FRAUNHOFER IZM RESEARCH FOR TOMORROW S PRODUCTS

Transcription

1 FRAUNHOFER IZM RESEARCH FOR TOMORROW S PRODUCTS Name Klaus-Dieter Lang Abteilung Institutsleiter Overview Fraunhofer Gesellschaft 66 institutes 22,000 employees app. 1.9 billion turnover app. 70% contract research Information Technology Light & Surfaces Life Sciences Micro Electronics Production Defense & Security Materials & Components

2 Overview Fraunhofer Group Microelectronics Organization 13 institutes 2,700 employees 307 Mio budget (2011) More than 50% industrial contracts 18% basic funding 32% public projects / other revenues Competencies: Systems - Components - Technologies Business Fields Ambient Assisted Living & Health Energy Efficiency Mobility Smart Living Mission: From Microelectronics and Microsystems towards Smart Systems System Integration Technologies [m] [nm], [µm] Nanodimensions to Final Product Size

3 Mission Fraunhofer IZM Bringing Microelectronics into Application Research Focus Functionality Reliability Application Trends Form Factor Cost

4 Security Clothes for Emergency Staff High Performance 3D-Solarmodule Project: HighCom Assembly and Packaging technologies for for three dimensional bended solar modules with high efficient Si-Solarcells Demonstrator: helmet, P = 1.6 W Working range: -30 C + 60 C

5 Top 10 Breakthroughs of the Year 2012 Science Magazin, Vol Discovery of the Higgs Boson (CERN) 2. Denisovan Genom 3. Genome Engineering 4. Curiosity Landing ATLAS-Pixel-Detector-Module 80 mio 1,7 sqm, more than pixels/module Rapid data retrieval by 40 MHz Chip thickness: 150 μm, Module yield: 97% 5. X-ray Laser Advances against Sleeping Sickness 6. Eggs from Stem Cells 7. Majorana fermions 8. ENCODE-Project 9. Controlling prostheses by micro electrons in the brain 10. Neutrino Mixing Angle Top 10 Breakthroughs of the Year 2012 Science Magazin, Vol Discovery of the Higgs Boson (CERN) 2. Neuronal Interface for Smart Prostheses Denisovan Genom Wireless data and performance transmission, biocompatibility, 3. miniaturization Genome Engineering 4. Bumping of thinned chips, 3D integration (array + low Curiosity power signallanding amplifier), planar coil with ferrite for energy transmission and encapsulation technology 5. X-ray Laser Advances against Sleeping Sickness ATLAS-Pixel-Detector-Module 80 mio 1,7 sqm, more than pixels/module Rapid data retrieval by 40 MHz Chip thickness: 150 μm, Module yield: 97% 6. Eggs from Stem Cells 7. Majorana fermions 8. ENCODE-Project 9. Controlling prostheses by micro electrons in the brain 10. Neutrino Mixing Angle

6 Our Customers and Partners (Selection) Applications Equipment Manufacturers // Material Suppliers FROM IDEA TO PRODUCT WAYS OF COOPERATION NDA/Contract/IP Feasibility Study Research & Development Test Transfer Consulting/ 1 Innovation Workshop 2 Target Specification List System 3 Specification List 4 Functional Model 5 Prototype 6 Manufacturing Few days - 3 month 1 3 month 2-4 month 3-24 month 12 month 3 6 month IP-Research Concept Simulation Realization Reliability Optimization Qualification

7 Invisible, but Indispensable: Application Adapted Multifunctional Electronics Automotive/ Transportation Photonics Medical Engineering Safety & Security Power Electronics 3D Integration Industrial Electronics How to Work with Fraunhofer IZM Industrial Contract Research (e.g. R&D-projects world-wide, feasibility studies, technology & process development) Services for Industry (e.g. demonstrators, prototypes, technology service, equipment, personnel) Technology Transfer (technologies and processes) Strategic Alliances (e.g. packaging manufacturing lines, personnel) Cooperative Projects (funded jointly by public & industrial sources, State, EU) Common Basic Research (with institutes and universities world-wide)

8 European Research Cooperations and Networks ENIAC Joint Technology Initiative (JTI) on Nanoelectronics Domain team Heterogeneous Integration CATRENE Cluster for Application and Technology Research in Europe on NanoElectronics IEEE-CPMT (GC) German Chapter of IEEE-CPMT Platform system packaging and manufacturing challenges EPoSS European Research Platform Smart Systems Integration HTA Heterogeneous Technology Alliance Partners: CEA-Leti, CSEM, VTT, Fraunhofer VμE EURIPIDES Eureka Initiative for Packaging & Integration of μdevices & Smart Systems Research Cooperations in Asia and America UoU University of Utah Development of new universal interface models for implants KAIST Korea Advanced Institute of Science and Technology e.g. Semiconductor 3D Equipment and Materials Consortium ITRI Industrial Technology Research Institute, Taiwan UN-University United Nations University Global Initiative Solving the E- Waste Problem (Step) 50 partners JoiLIT Joint Laboratory IZM/Todai, University of Tokyo Electronic packaging development and ecodesign Asian Office Fraunhofer Representative Office Japan

9 Thank you for your attention! Fraunhofer Institute for Reliability and Microintegration IZM Director Prof. Klaus-Dieter Lang Gustav-Meyer-Allee Berlin Germany Phone URL