Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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1 Freescale Semiconductor Data Sheet: Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. Features 5.0% Maximum Error over 0 to 85 C Ideally Suited for Microprocessor or Microcontroller-Based Systems Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package Temperature Compensated over -40 to +125 C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations Available in Surface Mount (SMT) or Through-hole (DIP) Configurations MPXV5010 MPVZ5010 Pressure Rev 13, 10/2012 Series 0 to 10 kpa (0 to 1.45 psi) (0 to mm H 2 O) 0.2 to 4.7 V Output Application Examples Hospital Beds HVAC Respiratory Systems Process Control Washing Machine Water Level Measurement (Reference AN1950) Ideally Suited for Microprocessor or Microcontroller-Based Systems Appliance Liquid Level and Pressure Measurement ORDERING INFORMATION Device Name Case No. # of Ports Pressure Type Device None Single Dual Gauge Differential Absolute Marking Unibody Package ( Series) DP 867C DP GP 867B GP GS 867E D GSX 867F D Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 MPXV5010DP MPXV5010G6U 482 MPXV5010G MPXV5010GC6T1 482A MPXV5010G MPXV5010GC6U 482A MPXV5010G MPXV5010GC7U 482C MPXV5010G MPXV5010GP 1369 MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010G6U 482 MPVZ5010G MPVZ5010G7U 482B MPVZ5010G MPVZ5010GW6U 1735 MZ5010GW MPVZ5010GW7U 1560 MZ5010GW , 2012 Freescale Semiconductor, Inc. All rights reserved.
2 Pressure S SURFACE MOUNT MPXV5010GC6U/C6T1 CASE 482A-01 MPXV5010G6U, MPVZ5010G6U CASE MPXV5010DP CASE MPXV5010GP CASE MPVZ5010GW6U CASE S THROUGH-HOLE J MPVZ5010G7U CASE 482B-03 MPXV5010GC7U CASE 482C-03 MPVZ5010GW7U CASE UNIBODY PACKAGES GP CASE 867B-04 DP CASE 867C-05 GS CASE 867E-03 GSX CASE 867F-03 2 Freescale Semiconductor, Inc.
3 Operating Characteristics Pressure Table 1. Operating Characteristics (V S = 5.0 Vdc, T A = 25 C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range P OP kpa mm H 2 O Supply Voltage (1) V S Vdc Supply Current I o madc Minimum Pressure Offset V S = 5.0 Volts Full Scale Output V S = 5.0 Volts Full Scale Span V S = 5.0 Volts Accuracy (5) (0 to 85 C) (0 to 85 C) (0 to 85 C) (0 to 85 C) V off Vdc V FSO Vdc V FSS Vdc 5.0 %V FSS Sensitivity V/P mv/mm mv/mm H 2 O Response Time (6) t R 1.0 ms Output Source Current at Full Scale Output I O+ 0.1 madc Warm-Up Time (7) Offset Stability (8) 20 ms 0.5 %V FSS 1. Device is ratiometric within this specified excitation range. 2. Offset (V off ) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 C. TcSpan: Output deviation over the temperature range of 0 to 85 C, relative to 25 C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 C, relative to 25 C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS, at 25 C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Semiconductor, Inc. 3
4 Pressure Maximum Ratings Table 2. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P max 40 kpa Storage Temperature T stg 40 to +125 C Operating Temperature T A 40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 (SOP) 3 (Unibody) Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry V out 1 (Unibody) 4 (SOP) 2 (Unibody) 3 (SOP) GND Pins 1 and 5 through 8 are NO CONNECTS for small outline package. Pins 4, 5, and 6 are NO CONNECTS for unibody package. Figure 1. Fully Integrated Pressure Sensor Schematic 4 Freescale Semiconductor, Inc.
5 Pressure ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPxx5010G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Fluoro Silicone Gel Die Coat Die Stainless Steel Cap +5 V Wire Bond P1 Thermoplastic Case V s V out OUTPUT Lead Frame IPS 1.0 F 0.01 F GND 470 pf Differential Sensing Element P2 Die Bond Figure 2. Cross-Sectional Diagram SOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Transfer Function (kpa): V out = V S (0.09 P ) ± 5.0% V FSS V S = 5.0 Vdc TEMP = 0 to 85 C 3.0 Output (V) 2.0 MAX TYPICAL 1.0 MIN Differential Pressure (kpa) Figure 4. Output vs. Pressure Differential Freescale Semiconductor, Inc. 5
6 Pressure Transfer Function Nominal Transfer Value: V out = V S x (0.09 x P ) ± (Pressure Error x Temp. Factor x 0.09 x V S ) V S = 5.0 V 0.25 Vdc Temperature Error Band 4.0 Temperature Error Factor Temp Multiplier to Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to 40 C and from 85 to 125 C. Pressure Error Band Pressure Error (kpa) Pressure (kpa) Pressure Error (Max) 0 to 10 (kpa) ±0.5 (kpa) 6 Freescale Semiconductor, Inc.
