ESTC2014 September 16-18, 2014 Helsinki, Finland
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1 ESTC2014 September 16-18, 2014 Helsinki, Finland
2 Electronics System-Integration Technology Conference ESTC2014 Helsinki ESTC2008 London ESTC2012 Amsterdam ESTC2010 Berlin ESTC2006 Dresden
3 Electronics System-Integration Technology Conference Track 3D Integration and Embedding Technologies Advanced Technologies for Emerging Systems Assembly and Manufacturing Technology Materials for Interconnects and Packaging MEMS/NEMS Packaging Co-design and Multiphysics System Modeling Optoelectronic Systems Packaging Power Electronic Systems Packaging Printable Electronics Reliability of Electronic Devices and Systems Poster Presentations Chairman Rolf Aschenbrenner, Fraunhofer IZM Klaus-Jürgen Wolter, TU Dresden David Whalley, University of Loughborough Johan Liu, Chalmers University Markku Tilli, Okmetic Torsten Hauck, Freescale Semiconductor Giovanni Del Rosso, GigOptix Thomas Harder, ECPE Jukka Hast, VTT Matthias Petzold, Fraunhofer IWM YC Chan, City Univ. of Hong Kong
4 Program Overview TIME Day 1, Tuesday Sept 16 08:30-12:00 Short course 1 Short course 2 Short course 3 Short course 4 12:00-13:00 Lunch 13:00-15:00 15:00-15:40 Opening, Keynote Oksanen, Keynote Schafbauer, Keynote Tummala Coffee Break and Poster presentations I 15:40-17:45 Emerging 1 Reliability 1 Simulation 1 Interconnect 1 19:00-21:00 Reception at the Helsinki City Hall TIME Day 2, Wednesday Sept 17 08:00-09:40 Emerging 2 Reliability 2 Simulation 2 Interconnect 2 09:40-10:15 Coffee Break and Poster presentations II 10:15-12:20 Power 1 3D Integration_1 Opto 1 MEMS 1 12:20-13:40 Lunch 13:40-15:30 15:30-16:00 Coffee Break and Poster presentations III 16:00-17:40 Power 2 3D Integration_2 Opto 2 MEMS 2 19:00-21:30 Conference Dinner TIME 8:30-10:10 10:10-10:40 Printable and emerging 3D Integration_3 Simulation & Reliability Electromigration 10:40-12:20 Printable 1 Reliability 3 Assembly 1 SLID Bonding 12:20-13:30 Lunch 13:30-15:10 Printable 2 Reliability 4 Assembly 2 Interconnect 3 15:10-15:40 15:40-17:30 Round table on smart system integration for automotive Day 3, Thursday Sept 18 Coffee Break and Poster presentations IV Coffee Break and Poster presentations V Keynote Fischer, Keynote Bauer, closure of the conference
5 Keynotes at ESTC2014 Developing Future Telecom Systems Lauri Oksanen, VP Research and Technology, Nokia Package is a Product Feature Dr. Thomas Schafbauer, Senior Director Development, Infineon Technologies Next Frontier in Electronics: Systems Scaling for Smart and Wearable Systems Prof. Rao Tummala, Georgia Tech The Challenge to design More-than-Moore Systems for Automotive Applications Andreas Fischer, Senior Manager, Robert Bosch
6 Special Sessions Wednesday 17th of September 13:40 15:30: Round table on Smart System Integration for Automotive emobility, Automated and Autonomous Driving, Infotainment What are the technology, quality and security requirements, specifically for smart system integration? What are the consequences for the supply chain? What should be the main topics for the R&D community focusing on integration and reliability technologies to support this overall development? Panelists: Berthold Hellenthal, Head of Progressive Semiconductor Program PSCP, Audi Hannu Laatikainen, Senior Advisor, Murata Electronics Dr. Martin Schrems, Director R&D, ams Moderation: Prof. Matthias Petzold, Deputy Director, Fraunhofer IWM Halle Friday 19th of September 08:30 15:00: Visits to local sensor and MEMS companies and research centres: 09:00 Micronova Nanofabrication centre, 11:00 Murata Electronics 13:00 Vaisala
7 Short courses at ESTC2014 How to Manufacture MEMS, Markku Tilli, Okmetic & Dr. Anssi Blomqvist, Murata Electronics An Introduction to Nanotechnologies in Microelectronics Packaging Prof. James Morris, Portland State University Electro-thermal Simulation of Semiconductor Packages and Assemblies Dr. Torsten Hauck, Freescale Atomic Layer Deposition From Fundamentals to Applications Prof. Mikko Ritala, University of Helsinki & Dr. Tommi Vainio, Beneq Efficient accelerated reliability testing through multiple loading conditions and physics-of-failure viewpoint Dr. Vesa Vuorinen, Aalto University & Dr. Juha Karppinen, Valmet Automotive IC Package Technology Selection and Cost Reduction Using Supply Chain Modeling Chet Palesko, SavanSys Solutions LLC & E. Jan Vardaman, TechSearch International
8 Technical Exhibition The conference hosts a technical exhibition Exhibition hall is centrally located in the direct vicinity of the session halls Space for 17 exhibitors Exhibition schedule: Tuesday September 16: 12:00 18:00 Exhibition Wednesday September 17: 8:00 18:00 Exhibition Thursday September 18: 8:00 15:30 Exhibition Exhibition Hall Technical session hall 1 Technical session hall 2 Technical session hall 3 Technical session hall 4
9 Conference Venue and Social Program Conference Venue Finlandia Hall Reception on Tuesday, City Hall of Helsinki Conference Dinner on Wednesday, Kulosaari Casino
10 Welcome to Helsinki September 16 18, 2014 Mervi Paulasto-Kröckel Toni Mattila Gilles Poupon General Chair Executive Chair Program Chair
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