MC33375, NCV33375 Series. 300 ma, Low Dropout Voltage Regulator with On/Off Control LOW DROPOUT MICROPOWER VOLTAGE REGULATOR

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1 3 ma, Low Dropout Voltage Regulator with On/Off Control The MC3337 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT3 and SOP. These devices feature a very low quiescent current and are capable of supplying output currents up to 3 ma. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC3337 has a control pin that allows a logic level signal to turnoff or turnon the regulator output. Due to the low inputtooutput voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. Features: Low Quiescent Current (.3 A in OFF mode; A in ON mode) Low InputtoOutput Voltage Differential of mv at I O = ma, and mv at I O = 3 ma Extremely Tight Line and Load Regulation Stable with Output Capacitance of only.33 F for. V Output Voltage Internal Current and Thermal Limiting Logic Level ON/OFF Control NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ Qualified and PPAP Capable These are PbFree Devices LOW DROPOUT MICROPOWER VOLTAGE REGULATOR SOT3 ST SUFFIX CASE 3E SOIC D SUFFIX CASE 7 MARKING DIAGRAMS AYM 37xx A = Assembly Location Y = Year M = Date Code L = Wafer Lot W = Work Week xx = Voltage Version = PbFree Package (Note: Microdot may be in either location) 37xx ALYW On/Off V in Thermal & Antisat Protection ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Rint On/Off Block.3 V V. Ref. K GND This device contains active transistors Figure. Simplified Block Diagram Semiconductor Components Industries, LLC, 3 October, 3 Rev. Publication Order Number: MC3337/D

2 PIN CONNECTIONS Gnd 3 Input Gnd Gnd ON/OFF 3 7 Output Gnd Gnd N/C V in ON/ OFF MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage V CC 3 Vdc Power Dissipation and Thermal Characteristics T A = C Maximum Power Dissipation Case 7 (SOP) D Suffix Thermal Resistance, JunctiontoAmbient Thermal Resistance, JunctiontoCase Case 3E (SOT3) ST Suffix Thermal Resistance, JunctiontoAir Thermal Resistance, JunctiontoCase P D R JA R JC R JA R JC Internally Limited W C/W C/W C/W C/W Output Current I O 3 ma Maximum Junction Temperature T J C Operating Ambient Temperature Range T A to + C Storage Temperature Range T stg to + C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

3 V ELECTRICAL CHARACTERISTICS (C L =. F, T A = C, for min/max values T J = C to + C, Note ) Characteristic Symbol Min Typ Max Unit Output Voltage I O = ma to ma Vdc. V Suffix T A = C, V in = [V O + ] V O.7... V Suffix 3. V Suffix 3.3 V Suffix. V Suffix V Suffix V in = [V O + ] V, < I O < ma. V Suffix % Tolerance from T J = to + C 3. V Suffix 3.3 V Suffix. V Suffix Line Regulation Load Regulation V in = [V O + ] V to V, I O = ma, All Suffixes T A = C V in = [V O + ] V, I O = ma to ma, All Suffixes T A = C Reg line. mv Reg load. mv Dropout Voltage (Note 3) I O = ma T J = C to + C I O = ma I O = ma I O = 3 ma V in V O mv Ripple Rejection ( Hz) V in(peakpeak) = [V O +.] V to [V O +.] V 7 db Output Noise Voltage C L =. F I O = ma ( Hz to khz) C L = F CURRENT PARAMETERS Quiescent Current ON Mode V in = [V O + ] V, I O = ma I QOn A Quiescent Current OFF Mode I QOff.3. A Quiescent Current ON Mode SAT V in = [V O.] V, I O = ma (Notes, ) 3. V Suffix 3.3 V Suffix. V Suffix Current Limit V in = [V O + ] V, V O Shorted I LIMIT ma ON/OFF INPUTS On/Off Input Voltage Logic (Regulator On) = V O ± % Logic (Regulator Off) <.3 V Logic (Regulator Off) <. V (. V Option) THERMAL SHUTDOWN V n I QSAT V CTRL. Thermal Shutdown C. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.. Quiescent Current is measured where the PNP pass transistor is in saturation. V in = [V O.] V guarantees this condition. 3. For. V version V DO is constrained by the minimum input voltage of. V.. For. V and. V versions, I QSAT is constrained by the minimum input voltage of. V...3 Vrms A V 3

