Gedanken zur Zukunft der Elektronik in Europa

Transcription

1 acatech - DEUTSCHE AKADEMIE DER TECHNIKWISSENSCHAFTEN Gedanken zur Zukunft der Elektronik in Europa Dresden, 18. April 2011 Alex Dommann

2 Scope and functionality baseline CMOS memory RF HV Power passives sensors actuators bio, fluidics More Moore More than Moore Compute/storage Sense, Interact, power Digital content Complex Design (SoC) Non-digital content Multi-level hetero Integration (SiP)

3 Smart Systems: combining hybrid technologies MEMS and Smart Sensors Flexible ICs Harvesting and Thin Film Batteries Embedded Software Harvesting Device (PV, Piezo, etc) New Materials: SiC & GaN Sensors Power Management Advanced BCD, BCD- SOI Analog Front End, Back End Energy Storage : Supercap, Flexible Batteries Ultra Low Power Technologies Low Power Digital Processing Wireless Transmission : RF low power, ZigBee, 3D Heterogeneous Integration/ TSV Advanced Packaging & System-in-Package Power Actuators : SiC, GaN, Power Mosfet, IGBT Technologies for System On Chip

4 Much more than technology multi-application / market multi-billion investment multi-design requirement (performance, cost, TtM, reliability) multi-supply chain multi-business model multi-infrastructure GlucoWatch

5 Moving Forward : from traditional to emerging applications Carmelo PAPA Energy, Automation and Healthcare: boosters for Smart System Integration

6 Consumer Markets - Tomorrows Lead Markets Agriculture/ Food Household Wearables Building/ Construction Industrieelektronik/E nergy Integration of electronics is the backbone of highly competetive products

7 Todays Lead Markets Security Medical Automotive Sensing ICT

8 Value Chain Application Sport Transport System Integration Mikro-/Nanoelectronics Agriculture/ Food Medical Hörgerät Lightning Implantate EKG Intelligente Prothesen Blutzuckermessung Engineering Energy Fashion/ Life Style

9 Smart Power Systems: mixing hybrid technologies for energy management An example in Electric Cars Energy Harvesting Autonomous Tire Pressure Sensors Power Conversion & PLC Battery Management Connectivity for Smart Grid Integration Plug-In Systems Photovoltaic Conversion SiC & Power Modules PV Roofs Electric Motor And much more

10 Intelligent systems need a set of aligned technologies Processor & Storage Radio Power Sensor & Actuator More Moore + Beyond Moore More than Moore Heterogeneous Integration + Design Environment + Material & Equipment

11 Embedded Intelligence: combining hardware and software in new application platforms

12 The Evolution of Smart Systems 1st Generation Smart Systems Integrated, miniaturised systems with advanced functionality. Driver Status Monitoring Piezo Injection Valve Object Recognition 2nd Generation Smart Systems Predictive & reactive systems matching harsh environments and equipped with advanced energy management capabilities. Smart Pill Retina implant Simple Artificial Organ 3rd Generation Smart Systems Self aware, autonomous systems interfacing physical w/ vritual world, adaptive to environment, ubiquitously connected, with cognitive abilities Autonomous Bio-Robot Swarming Agent Internet of Things Functions Examples VDI/VDE-IT

13 Material complexity increases exponentially

14 Task Heterogeneous Integration Bridging the Gap between Chip and Application [nm], [µm] Nanostructures to [m] Application

15 Technology Systemintegration Nano Electronics Subsystems (Components) Electronic Systems Electronics nm + Actuators + Sensors + Radio + Power + System Integration + Packaging + Reliability + System Design Application System m Nanostructures Application Semiconductor Electonics Application Industry System Supplier System Provider as well as Bridging the Gap between Large Industries and SMEs

16 MEMS 1 Watch Parts Components for Scientific Instruments TCD Micro-GC Optical MEMS Switches

17 MEMS 2 (Electro)-Chemical Sensing Systems (Amperometric Sensors, ChemFETS, Gas Sensors) Physical Sensing Systems (Accelerometers, Gyroscopes) Biomedical MEMS (Neurophysiologic Mini Laboratory NML)

18 Scanning probe arrays Tip radius ~10nm thin (<2 µm) cantilevers with integrated passivated piezoresistive sensors force sensing performance comparable with best published data

19 Hollow SiO2 cantilevers for nanoscale dispensing Attoliter dispensing 2 μm 20 nm polystyrene particles deposited from glycerol suspension. Fluidic cantilevers formed by direct wafer bonding Tips with FIB etched opening.

20 Situation in Dresden In Sachsen sind rund 280 Unternehmen im Branchenverband Silicon Saxony organisiert

21 Situation in Europe Fraunhofer IZM, Germany IBM Switzerland Infineon Technologies, Germany Global Foundry, Germany NXP, The Netherlands Robert Bosch, Germany STMicroelectronics, Italy/ France LETI, France Thales, France IMEC, Belgium CSEM, Switzerland VTT, Finland

22 Situation in Europa Oliver Wyman

23 Trends in der Fahrzeugelektronik Technologietreiber Assistenzsysteme Sicherheit Komfort Verbrauch W. Wondrak, Micro Car

24 Entwicklungsziele Energieeffizienz Individuelle Mobilität Unfallvermeidung Alternde Gesellschaften GPS-gestützte Betriebsstrategie GPS gestützte Unfallvermeidung Internet im Fahrzeug Minimierung des Energieverbrauchs Energy Harvesting Wärmemanagement Erfassung von Vitalparametern Ermüdungserkennung Fahrerassistenzsysteme Verkehrszeichenerkennung Pre-crash Sensorik Verbesserte Abgasfilterung W. Wondrak, Micro Car 2011

25 Gelber Engel 2011, Innovation und Umwelt Innovationen -durch Elektronik ermöglicht 2 Dynamic Light Assist (Volkswagen) 1 Aktiver Spurhalte / Totwinkel Assistent (Daimler) 3 Berührungslose Spurvermessung (API Leipzig) W. Wondrak, Micro Car 2011

26 ULP Integrated Systems SoC including the icyflex2 µc in 180nm MEMS-based Radio

27 Thank you for your attention! The Xcoder SoC