer to equation (5) in Ratiometric section on page 4. 30.8 3.2 mv/g 0.85.75 mv/g 4
haracteristic efinitions Quiescent Output Voltage. In the quiescent state (no significant magnetic field: = 0), the output, V OUTQ, equals one half of the supply voltage, V, throughout the entire operating ranges of V and ambient temperature, T. ue to internal component tolerances and thermal considerations, there is a tolerance on the quiescent output voltage, V OUTQ, which is a function of both V and T. For purposes of specification, the quiescent output voltage as a function of temperature, V OUTQ( T ), is defined as: ΔV OUTQ(ΔΤΑ ) V OUTQ(ΤΑ ) V OUTQ(25º) = () Sens (25º) where Sens is in mv/g, and the result is the device equivalent accuracy, in gauss (G), applicable over the entire operating temperature range. Sensitivity. The presence of a south-polarity (+) magnetic field, perpendicular to the branded face of the device package, increases the output voltage, V OUT, in proportion to the magnetic field applied, from V OUTQ toward the V rail. onversely, the application of a north polarity ( ) magnetic field, in the same orientation, proportionally decreases the output voltage from its quiescent value. This proportionality is specified as the magnetic sensitivity of the device and is defined as: Sens = V OUT( ) V OUT(+) The stability of the device magnetic sensitivity as a function of ambient temperature, Sens ( T ) (%) is defined as: 2 Sens (ΤΑ ) Sens (25º) ΔSens (ΔΤΑ ) = 00% Sens (25º) (2) (3) Ratiometric. The 30 and feature a ratiometric output. This means that the quiescent voltage output, V OUTQ, and the magnetic sensitivity, Sens, are proportional to the supply voltage, V. The ratiometric change (%) in the quiescent voltage output is defined as: V OUTQ(V ) V OUTQ(5V) ΔV OUTQ(ΔV) = 00% (4) V 5 V and the ratiometric change (%) in sensitivity is defined as: Sens (V ) Sens (5V) ΔSens (ΔV) = 00% (5) V 5 V Linearity and Symmetry. The on-chip output stage is designed to provide linear output at a supply voltage of 5 V. lthough the application of very high magnetic fields does not damage these devices, it does force their output into a nonlinear region. Linearity in percent is measured and defined as: V OUT(+) V OUTQ Lin+ = 00% (6) 2 (V OUT(+½) V VOUTQ ) V OUT( ) V OUTQ Lin = 2(V OUT( ½) V OUTQ ) 00% (7) and output symmetry as: V OUT(+) V OUTQ Sym = 00% (8) V OUTQ V OUT( ) 5
Typical haracteristics (30 pieces, 3 fabrication lots) Sensitivity (mv/g) 30 evice Sensitivity vs. mbient Temperature 302 evice Sensitivity vs. Temperature 2.65.40.38 2.60 U Package.36 U Package 2.55.34 2.50.32 2.45 LH Package.30.28 LH Package 2.40.26 2.35.24 50 25 0 25 50 75 00 25 50-50 -25 0 25 50 75 00 Temperature ( ) Temperature ( ) 25 50 Sensitivity (mv/g) 2.60 30 evice V OUTQ vs. mbient Temperature 302 evice V OUTQ vs. mbient Temperature 2.60 Output Voltage (V) 2.55 2.50 2.45 Output Voltage (V) 2.55 2.50 2.45 2.40 50 25 0 25 50 75 00 25 50 Temperature ( ) 2.40 50 25 0 25 50 75 00 25 50 Temperature ( ) 30 evice Sensitivity vs. Supply Voltage 302 evice Sensitivity vs. Supply Voltage 3.5.7.6 Sensitivity (mv/g) 3.0 2.5 2.0 Sensitivity (mv/g).5.4.3.2..5.0 ontinued on the next page... 6
Typical haracteristics, continued (30 pieces, 3 fabrication lots) 30 evice V OUTQ vs. Supply Voltage 302 evice V OUTQ vs. Supply Voltage 3.5 3.5 Output Voltage (V) 3.0 2.5 2.0 Output Voltage (V) 3.0 2.5 2.0.5.5 00.4 30 evice LIN+ and LIN vs. Supply Voltage 302 evice LIN+ and LIN vs. Supply Voltage 00.0 00.3 00.2 LIN 99.9 LIN+ Linearity (%) 00. 00.0 99.9 LIN+ Linearity (%) 99.8 99.7 LIN 99.8 99.6 30 evice Symmetry vs. Supply Voltage 302 evice Symmetry vs. Supply Voltage Symmetry (%) 00.0 99.9 99.8 99.7 99.6 99.5 99.4 99.3 99.2 99. 99.0 Symmetry (%) 00.5 00.4 00.3 00.2 00. 00.0 99.9 99.8 99.7 99.6 99.5 7
Package LH, 3-Pin; (SOT-23W) 2.98 +0.2 0.08 3.49 4 ±4 0.80 +0.020 0.053 0.96 2.90 +0.0 0.20.9 +0.9 0.06 0.25 MIN 0.70 2.40.00 2 0.55 RF 0.25 S Seating Plane Gauge Plane 0.95 P Layout Reference View 8X 0 RF randed Face.00 ±0.3 NNT 0.95 S ctive rea epth, 0.28 mm RF 0.40 ±0.0 0.05 +0.0 0.05 For Reference Only; not for tooling use (reference dwg. 802840) imensions in millimeters imensions exclusive of mold flash, gate burrs, and dambar protrusions xact case and lead configuration at supplier discretion within limits shown Standard randing Reference View N = Last two digits of device part number T = Temperature code Reference land pattern layout ll pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and P layout tolerances randing scale and appearance at supplier discretion Hall element, not to scale 8
Package U, 3-Pin SIP Matrix Leadframe 4.09 +0.08 0.05 45 2.04.52 ±0.05 3.02 +0.08 0.05.44 2X0 Mold jector Pin Indent NNT.02 MX 0.5 RF 2 3 randed Face 0.79 RF 45 Standard randing Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code 4.99 ±0.25 0.4 +0.03 0.06 For Reference Only; not for tooling use (reference WG-903) imensions in millimeters imensions exclusive of mold flash, gate burrs, and dambar protrusions xact case and lead configuration at supplier discretion within limits shown ambar removal protrusion (6X) Gate and tie bar burr area ctive rea epth, 0.50 mm RF randing scale and appearance at supplier discretion Hall element, not to scale 0.43 +0.05 0.07.27 NOM Please note that there are changes to the existing U package drawing pending. Please contact the llegro Marketing department for additional information. 9
Package U, 3-Pin SIP onventional Leadframe 4.09 +0.08 0.05 45 2.04.52 ±0.05 3.02 +0.08 0.05 2.6 MX 0.5 RF 2 3.44 randed Face 0.79 RF 45 Mold jector Pin Indent NNT Standard randing Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code 5.75 ±0.5 0.4 +0.03 0.06 For Reference Only; not for tooling use (reference WG-9049) imensions in millimeters imensions exclusive of mold flash, gate burrs, and dambar protrusions xact case and lead configuration at supplier discretion within limits shown ambar removal protrusion (6X) Gate burr area ctive rea epth, 0.50 mm RF randing scale and appearance at supplier discretion Hall element, not to scale 0.43 +0.05 0.07.27 NOM opyright 2005-200, reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to permit improvements in the per for mance, reliability, or manufacturability of its products. efore placing an order, the user is cautioned to verify that the information being relied upon is current. llegro s products are not to be used in life support devices or systems, if a failure of an llegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, assumes no responsibility for its use; nor for any in fringe ment of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com 0