4 DEFINITIONS Load Regulation The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops mv below its nominal value (which is measured at. V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. C. The junction temperature is rising while the difference between the input power (V CC X I CC ) and the output power ( X I out ) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: Pd T J T A R JA The maximum operating junction temperature T J is specified at C, if T A = C, then P D can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as: I out P D V V CC out The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature ( C for MC3337) and ambient temperature. R JA T J T A P D

5 V in, INPUT VOLTAGE (V) 7 3 T A = C C L =.7 F I L = ma = 3.3 V V in - TIME ( S) Figure. Line Transient Response - OUTPUT VOLTAGE CHANGE (mv) V in, INPUT VOLTAGE (V) 7 3 T A = C C L = 33 F I L = ma = 3.3 V V in - TIME ( S) Figure 3. Line Transient Response OUTPUT VOLTAGE CHANGE (mv) LOAD CURRENT (ma) C L =. F = 3.3 V T A = C V in =.3 V LOAD CURRENT CHANGE TIME ( S) Figure. Load Transient Response OUTPUT VOLTAGE CHANGE (V) LOAD CURRENT (ma) 3. LOAD CURRENT C L = 33. F = 3.3 V -. - CHANGE T A = C - V in =.3 V TIME ( S) Figure. Load Transient Response OUTPUT VOLTAGE CHANGE (V) 3. 3 OUTPUT VOLTAGE (V) I L = ma I L = ma DROPOUT VOLTAGE (mv) INPUT VOLTAGE (V) I O, OUTPUT CURRENT (ma) Figure. Output Voltage versus Input Voltage Figure 7. Dropout Voltage versus Output Current

6 I MC3337, NCV3337 Series 3 DROPOUT VOLTAGE (mv) - I L = 3 ma I L = ma I L = ma I L = ma I gnd (ma) I L = ma I L = 3 ma I L = ma 3 7 TEMPERATURE ( C) Figure. Dropout Voltage versus Temperature V in (VOLTS) Figure 9. Ground Pin Current versus Input Voltage. (ma) gnd T A ( C) I L = ma I L = ma I L = ma (VOLTS) I O = I O = ma TEMPERATURE ( C) Figure. Ground Pin Current versus Ambient Temperature Figure. Output Voltage versus Ambient Temperature (V in = + V)

7 ..9 I O =.9 (VOLTS) out V...7 I O = ma.7. - TEMPERATURE ( C) Figure. Output Voltage versus Ambient Temperature (V in = V) 7 7 db 3 I L = ma I L = ma db 3 I L = ma I L = ma. FREQUENCY (khz). FREQUENCY (khz) Figure 3. Ripple Rejection Figure. Ripple Rejection. ENABLE VOLTAGE (V) C L =. F C L = 33 F.. 3 TIME ( S) Figure. Enable Transient 7

8 . V Option V OUT, OUTPUT VOLTAGE (V).. I LOAD = ma T A, AMBIENT TEMPERATURE ( C) Figure. Output Voltage versus Temperature V OUT, OUTPUT VOLTAGE (V) V CC, (V) T A = C I LOAD = ma Figure 7. Output Voltage versus Input Voltage Ignd, (ma) T A = C V CC = 3 V 3 3 I Q ( A) T A = C I LOAD = ma 3 I LOAD, (ma) V CC, (V) Figure. Ground Current versus Load Current Figure 9. Quiescent Current versus Input Voltage PSRR (db) 7 3 V CC = 3 V I LOAD = ma T A = C C OUT = F V ENABLE V OUT. f, FREQUENCY (khz) Figure. PSRR versus Frequency V 3 3 t, TIME ( s) Figure. Enable Response

9 V CC = 3 V I LOAD = ma to ma T A = C. V. V.7 V ma ma t, TIME (ms) Figure. Load Transient Response APPLICATIONS INFORMATION ON/OFF Vin MC3337xx C in C out LOAD GND Figure 3. Typical Application Circuit The MC3337 regulators are designed with internal current limiting and thermal shutdown making them userfriendly. Figure is a typical application circuit. The output capability of the regulator is in excess of 3 ma, with a typical dropout voltage of less than mv. Internal protective features include current and thermal limiting. EXTERNAL CAPACITORS These regulators require only a.33 F (or greater) capacitance between the output and ground for stability for. V,. V, 3. V, and 3.3 put voltage options. Output voltage options of. V require only. F for stability. The output capacitor must be mounted as close as possible to the MC3337. If the output capacitor must be mounted further than two centimeters away from the MC3337, then a larger value of output capacitor may be required for stability. A value of. F or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than inches. This will reduce the circuit s sensitivity to the input line impedance at high frequencies. A.33 F or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator s input terminals. Figure shows the ESR that allows the LDO to remain stable for various load currents. ESR (ohm).. Stable Region 3 LOAD CURRENT (ma) Figure. ESR for = 3.V = 3. V C out =. F C in =. F Applications should be tested over all operating conditions to insure stability. 9