7 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier DP 867C Side with Part Marking GP 867B Side with Port Attached GS 867E Side with Port Attached GSX 867F Side with Port Attached MPXV5010G6U 482 Stainless Steel Cap MPXV5010GC6U/6T1 482A Side with Port Attached MPXV5010GC7U 482C Side with Port Attached MPXV5010GP 1369 Side with Port Attached MPXV5010DP 1351 Side with Part Marking MPVZ5010G6U 482 Stainless Steel Cap MPVZ5010G7U 482B Stainless Steel Cap MPVZ5010GW6U 1735 Vertical Port Attached MPVZ5010GW7U 1560 Vertical Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads TYP 8X TYP 8X TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) Freescale Semiconductor, Inc. 7
8 Pressure PACKAGE DIMENSIONS -A- -B G D 8 PL 0.25 (0.010) M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. J K S N M C PIN 1 IDENTIFIER H -T- SEATING PLANE INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G BSC 2.54 BSC H J K M N S CASE ISSUE O N B J 5 8 A S V 4 1 G C D 8 PL 0.25 (0.010) M T B S A S W H T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G BSC 2.54 BSC H J K M N S V W K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-0 ISSUE A 8 Freescale Semiconductor, Inc.
9 PACKAGE DIMENSIONS Pressure -A- -B- 5 8 J -T- S N 4 1 G C M D 8 PL 0.25 (0.010) M T B S A S PIN 1 IDENTIFIER DETAIL X K DETAIL X SEATING PLANE NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5 TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX BSC 2.54 BSC CASE 482B-03 ISSUE B N B 5 8 A S 4 1 V G C D 8 PL 0.25 (0.010) M T B S A S PIN 1 IDENTIFIER DETAIL X W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G BSC 2.54 BSC J K M N S V W J M DETAIL X K T SEATING PLANE CASE 482C-03 ISSUE B Freescale Semiconductor, Inc. 9
10 Pressure PACKAGE DIMENSIONS C E -T- A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. V PORT #1 POSITIVE PRESSURE (P1) J -P (0.010) M T D 6 PL 0.13 (0.005) M T P S Q S Q M F G K PIN 1 N S R B DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX BSC 2.54 BSC STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX CASE 867F-03 ISSUE D UNIBODY PACKAGE 10 Freescale Semiconductor, Inc.
11 PACKAGE DIMENSIONS Pressure PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE Freescale Semiconductor, Inc. 11
12 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE 12 Freescale Semiconductor, Inc.
13 PACKAGE DIMENSIONS Pressure PAGE 1 OF 2 CASE ISSUE A Freescale Semiconductor, Inc. 13
14 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE ISSUE A 14 Freescale Semiconductor, Inc.
15 PACKAGE DIMENSIONS Pressure PAGE 1 OF 2 CASE ISSUE B Freescale Semiconductor, Inc. 15
16 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE ISSUE B 16 Freescale Semiconductor, Inc.
17 PACKAGE DIMENSIONS Pressure PAGE 1 OF ISSUE C Freescale Semiconductor, Inc. 17
18 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE ISSUE D 18 Freescale Semiconductor, Inc.
19 PACKAGE DIMENSIONS Pressure PAGE 3 OF 3 CASE ISSUE D Freescale Semiconductor, Inc. 19
20 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE ISSUE B 20 Freescale Semiconductor, Inc.
21 PACKAGE DIMENSIONS Pressure PAGE 2 OF 3 CASE ISSUE B Freescale Semiconductor, Inc. 21
22 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE ISSUE B 22 Freescale Semiconductor, Inc.
23 Table 3. Revision History Pressure Revision number Revision date Description of changes 13 10/2012 Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and MPVZ5010G6U/ 6T1 throughout the document Freescale Semiconductor, Inc. 23
24 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale, the Freescale logo, Energy Efficient Solutions logo, are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Xtrinsic is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners Freescale Semiconductor, Inc. Rev /2012
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