10 THERMAL PROTECTION Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold. Thermal limit is not a substitute for proper heatsinking. The internal current limit will typically limit current to ma. If during current limit the junction exceeds C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking. OUTPUT NOISE In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC3337. ON/OFF PIN When this pin is pulled low, the MC3337 is off. This pin should not be left floating. The pin should be pulled high for the MC3337 to operate. R JA, THERMAL RESISTANCE, JUNCTIONTOAIR ( CW) Minimum Size Pad P D(max) for T A = C. oz. Copper L. R JA.. 3 L, LENGTH OF COPPER (mm) Figure. SOT3 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length L ÎÎÎ ÎÎÎ ÎÎÎ..... P D, MAXIMUM POWER DISSIPATION (W) R θ JA, THERMAL RESISTANCE, JUNCTION TO AIR ( C/W) R JA L P D(max) for T A = C ÎÎÎÎÎÎÎ. oz. ÎÎÎÎÎÎÎ Graph Represents Symmetrical Layout Copper 3. 3 L, LENGTH OF COPPER (mm) Figure. SOP Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length L 3. mm

11 ORDERING INFORMATION Device MC3337ST.T3G NCV3337ST.T3G* MC3337D.G Type. V (Fixed Voltage) Operating Temperature Range, Tolerance Package Shipping SOT3 (PbFree) SOIC (PbFree) / Tape & Reel 9 Units / Rail MC3337D.RG NCV3337D.RG*. V (Fixed Voltage) SOIC (PbFree) / Tape & Reel MC3337ST.T3G SOT3 (PbFree) / Tape & Reel MC3337D3.G SOIC (PbFree) 9 Units / Rail MC3337D3.RG 3. V (Fixed Voltage) % Tolerance at T A = C SOIC (PbFree) / Tape & Reel MC3337ST3.T3G % Tolerance at T J from to + C SOT3 (PbFree) / Tape & Reel MC3337D3.3G SOIC (PbFree) 9 Units / Rail MC3337D3.3RG NCV3337D3.3RG* 3.3 V (Fixed Voltage) SOIC (PbFree) / Tape & Reel MC3337ST3.3T3G NCV3337ST3.3T3G* SOT3 (PbFree) / Tape & Reel MC3337D.G SOIC (PbFree) 9 Units / Rail MC3337D.RG. V (Fixed Voltage) SOIC (PbFree) / Tape & Reel MC3337ST.T3G SOT3 (PbFree) / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ Qualified and PPAP Capable DEVICE MARKING Device Version Marking (st line) MC3337, NCV3337. V 37 MC3337, NCV3337. V 37 MC V 373 MC3337, NCV V 3733 MC3337. V 37 TAPE AND REEL SPECIFICATIONS Device Reel Size Tape Width Quantity MC3337D, NCV3337D 3 mm Embossed Tape Units MC3337ST, NCV3337ST 3 mm Embossed Tape Units For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D.

12 PACKAGE DIMENSIONS SOT3 (TO) CASE 3E ISSUE N D b NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.M, 99.. CONTROLLING DIMENSION: INCH.. (3) H E e A e 3 A b E L L C MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A b b c D E e e L.. L H E SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

13 PACKAGE DIMENSIONS SOIC NB CASE 77 ISSUE AK Y B X A S. (.) M Y M K NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 9.. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION. (.) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.7 (.) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.. 7 THRU 7 ARE OBSOLETE. NEW STANDARD IS 77. Z H G D C. (.) M Z Y S X S SEATING PLANE. (.) N X M J MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D G.7 BSC. BSC H.... J K..7.. M N.... S.... SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 3, Denver, Colorado 7 USA Phone: 3377 or 33 Toll Free USA/Canada Fax: 3377 or 337 Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: 9 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: 37 3 ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MC3337/D